CN101226909A - Thin membrane encapsulation structure of fingerprint identifying device - Google Patents
Thin membrane encapsulation structure of fingerprint identifying device Download PDFInfo
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- CN101226909A CN101226909A CNA2007100024152A CN200710002415A CN101226909A CN 101226909 A CN101226909 A CN 101226909A CN A2007100024152 A CNA2007100024152 A CN A2007100024152A CN 200710002415 A CN200710002415 A CN 200710002415A CN 101226909 A CN101226909 A CN 101226909A
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- 239000012528 membrane Substances 0.000 title claims description 4
- 238000005538 encapsulation Methods 0.000 title description 9
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 239000000084 colloidal system Substances 0.000 claims abstract description 6
- 238000004806 packaging method and process Methods 0.000 claims description 64
- 238000010276 construction Methods 0.000 claims description 47
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 238000004804 winding Methods 0.000 claims description 9
- 239000010408 film Substances 0.000 abstract 3
- 238000007906 compression Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
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- 230000002950 deficient Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 206010007247 Carbuncle Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention relates to a thin film enclosing structure of a fingerprint identifier, comprising a fingerprint identifier chip, a plurality of projecting blocks, a plurality of virtual projecting blocks, a circuit film and sealing colloids. A sensing area is formed on an active surface of the fingerprint identifier chip. The above projecting blocks are arranged on the active surface and are located at one lateral end of the sensing area, and the above virtual projecting blocks are also arranged on the active surface and are located at the opposite lateral end of the sensing area. The circuit film is equipped with a through opening to expose the sensing area and includes a plurality of pins and virtual pins to respectively join the above projecting blocks and virtual projecting blocks, wherein all the outer ends of the pins are confluent at the same side of the circuit film. The sealing colloids are used to seal the above projecting blocks and virtual projecting blocks, thereby reaching the balance of thermo-compression bonding and engagement and facilitating to form the sealing colloids.
Description
Technical field
The present invention relates to a kind of fingerprint identifier packaging structure (fingerprint sensor package), particularly relevant for a kind of film packaging construction of fingerprint identifier.
Background technology
The fingerprint identifier packaging structure can add and be installed in various electronic product, and for example mobile phone, notebook computer, personal digital assistant device (PDA, or claim palmtop computer) or the like are in order to identification user's fingerprint.Fingerprint identifier can utilize manufacture of semiconductor to make and encapsulated at present, is different from traditional IC encapsulation, and the fingerprint identifier wafer should have a sensing area that exposes, can the identification fingerprint.Right fingerprint identifier packaging structure in the past is the encapsulation technology that adopts conventional substrate and mould envelope, and the interface of mechanical fixation and electric connection all is positioned at the bottom surface of substrate, the horizontal plane of wayward identification of fingerprint.
Fig. 1 is the schematic cross-section for a kind of known fingerprint identifier packaging structure.Fig. 2 is the schematic bottom view for this fingerprint identifier packaging structure.As Fig. 1 and shown in Figure 2, a kind of fingerprint identifier packaging structure 100 mainly comprises a substrate 110, a fingerprint identifier wafer 120, a plurality of bonding wire 130 and an adhesive body 140.Be to be formed with a sensing area 123 on one active surface 121 of this fingerprint identifier wafer 120.Wherein, the back side 122 of this fingerprint identifier wafer 120 is the upper surfaces 111 that stick on this substrate 110, and electrically connects the one-sided weld pad of this fingerprint identifier wafer 120 to this substrate 110 with above-mentioned these bonding wires 130.This adhesive body 140 is the upper surfaces 111 that are formed at this substrate 110, sealing the part of above-mentioned these bonding wires 130 and this fingerprint identifier wafer 120, but must appear this sensing area 123.The lower surface 112 of this substrate 110 is to be provided with a plurality of external terminals 150 as the tin ball, and above-mentioned these external terminals 150 are to carry out external mechanical bond and electric connection.Therefore, this fingerprint identifier packaging structure 100 is that surface engagement (SMT) is to an external printed circuit board when using, its mechanical bond direction and electrical connection path are all at the lower surface 112 of this substrate 110, known surface engagement mode can increase packaging appearance thickness, and the external carbuncle that puts on this fingerprint identifier wafer 120 in the use of identification of fingerprint is passed to this substrate 110, can cause that above-mentioned these external terminals 150 electrically connect the problem that opens circuit.
