CN101247715A - 热扩散片及其制造方法 - Google Patents
热扩散片及其制造方法 Download PDFInfo
- Publication number
- CN101247715A CN101247715A CNA2008100807091A CN200810080709A CN101247715A CN 101247715 A CN101247715 A CN 101247715A CN A2008100807091 A CNA2008100807091 A CN A2008100807091A CN 200810080709 A CN200810080709 A CN 200810080709A CN 101247715 A CN101247715 A CN 101247715A
- Authority
- CN
- China
- Prior art keywords
- thermal diffusion
- heat
- layer
- diffusion sheet
- conducting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/02—Layered products comprising a layer of synthetic resin in the form of fibres or filaments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Description
导热层 | 热扩散层 | 隔热层 | 10分钟后的温度(℃) | 热扩散性 | ||||||||
配置 | 厚度(μm) | 材料 | 厚度(μm) | 材料 | 厚度(μm) | S点 | A点 | B点 | C点 | S-B | S-C | |
例1 | 导热层 | 90 | 铜 | 35 | PET | 25 | 68 | 66 | 48 | 34 | 20 | 34 |
例2 | 导热层 | 90 | 铝 | 30 | PET | 50 | 73.5 | 69.1 | 46.6 | 40.3 | 26.9 | 33.2 |
例3 | 导热层 | 90 | 铜 | 18 | PET | 25 | 70.0 | 69.1 | 49.7 | 36.6 | 20.3 | 33.4 |
例4 | 导热层 | 90 | 铜 | 18 | PET | 50 | 72.5 | 67.6 | 47.5 | 38.4 | 25.0 | 34.1 |
例5 | 导热层 | 90 | 铜 | 70 | PET | 50 | 46.8 | 43.4 | 37.0 | 33.1 | 9.8 | 13.7 |
例6 | 导热层 | 90 | 铜 | 35 | PET | 50 | 68 | 64 | 48 | 36 | 20 | 32 |
例7 | 导热层 | 90 | 铜 | 70 | PET | 16 | 50 | 44 | 38 | 34 | 12 | 17 |
例8 | 导热层 | 90 | 铜 | 70 | PET | 100 | 46 | 38 | 35 | 34 | 11 | 12 |
例9 | 导热层 | 90 | 铜 | 105 | PP | 50 | 45 | 40 | 37 | 33 | 8 | 12 |
例10 | 导热层 | 90 | 铝 | 50 | PP | 50 | 70 | 65 | 49 | 42 | 21 | 28 |
比较例1 | 无 | - | 铜 | 70 | PET | 50 | 62.4 | 45.9 | 39.3 | 36.7 | 23.1 | 25.7 |
比较例2 | 双面胶带 | 20 | 铜 | 70 | PET | 50 | 67.0 | 37.7 | 35.3 | 29.9 | 31.7 | 37.1 |
比较例3 | 导热层 | 90 | 石墨 | 127 | PET | 5 | 45.6 | 42.6 | 36.9 | 34.4 | 8.7 | 11.2 |
比较例4 | 导热层 | 90 | 铜 | 70 | 无 | - | 53 | 45 | 39 | 34 | 14 | 19 |
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007034755A JP2008198917A (ja) | 2007-02-15 | 2007-02-15 | 熱拡散シート及びその製造方法 |
JP2007-034755 | 2007-02-15 | ||
JP2007034755 | 2007-02-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101247715A true CN101247715A (zh) | 2008-08-20 |
CN101247715B CN101247715B (zh) | 2010-12-29 |
Family
ID=39706921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100807091A Active CN101247715B (zh) | 2007-02-15 | 2008-02-05 | 热扩散片及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080199688A1 (zh) |
JP (1) | JP2008198917A (zh) |
KR (1) | KR20080076761A (zh) |
CN (1) | CN101247715B (zh) |
TW (1) | TW200835727A (zh) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102098886A (zh) * | 2009-12-14 | 2011-06-15 | 和硕联合科技股份有限公司 | 机壳及其制作方法 |
CN102495515A (zh) * | 2011-12-12 | 2012-06-13 | 中国科学院长春光学精密机械与物理研究所 | 一种适用于空间相机热控制的隔热垫 |
CN103228120A (zh) * | 2012-01-31 | 2013-07-31 | 曼埃利康有限公司 | 利用潜热的延迟散热片 |
