CN101241924B - 成像装置模块和采用该成像装置模块的便携式电子设备 - Google Patents

成像装置模块和采用该成像装置模块的便携式电子设备 Download PDF

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Publication number
CN101241924B
CN101241924B CN200810008690XA CN200810008690A CN101241924B CN 101241924 B CN101241924 B CN 101241924B CN 200810008690X A CN200810008690X A CN 200810008690XA CN 200810008690 A CN200810008690 A CN 200810008690A CN 101241924 B CN101241924 B CN 101241924B
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imaging device
radiation component
component
radiation
circuit board
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Expired - Fee Related
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CN200810008690XA
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English (en)
Chinese (zh)
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CN101241924A (zh
Inventor
山宫国雄
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Olympus Corp
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Olympus Imaging Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
CN200810008690XA 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备 Expired - Fee Related CN101241924B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-029337 2007-02-08
JP2007029337 2007-02-08
JP2007029337 2007-02-08
JP2007-321138 2007-12-12
JP2007321138A JP5060935B2 (ja) 2007-02-08 2007-12-12 撮像素子モジュール及びそれを用いた携帯用電子機器
JP2007321138 2007-12-12

Related Child Applications (1)

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CN2010102424240A Division CN101916766B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备

Publications (2)

Publication Number Publication Date
CN101241924A CN101241924A (zh) 2008-08-13
CN101241924B true CN101241924B (zh) 2010-09-22

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CN2010102424240A Expired - Fee Related CN101916766B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备
CN200810008690XA Expired - Fee Related CN101241924B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备

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CN2010102424240A Expired - Fee Related CN101916766B (zh) 2007-02-08 2008-02-05 成像装置模块和采用该成像装置模块的便携式电子设备

Country Status (2)

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JP (1) JP5060935B2 (ja)
CN (2) CN101916766B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243634A (ja) * 2009-04-02 2010-10-28 Sony Corp 撮像装置
CN102129110B (zh) * 2010-01-20 2014-05-14 智宝科技股份有限公司 光学变焦系统
JP5574776B2 (ja) * 2010-03-26 2014-08-20 キヤノン株式会社 レンズ鏡筒および撮像装置
JP5820607B2 (ja) * 2011-04-25 2015-11-24 株式会社シグマ 撮像装置及び撮像システム
JP6193753B2 (ja) * 2013-06-27 2017-09-06 京セラ株式会社 撮像素子搭載用基板及び撮像装置
CN107976857B (zh) * 2016-10-20 2021-04-30 台湾东电化股份有限公司 光学系统
CN109427264A (zh) * 2017-08-30 2019-03-05 深圳市奥拓电子股份有限公司 一种光控板及led显示屏
CN110896435B (zh) * 2018-09-13 2021-07-20 三赢科技（深圳）有限公司 相机模组
JP6756357B2 (ja) * 2018-11-29 2020-09-16 株式会社ニコン 撮像装置
CN114740674B (zh) * 2022-02-28 2023-12-08 广东安达智能装备股份有限公司 一种微型工业ccd模组及其组装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2665441B2 (ja) * 1993-05-21 1997-10-22 オリンパス光学工業株式会社 内視鏡
JPH08107526A (ja) * 1994-10-05 1996-04-23 Olympus Optical Co Ltd 電子的撮像装置
JP3875505B2 (ja) * 2001-03-29 2007-01-31 オリンパス株式会社 撮像装置
US20040061799A1 (en) * 2002-09-27 2004-04-01 Konica Corporation Image pickup device and portable terminal equipped therewith
US6956272B2 (en) * 2004-03-10 2005-10-18 Micron Technology, Inc. Support frame for semiconductor packages
JP2006174226A (ja) * 2004-12-17 2006-06-29 Konica Minolta Photo Imaging Inc 撮像ユニット及び撮像装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP特开2003-110930A 2003.04.11
JP特开2006-174226A 2006.06.29
JP特开2006-332894A 2006.12.07
JP特开2006-349942A 2006.12.28

Also Published As

Publication number Publication date
JP2008219861A (ja) 2008-09-18
CN101916766B (zh) 2013-04-10
CN101241924A (zh) 2008-08-13
JP5060935B2 (ja) 2012-10-31
CN101916766A (zh) 2010-12-15

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Effective date of registration: 20151117

Address after: Tokyo, Japan, Japan

Patentee after: Olympus Corporation

Address before: Tokyo, Japan

Patentee before: Olympus Imaging Corp.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100922

Termination date: 20190205