TaiWan, China letters patent I243437 number " the slim gliding style fingerprint identifier packaging structure that touches " discloses a kind of fingerprint identifier packaging structure; will be with the back side of the protective layer coating wafer of mould envelope, a flexible circuit board is to press to be located at the wherein conducting element on the side of this wafer.Its technological means is for first sealing overlays a soft board in the one-sided limit of wafer again, has the shortcoming of excessive glue pollution sensing area, and can't continue to use the encapsulation procedure and the equipment of existing coil type transmission.
This shows that the packaging structure of above-mentioned existing fingerprint identifier obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.The problem that exists for the packaging structure that solves fingerprint identifier, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of film packaging construction of fingerprint identifier of new structure, just become the current industry utmost point to need improved target.
Because the defective that the packaging structure of above-mentioned existing fingerprint identifier exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, film packaging construction in the hope of the fingerprint identifier of founding a kind of new structure, can improve the packaging structure of general existing fingerprint identifier, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective of the packaging structure existence of existing fingerprint identifier, and provide a kind of film packaging construction of fingerprint identifier of new structure, technical problem to be solved is to make it can make the also even hot pressing of fingerprint identifier wafer with one-sided projection, and provide the balance of film both sides and wafer bump bond, in order to the formation of adhesive body and the control of identification of fingerprint horizontal plane, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.The film packaging construction of a kind of fingerprint identifier that proposes according to the present invention comprises a fingerprint identifier wafer, plurality of bump, a plurality of virtual projection, a circuit film and an adhesive body.Be to be formed with a sensing area on one active surface of this fingerprint identifier wafer; Above-mentioned these projections are sides that are arranged on this active surface and are positioned at this sensing area; Above-mentioned these virtual projections are another relative sides that are arranged on this active surface and are positioned at this sensing area; This circuit film is to have one to connect opening, to appear this sensing area, this circuit film includes a plurality of pins and a plurality of virtual pin, the inner of above-mentioned these pins is to be engaged to above-mentioned these projections, the inner of above-mentioned these virtual pins is to be engaged to above-mentioned these virtual projections, and wherein the outer end of above-mentioned these pins is the same sides that merge in this circuit film; This adhesive body is above-mentioned these projections of sealing and above-mentioned these virtual projections.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
In the film packaging construction of aforesaid fingerprint identifier, above-mentioned these virtual pins are to can be no electrical propagation function and be shorter than above-mentioned these pins.
In the film packaging construction of aforesaid fingerprint identifier, this adhesive body is to can be any to be coated with colloid (potting resin).
In the film packaging construction of aforesaid fingerprint identifier, this pass through openings of this circuit film is to can be a slotted eye, the opening length of this circuit film is the length less than the active surface of this fingerprint identifier wafer, but greater than the length of this sensing area, and the A/F of this circuit film is the width greater than the sensing area of the active surface of this fingerprint identifier wafer.
In the film packaging construction of aforesaid fingerprint identifier, this circuit film is the winding that can be a membrane of flip chip (COF) encapsulation.
In the film packaging construction of aforesaid fingerprint identifier, this circuit film is the winding that can be winding carrying encapsulation (TCP).
In the film packaging construction of aforesaid fingerprint identifier, the outer end of each pin is to be connected with an external finger.
In the film packaging construction of aforesaid fingerprint identifier, above-mentioned these external fingers are to can be multi-row staggered arrangement.
In the film packaging construction of aforesaid fingerprint identifier, above-mentioned these external fingers are to be same linear array.
In the film packaging construction of aforesaid fingerprint identifier, the orientation of above-mentioned these external fingers is to be parallel with this sensing area.
In the film packaging construction of aforesaid fingerprint identifier, the orientation of above-mentioned these external fingers is to be vertical with this sensing area.
In the film packaging construction of aforesaid fingerprint identifier, above-mentioned these projections and above-mentioned these virtual projections are to can be golden projection or tie lines projection.
In sum, the film packaging construction of the fingerprint identifier of special construction of the present invention, can make also even hot pressing of fingerprint identifier wafer with one-sided projection, and provide the balance of film both sides and wafer bump bond, be beneficial to the formation of adhesive body and the control of identification of fingerprint horizontal plane, thereby be suitable for practicality more.It has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and the film packaging construction of more existing fingerprint identifier has the multinomial effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic cross-section of known fingerprint identifier packaging structure.
