CN101194375B - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN101194375B
CN101194375B CN2006800203512A CN200680020351A CN101194375B CN 101194375 B CN101194375 B CN 101194375B CN 2006800203512 A CN2006800203512 A CN 2006800203512A CN 200680020351 A CN200680020351 A CN 200680020351A CN 101194375 B CN101194375 B CN 101194375B
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China
Prior art keywords
wavelength
light
energy intensity
mentioned
emitting device
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CN2006800203512A
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English (en)
Chinese (zh)
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CN101194375A (zh
Inventor
高岛优
相原正人
武市顺司
内藤隆宏
玉置宽人
岸本智久
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Nichia Corp
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Nichia Corp
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Publication of CN101194375A publication Critical patent/CN101194375A/zh
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Publication of CN101194375B publication Critical patent/CN101194375B/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/66—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing germanium, tin or lead
    • C09K11/661—Chalcogenides
    • C09K11/662—Chalcogenides with zinc or cadmium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7767—Chalcogenides
    • C09K11/7769—Oxides
    • C09K11/7771—Oxysulfides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7784—Chalcogenides
    • C09K11/7785—Chalcogenides with zinc or cadmium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
CN2006800203512A 2005-06-15 2006-06-15 发光装置 Active CN101194375B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP174518/2005 2005-06-15
JP2005174518 2005-06-15
PCT/JP2006/312026 WO2006135005A1 (ja) 2005-06-15 2006-06-15 発光装置

Publications (2)

Publication Number Publication Date
CN101194375A CN101194375A (zh) 2008-06-04
CN101194375B true CN101194375B (zh) 2011-03-23

Family

ID=37532359

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800203512A Active CN101194375B (zh) 2005-06-15 2006-06-15 发光装置

Country Status (7)

Country Link
US (1) US8044569B2 (enExample)
EP (2) EP1895599B1 (enExample)
JP (2) JP5200537B2 (enExample)
KR (1) KR101194129B1 (enExample)
CN (1) CN101194375B (enExample)
TW (1) TWI413276B (enExample)
WO (1) WO2006135005A1 (enExample)

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US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
JP2009054633A (ja) * 2007-08-23 2009-03-12 Stanley Electric Co Ltd Ｌｅｄ照明灯具
KR20110048581A (ko) 2008-09-04 2011-05-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 높은 종횡비를 가지는 단색 광원
WO2010027648A1 (en) 2008-09-04 2010-03-11 3M Innovative Properties Company I i-vi mqw vcsel on a heat sink optically pumped by a gan ld
WO2010027650A1 (en) * 2008-09-04 2010-03-11 3M Innovative Properties Company Light source with improved monochromaticity
WO2010027580A2 (en) * 2008-09-04 2010-03-11 3M Innovative Properties Company Light source having light blocking components
WO2010027581A1 (en) 2008-09-04 2010-03-11 3M Innovative Properties Company Monochromatic light source
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US8511851B2 (en) 2009-12-21 2013-08-20 Cree, Inc. High CRI adjustable color temperature lighting devices
JP5410342B2 (ja) * 2010-03-12 2014-02-05 星和電機株式会社 発光装置
JP5734581B2 (ja) * 2010-05-21 2015-06-17 シャープ株式会社 半導体発光装置
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
EP3176837B1 (en) * 2011-03-15 2018-08-08 Kabushiki Kaisha Toshiba White light source
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
KR101219106B1 (ko) * 2011-08-01 2013-01-11 삼성전자주식회사 발광소자 패키지 및 그 제조방법
JP6356606B2 (ja) * 2012-10-04 2018-07-11 株式会社東芝 歯科用照明装置
JP6380826B2 (ja) * 2013-09-20 2018-08-29 パナソニックＩｐマネジメント株式会社 光源装置
US10020428B2 (en) 2013-10-02 2018-07-10 Glbtech Co., Ltd. White light emitting device having high color rendering
CN103642493A (zh) * 2013-12-23 2014-03-19 张书生 一种高光效、高稳定性无机发光材料及其制造方法
CN106104822B (zh) * 2014-04-30 2018-12-25 夏普株式会社 发光装置
JP6455817B2 (ja) * 2014-09-12 2019-01-23 パナソニックＩｐマネジメント株式会社 照明装置
JP2017147290A (ja) * 2016-02-16 2017-08-24 岩崎電気株式会社 Ｌｅｄユニット、及び照明装置
KR101995000B1 (ko) 2016-05-16 2019-07-01 엘지이노텍 주식회사 발광소자 패키지 및 조명장치
KR102427049B1 (ko) 2016-05-19 2022-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 플래시 모듈 및 이를 포함하는 단말기
US10270015B1 (en) 2017-01-13 2019-04-23 Nichia Corporation Light-emitting device
JP6558378B2 (ja) * 2017-01-13 2019-08-14 日亜化学工業株式会社 発光装置
DE112017007092T5 (de) * 2017-02-20 2019-11-28 Panasonic Intellectual Property Management Co., Ltd. Lichtemittierende Vorrichtung
JP7492142B2 (ja) * 2021-07-01 2024-05-29 日亜化学工業株式会社 発光装置、灯具及び照明器具
CN118679230A (zh) * 2021-12-09 2024-09-20 亮锐有限责任公司 氧代次氮基铍硅酸盐磷光体

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Also Published As

Publication number Publication date
JPWO2006135005A1 (ja) 2009-01-08
TW200711174A (en) 2007-03-16
EP3565011B1 (en) 2022-03-30
EP1895599A4 (en) 2014-03-19
TWI413276B (zh) 2013-10-21
CN101194375A (zh) 2008-06-04
JP2013033971A (ja) 2013-02-14
WO2006135005A1 (ja) 2006-12-21
EP1895599A1 (en) 2008-03-05
EP1895599B1 (en) 2019-09-04
EP3565011A1 (en) 2019-11-06
JP5429342B2 (ja) 2014-02-26
JP5200537B2 (ja) 2013-06-05
KR101194129B1 (ko) 2012-10-24
KR20080027343A (ko) 2008-03-26
US8044569B2 (en) 2011-10-25
US20100277054A1 (en) 2010-11-04

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