CN101712217B (zh) * | 2009-05-12 | 2013-07-31 | 大连丽昌新材料有限公司 | 一种石墨导热界面材料的制造工艺 |
CN103242755A (zh) * | 2013-05-06 | 2013-08-14 | 深圳市美信电子有限公司 | 一种导热扩散片及其制备方法 |
CN103322457A (zh) * | 2013-06-26 | 2013-09-25 | 合肥京东方光电科技有限公司 | 一种灯条、背光模组和显示装置 |
CN103730482A (zh) * | 2012-10-16 | 2014-04-16 | 乐金显示有限公司 | 有机发光二极管显示器 |
CN104152118A (zh) * | 2014-09-01 | 2014-11-19 | 络派模切(北京)有限公司 | 具有单层导热颗粒的导热片及其制备方法 |
CN104737634A (zh) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | 混合型隔热片及具有该混合型隔热片的电子设备 |
CN105283037A (zh) * | 2014-07-18 | 2016-01-27 | 松下知识产权经营株式会社 | 复合片材及其制造方法以及使用复合片材的电子设备 |
WO2016173140A1 (zh) * | 2015-04-28 | 2016-11-03 | 中兴通讯股份有限公司 | 热量控制方法及装置 |
CN106659079A (zh) * | 2016-12-23 | 2017-05-10 | 努比亚技术有限公司 | 一种复合散热膜和移动终端 |
CN106750454A (zh) * | 2016-11-30 | 2017-05-31 | 东莞珂洛赫慕电子材料科技有限公司 | 一种高绝缘单向导热聚酰亚胺膜及其制备方法 |
CN107722417A (zh) * | 2017-09-20 | 2018-02-23 | 苏州固德新材科技有限公司 | 复合高导热缓冲辐照交联聚乙烯泡棉及其制备方法 |
CN113442527A (zh) * | 2021-07-07 | 2021-09-28 | 王氏港建移动科技有限公司 | 在电子电路或组件中有用的金属聚合物界面 |
CN113889440A (zh) * | 2020-07-01 | 2022-01-04 | 华为技术有限公司 | 一种导热结构及其制作方法、导热系统、芯片封装结构和电子设备 |
CN113993624A (zh) * | 2019-06-21 | 2022-01-28 | 亚德诺半导体国际无限责任公司 | 热平台和制造热平台的方法 |
Families Citing this family (9)
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JPWO2011111716A1 (ja) * | 2010-03-10 | 2013-06-27 | 日東電工株式会社 | 断熱放熱シート及び装置内構造 |
JP2013128034A (ja) * | 2011-12-19 | 2013-06-27 | Seiwa Electric Mfg Co Ltd | 熱対策シート |
CN102555314A (zh) * | 2011-12-30 | 2012-07-11 | 深圳市爱诺菲科技有限公司 | 一种散热电磁波吸收贴片及其制作方法和应用 |
JP2014003141A (ja) * | 2012-06-18 | 2014-01-09 | Shin Etsu Chem Co Ltd | 熱伝導性シート及び電子機器 |
WO2015102415A1 (ko) * | 2013-12-31 | 2015-07-09 | 주식회사 아모그린텍 | 복합 시트 및 그를 구비한 휴대용 단말 |
JP6437752B2 (ja) * | 2014-07-25 | 2018-12-12 | 京セラ株式会社 | インクジェットヘッド及びインクジェットプリンタ |
US9353245B2 (en) | 2014-08-18 | 2016-05-31 | 3M Innovative Properties Company | Thermally conductive clay |
US20170298624A1 (en) * | 2016-04-13 | 2017-10-19 | Chien-Yi HSIEH | Dropped ceiling with eco-friendly ceiling panels |
CN111525228B (zh) * | 2020-05-18 | 2021-08-13 | Oppo广东移动通信有限公司 | 天线模块和电子设备 |
Family Cites Families (10)
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US5919517A (en) * | 1993-05-05 | 1999-07-06 | Aluminum Company Of America | Method for coating a metal strip |
AU691517B2 (en) * | 1993-09-03 | 1998-05-21 | Suikoh Topline Co., Ltd | Radiating plate and cooling method using same |
JP3098404B2 (ja) * | 1995-09-20 | 2000-10-16 | 帝人株式会社 | 帯電防止性ポリエステルフィルム |
JP3289263B2 (ja) * | 1995-12-20 | 2002-06-04 | 株式会社ピーエフユー | カード型回路モジュール |
JP2000077872A (ja) * | 1998-08-27 | 2000-03-14 | Nitto Denko Corp | 熱伝導部材及び当該伝導部材を用いた電子機器 |
US6570086B1 (en) * | 2000-06-06 | 2003-05-27 | Mitsubishi Denki Kabushiki Kaisha | Cooling structure of communication device |