Fig. 2 is the schematic bottom view of known fingerprint identifier packaging structure.
Fig. 3 is according to first specific embodiment of the present invention, a kind of end face schematic diagram of film packaging construction of fingerprint identifier.
Fig. 4 is according to first specific embodiment of the present invention, the local top surface schematic diagram of the film packaging construction of this fingerprint identifier.
Fig. 5 is according to first specific embodiment of the present invention, the schematic cross-section of the film packaging construction of this fingerprint identifier.
Fig. 6 is according to second specific embodiment of the present invention, the end face schematic diagram of the film packaging construction of another kind of fingerprint identifier.
Fig. 7 is according to second specific embodiment of the present invention, the schematic cross-section of the film packaging construction of this fingerprint identifier.
100: fingerprint identifier packaging structure 110: substrate
111: upper surface 112: lower surface
120: fingerprint identifier wafer 121: active surface
122: the back side 123: sensing area
130: bonding wire 140: adhesive body
150: external terminal 200: the film packaging construction of fingerprint identifier
210: fingerprint identifier wafer 211: active surface
212: sensing area 213: weld pad
220: projection 230: virtual projection
240: circuit film 241: pass through openings
242: pin 242A: the inner
242B: outer end 243: virtual pin
243A: inner 244: side
245: external finger 250: adhesive body
260: base 300: the film packaging construction of fingerprint identifier
310: fingerprint identifier wafer 311: active surface
312: sensing area 320: projection
330: virtual projection 340: circuit film
341: pass through openings 342: pin
342A: inner 342B: outer end
343: virtual pin 343A: the inner
344: side 345: external finger
350: adhesive body Lo: opening length
W
O: A/F Lc: wafer length
W
S: the wafer sensing region width
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, its embodiment of film packaging construction, structure, feature and the effect thereof of the fingerprint identifier that foundation the present invention is proposed, describe in detail as after.
The first tool physical embodiment of the present invention discloses a kind of film packaging construction of fingerprint identifier.Fig. 3 is the end face schematic diagram for the film packaging construction of this fingerprint identifier.Fig. 4 is that film packaging construction for this fingerprint identifier is in the local top surface schematic diagram at virtual pin place.Fig. 5 is the schematic cross-section for the film packaging construction of this fingerprint identifier.
See also Fig. 3, Fig. 4 and Fig. 5, the film packaging construction 200 of this fingerprint identifier mainly comprises a fingerprint identifier wafer 210, plurality of bump 220, a plurality of virtual projection 230, a circuit film 240 and an adhesive body 250.
As shown in Figure 5, this fingerprint identifier wafer 210 is to have an active surface 211, is to be formed with a sensing area 212 on this active surface 211, in order to the identification fingerprint.On this active surface 211, be formed with a plurality of weld pads 213 in addition, as the electrode of external transmission.
Above-mentioned these projections 220 are sides that are arranged on this active surface 211 and are positioned at this sensing area 212, and it is to be engaged in the top of above-mentioned these weld pads 213 and to protrude in this active surface 211, has the function of electrical transmission.In other words, the only one-sided limit of this fingerprint identifier wafer 210 has the design of electrical transmission.
Above-mentioned these virtual projections 230 are another relative sides that are arranged on this active surface 211 and are positioned at this sensing area 212.Above-mentioned these virtual projections 230 are to have identical material with above-mentioned these projections 220, as gold, for example above-mentioned these projections 220 are to can be golden projection or tie lines projection with above-mentioned these virtual projections 230, certainly, in the middle of other embodiment, virtual projection 230 is to have material inequality with above-mentioned these projections 220.Right above-mentioned these virtual projections 230 do not have the function of electrical transmission.The purpose that is provided with of above-mentioned these virtual projections 230 is the opposite side mechanical engagement that are to provide 210 pairs of these circuit films 240 of this fingerprint identifier wafer.
