CN101258413A - 用于可层叠半导体测试系统的便携操纵装置 - Google Patents

用于可层叠半导体测试系统的便携操纵装置 Download PDF

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Publication number
CN101258413A
CN101258413A CNA2006800326103A CN200680032610A CN101258413A CN 101258413 A CN101258413 A CN 101258413A CN A2006800326103 A CNA2006800326103 A CN A2006800326103A CN 200680032610 A CN200680032610 A CN 200680032610A CN 101258413 A CN101258413 A CN 101258413A
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CN
China
Prior art keywords
connecting rod
equipment
measuring head
lead screw
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800326103A
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English (en)
Chinese (zh)
Inventor
P·特鲁多
M·卡拉多纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nextest Systems Corp
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Nextest Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nextest Systems Corp filed Critical Nextest Systems Corp
Publication of CN101258413A publication Critical patent/CN101258413A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)
CNA2006800326103A 2005-07-29 2006-07-19 用于可层叠半导体测试系统的便携操纵装置 Pending CN101258413A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/192,631 2005-07-29
US11/192,631 US7312604B2 (en) 2005-07-29 2005-07-29 Portable manipulator for stackable semiconductor test system

Publications (1)

Publication Number Publication Date
CN101258413A true CN101258413A (zh) 2008-09-03

Family

ID=37693630

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800326103A Pending CN101258413A (zh) 2005-07-29 2006-07-19 用于可层叠半导体测试系统的便携操纵装置

Country Status (6)

Country Link
US (2) US7312604B2 (https=)
JP (1) JP4796142B2 (https=)
KR (1) KR101265230B1 (https=)
CN (1) CN101258413A (https=)
TW (1) TWI394220B (https=)
WO (1) WO2007015952A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101769942B (zh) * 2008-12-31 2012-08-29 京元电子股份有限公司 电子元件翻转测试装置及测试方法
CN110058138A (zh) * 2013-10-29 2019-07-26 东京毅力科创株式会社 晶片检查装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5559654B2 (ja) * 2010-10-06 2014-07-23 株式会社Ｓｙｎａｘ Ｉｃハンドラ及びｉｃ検査装置
CN103454458B (zh) * 2013-09-10 2016-04-27 嘉兴景焱智能装备技术有限公司 芯片角度翻转装置
US9726718B2 (en) * 2014-05-30 2017-08-08 Skyworks Solutions, Inc. Modular test fixture
KR101490286B1 (ko) 2014-10-21 2015-02-04 주식회사 아이티엔티 일체형 자동 테스트 장치
US10094854B2 (en) * 2015-10-23 2018-10-09 Teradyne, Inc. Manipulator in automatic test equipment
KR102653657B1 (ko) 2016-02-12 2024-04-03 (주)테크윙 반도체소자 테스트용 핸들러
US10634718B2 (en) 2016-10-10 2020-04-28 Reid-Ashman Manufacturing, Inc. Manipulator for moving a test head
CN110615121B (zh) * 2019-10-31 2024-11-29 苏州富强科技有限公司 一种开关导通测试装置
US11498207B2 (en) 2021-01-08 2022-11-15 Teradyne, Inc. Test head manipulator configured to address uncontrolled test head rotation
KR102706340B1 (ko) * 2021-10-06 2024-09-12 주식회사 쎄믹스 그룹 프로버용 냉매 공급 장치

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US4572942A (en) * 1982-08-03 1986-02-25 Church John G Gas-metal-arc welding process
US4527942A (en) 1982-08-25 1985-07-09 Intest Corporation Electronic test head positioner for test systems
US5149029A (en) * 1982-08-25 1992-09-22 Intest Corporation Electronic test head positioner for test systems
US4973015A (en) * 1987-09-17 1990-11-27 Schlumberger Technologies, Inc. Manipulator apparatus for test head support and orientation
US5241870A (en) * 1991-07-22 1993-09-07 Intest Corporation Test head manipulator
US5600258A (en) * 1993-09-15 1997-02-04 Intest Corporation Method and apparatus for automated docking of a test head to a device handler
JPH07147305A (ja) * 1993-11-25 1995-06-06 Tokyo Electron Ltd 被検査体のテスト装置
US5506512A (en) * 1993-11-25 1996-04-09 Tokyo Electron Limited Transfer apparatus having an elevator and prober using the same
JPH0864645A (ja) * 1994-08-17 1996-03-08 Tokyo Electron Ltd プローブ装置
KR960019641A (ko) * 1994-11-24 1996-06-17 오우라 히로시 테스트·헤드 접속 장치를 장비한 반도체 시험 장치
JP3237740B2 (ja) * 1995-11-16 2001-12-10 東京エレクトロン株式会社 プローブ装置
US5912555A (en) * 1995-04-10 1999-06-15 Tokyo Electron Limited Probe apparatus
US6888343B1 (en) * 1999-01-13 2005-05-03 Intest Ip Corporation Test head manipulator
US6396257B1 (en) * 2000-04-26 2002-05-28 Credence Systems Corporation Test head manipulator for semiconductor tester with manual assist for vertical test head movement
US6838868B1 (en) * 2000-11-07 2005-01-04 Teradyne, Inc. Test head actuation system with positioning and compliant modes
US6766996B1 (en) * 2001-07-16 2004-07-27 Reid-Ashman Manufacturing, Inc. Manipulator
US6646431B1 (en) * 2002-01-22 2003-11-11 Elite E/M, Inc. Test head manipulator

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101769942B (zh) * 2008-12-31 2012-08-29 京元电子股份有限公司 电子元件翻转测试装置及测试方法
CN110058138A (zh) * 2013-10-29 2019-07-26 东京毅力科创株式会社 晶片检查装置
US10976364B2 (en) 2013-10-29 2021-04-13 Tokyo Electron Limited Test head and wafer inspection apparatus
US11061071B2 (en) 2013-10-29 2021-07-13 Tokyo Electron Limited Wafer inspection system, wafer inspection apparatus and prober
US11567123B2 (en) 2013-10-29 2023-01-31 Tokyo Electron Limited Wafer inspection system
US11762012B2 (en) 2013-10-29 2023-09-19 Tokyo Electron Limited Wafer inspection system
US12117485B2 (en) 2013-10-29 2024-10-15 Tokyo Electron Limited Wafer inspection system

Also Published As

Publication number Publication date
US20080100322A1 (en) 2008-05-01
TWI394220B (zh) 2013-04-21
US20070024296A1 (en) 2007-02-01
JP4796142B2 (ja) 2011-10-19
JP2009503854A (ja) 2009-01-29
WO2007015952A3 (en) 2007-07-12
KR101265230B1 (ko) 2013-05-24
WO2007015952A2 (en) 2007-02-08
TW200711021A (en) 2007-03-16
US7312604B2 (en) 2007-12-25
KR20080036620A (ko) 2008-04-28

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Open date: 20080903