JP2002043784A (ja) * | 2000-07-28 | 2002-02-08 | Asahi Optical Co Ltd | 携帯機器の断熱装置及び断熱シート |
JP2004211060A (ja) * | 2002-12-16 | 2004-07-29 | Ceramission Kk | エマルジョン性組成物およびそれにより形成した塗膜並びにその塗膜を用いた冷却構造 |
WO2005016631A1 (ja) * | 2003-08-18 | 2005-02-24 | Nippon Steel Corporation | ラミネート金属板とその製造方法 |
JP2007027520A (ja) * | 2005-07-20 | 2007-02-01 | Nec Access Technica Ltd | 放熱装置 |
-
2007
- 2007-02-15 JP JP2007034755A patent/JP2008198917A/ja active Pending
-
2008
- 2008-02-05 CN CN2008100807091A patent/CN101247715B/zh active Active
- 2008-02-07 US US12/027,466 patent/US20080199688A1/en not_active Abandoned
- 2008-02-13 KR KR1020080012795A patent/KR20080076761A/ko not_active Application Discontinuation
- 2008-02-13 TW TW97104990A patent/TW200835727A/zh unknown
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CN103322457A (zh) * | 2013-06-26 | 2013-09-25 | 合肥京东方光电科技有限公司 | 一种灯条、背光模组和显示装置 |
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CN105283037B (zh) * | 2014-07-18 | 2018-11-13 | 松下知识产权经营株式会社 | 复合片材及其制造方法以及使用复合片材的电子设备 |
CN104152118A (zh) * | 2014-09-01 | 2014-11-19 | 络派模切(北京)有限公司 | 具有单层导热颗粒的导热片及其制备方法 |
WO2016173140A1 (zh) * | 2015-04-28 | 2016-11-03 | 中兴通讯股份有限公司 | 热量控制方法及装置 |
US10528101B2 (en) | 2015-04-28 | 2020-01-07 | Xi'an Zhongxing New Software Co., Ltd. | Heat control method and device |
CN106750454A (zh) * | 2016-11-30 | 2017-05-31 | 东莞珂洛赫慕电子材料科技有限公司 | 一种高绝缘单向导热聚酰亚胺膜及其制备方法 |
CN106659079A (zh) * | 2016-12-23 | 2017-05-10 | 努比亚技术有限公司 | 一种复合散热膜和移动终端 |
CN107722417A (zh) * | 2017-09-20 | 2018-02-23 | 苏州固德新材科技有限公司 | 复合高导热缓冲辐照交联聚乙烯泡棉及其制备方法 |
CN113993624A (zh) * | 2019-06-21 | 2022-01-28 | 亚德诺半导体国际无限责任公司 | 热平台和制造热平台的方法 |
CN113993624B (zh) * | 2019-06-21 | 2024-02-09 | 亚德诺半导体国际无限责任公司 | 热平台和制造热平台的方法 |
CN113889440A (zh) * | 2020-07-01 | 2022-01-04 | 华为技术有限公司 | 一种导热结构及其制作方法、导热系统、芯片封装结构和电子设备 |
CN113442527A (zh) * | 2021-07-07 | 2021-09-28 | 王氏港建移动科技有限公司 | 在电子电路或组件中有用的金属聚合物界面 |
Also Published As
Publication number | Publication date |
---|---|
TW200835727A (en) | 2008-09-01 |
CN101247715B (zh) | 2010-12-29 |
KR20080076761A (ko) | 2008-08-20 |
US20080199688A1 (en) | 2008-08-21 |
JP2008198917A (ja) | 2008-08-28 |
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Effective date of registration: 20160215 Address after: Japan Sakura Saitama Saitama District Tajima eight chome 10 No. 1 Patentee after: Polymatech Japan Co Ltd Address before: Japan's Tokyo central Japan Hashimoto Ting 4 chome 8 times 16, thousands of city building Patentee before: Polymatech Co., Ltd., |
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Address after: Japan Sakura Saitama Saitama District Tajima eight chome 10 No. 1 Patentee after: Jishui Baoli Ma Technology Co., Ltd. Address before: Japan Sakura Saitama Saitama District Tajima eight chome 10 No. 1 Patentee before: Polymatech Japan Co Ltd |