As shown in Figures 3 and 4, this circuit film 240 is to have one to connect opening 241, to appear this sensing area 212, this circuit film 240 includes a plurality of pins 242 and a plurality of virtual pins 243, the inner 242A of above-mentioned these pins 242 is engaged to above-mentioned these projections 220, the inner 243A of above-mentioned these virtual pins 243 is engaged to above-mentioned these virtual projections 230, and the outer end 242B of wherein above-mentioned these pins 242 is the same sides 244 that merge in this circuit film 240.Wherein, above-mentioned these virtual pins 243 are to can be no electrical propagation function and be shorter than above-mentioned these pins 242, with the configuration of the outer end 242B that do not influence above-mentioned these pins 242.Again as shown in Figure 3, the outer end 242B of each pin 242 can be connected with an external finger 245.Preferably, above-mentioned these external fingers 245 are to can be multi-row staggered arrangement.In the present embodiment, the orientation of above-mentioned these external fingers 245 is to be parallel with this sensing area 212.
As shown in Figure 5, this adhesive body 250 is above-mentioned these projections 220 and above-mentioned these virtual projections 230 of sealing.In the present embodiment, this adhesive body 250 is to can be any to be coated with colloid (potting resin).In addition, this fingerprint identifier wafer 210 is can be combined on the base 260, for mechanical bond.
Please consult Fig. 4 especially, this pass through openings 241 of this circuit film 240 is to can be a slotted eye.In addition, in the present embodiment, this circuit film 240 is the winding that can be a membrane of flip chip (COF) encapsulation.The opening length L o of this circuit film 240 is the length L c less than the active surface 211 of this fingerprint identifier wafer 210, but greater than the length of this sensing area 212, so that the inner 243A of the inner 242A of above-mentioned these pins 242 and above-mentioned these virtual pins 243 is attached on the dielectric film carrier of this circuit film 240.Perhaps, the opening length L o of this circuit film 240 also can be less than or equal to this sensing area 212 length (like this sensing area 212 can be stopped by this circuit film 240, can operate like this?).And, the A/F W of this circuit film 240
OIt is a width W greater than the sensing area 212 of the active surface 211 of this fingerprint identifier wafer 210
S
Therefore, the film packaging construction 200 of fingerprint identifier of the present invention is applicable to that encapsulation has the fingerprint identifier wafer 210 of one-sided electrical transmission, also can engage in the bump bond mode, and the balance of film 240 both sides and wafer bump bond is provided, in order to the formation of adhesive body 250 and the control of identification of fingerprint horizontal plane.
Second specific embodiment of the present invention discloses the film packaging construction of another kind of fingerprint identifier.See also Fig. 6 and Fig. 7, the film packaging construction 300 of this fingerprint identifier comprises a fingerprint identifier wafer 310, plurality of bump 320, a plurality of virtual projection 330, a circuit film 340 and an adhesive body 350.On an active surface 311 of this fingerprint identifier wafer 310, be to be formed with a sensing area 312.Above-mentioned these projections 320 are sides that are arranged on this active surface 311 and are positioned at this sensing area 312; Above-mentioned these virtual projections 330 are another relative sides that are arranged on this active surface 311 and are positioned at this sensing area 312.This circuit film 340 is to have one to connect opening 341, to appear this sensing area 312.In addition, this circuit film 340 includes a plurality of pins 342 and a plurality of virtual pins 343, the inner 342A of above-mentioned these pins 342 is engaged to above-mentioned these projections 320, the inner 343A of above-mentioned these virtual pins 343 is engaged to above-mentioned these virtual projections 330, and the outer end 342B of wherein above-mentioned these pins 342 is the same sides 344 that merge in this circuit film 340.This adhesive body 350 is above-mentioned these projections 320 and above-mentioned these virtual projections 330 of sealing.In the present embodiment, this circuit film 340 is the winding that can be winding carrying encapsulation (TCP), and the inner 343A that makes the inner 342A of above-mentioned these pins 342 and above-mentioned these virtual pins 343 is for being suspended on this pass through openings 341.In addition, the outer end 342B of at least one pin 342 can be connected with an external finger 345, can be arranged in same straight line.In the present embodiment, the orientation of this external finger 345 is to be vertical with this sensing area 312.
