CN101236596B - 无线系统、半导体装置以及通讯装置 - Google Patents

无线系统、半导体装置以及通讯装置 Download PDF

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Publication number
CN101236596B
CN101236596B CN2008100057771A CN200810005777A CN101236596B CN 101236596 B CN101236596 B CN 101236596B CN 2008100057771 A CN2008100057771 A CN 2008100057771A CN 200810005777 A CN200810005777 A CN 200810005777A CN 101236596 B CN101236596 B CN 101236596B
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China
Prior art keywords
processing
data
circuit
processed data
majority
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Expired - Fee Related
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CN2008100057771A
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English (en)
Chinese (zh)
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CN101236596A (zh
Inventor
黑川义元
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Publication of CN101236596A publication Critical patent/CN101236596A/zh
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B5/00Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/70Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
    • H04B5/77Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for interrogation
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Hardware Redundancy (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Dc Digital Transmission (AREA)
  • Detection And Prevention Of Errors In Transmission (AREA)
CN2008100057771A 2007-02-02 2008-02-01 无线系统、半导体装置以及通讯装置 Expired - Fee Related CN101236596B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007024001 2007-02-02
JP2007-024001 2007-02-02
JP2007024001 2007-02-02

Publications (2)

Publication Number Publication Date
CN101236596A CN101236596A (zh) 2008-08-06
CN101236596B true CN101236596B (zh) 2013-04-24

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ID=39675695

Family Applications (1)

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CN2008100057771A Expired - Fee Related CN101236596B (zh) 2007-02-02 2008-02-01 无线系统、半导体装置以及通讯装置

Country Status (4)

Country Link
US (1) US8009050B2 (https=)
JP (1) JP5121479B2 (https=)
KR (1) KR101460979B1 (https=)
CN (1) CN101236596B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1956523B1 (en) * 2007-02-02 2013-05-29 Semiconductor Energy Laboratory Co., Ltd. Wireless identification system, semiconductor device, and communication device
JP5301299B2 (ja) * 2008-01-31 2013-09-25 株式会社半導体エネルギー研究所 半導体装置
KR101611643B1 (ko) 2008-10-01 2016-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2014168761A1 (en) * 2013-04-10 2014-10-16 Honeywell International Inc. High temperature tolerant rfid tag

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JPS63239576A (ja) * 1987-03-27 1988-10-05 Toshiba Corp 携帯可能電子装置
JPH02161585A (ja) * 1988-12-15 1990-06-21 Toppan Printing Co Ltd 電子カードシステム
JPH066329A (ja) * 1992-06-24 1994-01-14 Nec Eng Ltd 多数決判定回路
JPH06332794A (ja) * 1993-05-25 1994-12-02 Hitachi Ltd データ送出装置
US5661470A (en) * 1994-03-04 1997-08-26 Karr; Gerald S. Object recognition system
JP3694987B2 (ja) * 1996-06-25 2005-09-14 石川島播磨重工業株式会社 三重系フォールトトレラントシステム
JP3568180B2 (ja) * 1997-06-12 2004-09-22 株式会社日立国際電気 データ伝送装置
CA2262894C (en) * 1997-06-19 2004-08-03 Kabushiki Kaisha Toshiba Information data multiplexing transmission system, multiplexer and demultiplexer used therefor, and error correcting encoder and decoder
JP3542707B2 (ja) * 1997-12-05 2004-07-14 富士通株式会社 電子現金金庫
JP2000115804A (ja) * 1998-09-22 2000-04-21 Neucore Technol Inc カード式半導体メモリ装置
JP2000149194A (ja) 1998-11-12 2000-05-30 Toshiba Corp 駐車管理システム
JP2001344213A (ja) * 2000-05-31 2001-12-14 Hitachi Ltd 生体認証システム
JP4269502B2 (ja) * 2000-09-07 2009-05-27 三菱マテリアル株式会社 データキャリア
JP2003067683A (ja) 2001-08-30 2003-03-07 Omron Corp 生産ラインにおける認識システム
JP2003287587A (ja) * 2002-03-27 2003-10-10 Toshiba Corp プラント保護計装装置
US7973313B2 (en) * 2003-02-24 2011-07-05 Semiconductor Energy Laboratory Co., Ltd. Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container
US7768405B2 (en) * 2003-12-12 2010-08-03 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
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EP1850267B1 (en) * 2006-04-28 2011-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and position detecting method using the semiconductor device
EP1956523B1 (en) * 2007-02-02 2013-05-29 Semiconductor Energy Laboratory Co., Ltd. Wireless identification system, semiconductor device, and communication device

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Title
JP特开2003-67683A 2003.03.07
JP特开2006-303912A 2006.11.02

Also Published As

Publication number Publication date
JP5121479B2 (ja) 2013-01-16
US8009050B2 (en) 2011-08-30
KR101460979B1 (ko) 2014-11-13
CN101236596A (zh) 2008-08-06
US20080186181A1 (en) 2008-08-07
JP2008210380A (ja) 2008-09-11
KR20080072568A (ko) 2008-08-06

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Granted publication date: 20130424

Termination date: 20210201

CF01 Termination of patent right due to non-payment of annual fee