Therefore, in the film packaging construction 300 of above-mentioned fingerprint identifier, utilize the mechanical engagement of the inner 343A of above-mentioned these virtual projections 330 and the virtual pin 343 of this circuit film 340 at single side, the fingerprint identifier wafer 310 that feasible script has one-sided projection also can engage, and provide the balance of these circuit film 340 both sides and this wafer 310 bump bond, the control of the formation of more favourable this adhesive body 350 and identification of fingerprint horizontal plane.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the structure that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1. the film packaging construction of a fingerprint identifier is characterized in that it comprises:
One fingerprint identifier wafer, it is to be formed with a sensing area on an active surface;
Plurality of bump, it is a side that is arranged on this active surface and is positioned at this sensing area;
A plurality of virtual projections, it is another the relative side that is arranged on this active surface and is positioned at this sensing area;
One circuit film, it is to have one to connect opening, to appear this sensing area, this circuit film includes a plurality of pins and a plurality of virtual pin, the inner of above-mentioned these pins is to be engaged to above-mentioned these projections, the inner of above-mentioned these virtual pins is to be engaged to above-mentioned these virtual projections, and wherein the outer end of above-mentioned these pins is the same sides that merge in this circuit film; And
One adhesive body, it is above-mentioned these projections of sealing and above-mentioned these virtual projections.
2. the film packaging construction of fingerprint identifier according to claim 1 is characterized in that wherein above-mentioned virtual pin is for not having electrical propagation function and being shorter than above-mentioned pin.
3. the film packaging construction of fingerprint identifier according to claim 1 is characterized in that wherein this adhesive body is to be coated with colloid for a bit.
4. the film packaging construction of fingerprint identifier according to claim 3, it is characterized in that wherein this pass through openings of this circuit film is to be a slotted eye, the opening length of this circuit film is the length less than the active surface of this fingerprint identifier wafer, and the A/F of this circuit film is the width greater than the sensing area of the active surface of this fingerprint identifier wafer.
5. the film packaging construction of fingerprint identifier according to claim 4 is characterized in that wherein this circuit film is the winding that encapsulates for a membrane of flip chip.
6. the film packaging construction of fingerprint identifier according to claim 1 is characterized in that wherein this circuit film is the winding that encapsulates for winding carrying.
7. the film packaging construction of fingerprint identifier according to claim 1 is characterized in that wherein the outer end of at least one pin is to be connected with an external finger.
8. the film packaging construction of fingerprint identifier according to claim 7 is characterized in that wherein above-mentioned external finger is to be multi-row staggered arrangement.
9. the film packaging construction of fingerprint identifier according to claim 7 is characterized in that wherein above-mentioned external finger is to be same linear array.
10. the film packaging construction of fingerprint identifier according to claim 1 is characterized in that wherein above-mentioned projection and above-mentioned virtual projection are to be golden projection or tie lines projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100024152A CN100547774C (en) | 2007-01-17 | 2007-01-17 | The film packaging construction of fingerprint identifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100024152A CN100547774C (en) | 2007-01-17 | 2007-01-17 | The film packaging construction of fingerprint identifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101226909A true CN101226909A (en) | 2008-07-23 |
| CN100547774C CN100547774C (en) | 2009-10-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100024152A Expired - Fee Related CN100547774C (en) | 2007-01-17 | 2007-01-17 | The film packaging construction of fingerprint identifier |
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| CN (1) | CN100547774C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016065618A1 (en) * | 2014-10-31 | 2016-05-06 | 方丽文 | Encapsulation device having arc edge fingerprint identification chip and encapsulating and cutting method |
| CN108288590A (en) * | 2017-01-09 | 2018-07-17 | 中芯国际集成电路制造(上海)有限公司 | Convex block packaging method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4160851B2 (en) * | 2003-03-31 | 2008-10-08 | 富士通株式会社 | Semiconductor device for fingerprint recognition |
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2007
- 2007-01-17 CN CNB2007100024152A patent/CN100547774C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016065618A1 (en) * | 2014-10-31 | 2016-05-06 | 方丽文 | Encapsulation device having arc edge fingerprint identification chip and encapsulating and cutting method |
| CN108288590A (en) * | 2017-01-09 | 2018-07-17 | 中芯国际集成电路制造(上海)有限公司 | Convex block packaging method |
| CN108288590B (en) * | 2017-01-09 | 2020-03-10 | 中芯国际集成电路制造(上海)有限公司 | Bump packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100547774C (en) | 2009-10-07 |
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Granted publication date: 20091007 Termination date: 20200117 |