CN101180715A - 半导体用粘合膜 - Google Patents

半导体用粘合膜 Download PDF

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CN101180715A
CN101180715A CNA2005800498887A CN200580049888A CN101180715A CN 101180715 A CN101180715 A CN 101180715A CN A2005800498887 A CNA2005800498887 A CN A2005800498887A CN 200580049888 A CN200580049888 A CN 200580049888A CN 101180715 A CN101180715 A CN 101180715A
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semiconductor
adhesive layer
adhesive film
film
bonding
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申东天
姜炳彦
成太炫
金载勳
魏京台
徐准模
文赫洙
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LS Cable and Systems Ltd
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LS Cable Ltd
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Abstract

本发明公开了一种半导体用粘合膜。本发明提供用于半导体封装的半导体用粘合膜，所述粘合膜包含粘合层，其中，所述粘合层在60℃具有的表面张力为19erg/cm2～52erg/cm2。因此，本发明的半导体用粘合膜通过将表面张力控制在最佳条件下可以防止在所述粘合膜与支持部件之间形成气泡，并通过将粘性和粘合力控制在最佳条件下还可在半导体封装中使用所述粘合膜时获得更高的可靠性。

Description

半导体用粘合膜
技术领域
本发明涉及粘合膜，更具体地涉及用于在半导体的封装过程中将模具与芯片安装框架粘合的半导体用粘合膜。
背景技术
半导体封装过程通常包括用于将晶片切割为半导体芯片单元的晶片切割过程；用于将切割的半导体芯片与芯片安装框架粘合的模具粘合过程，所述框架例如为引线框架或衬底(如印刷电路板(PCB)或胶带接线板(tape wiring board)等)；用于将芯片安装框架电连接至半导体芯片的导线粘合过程；以及通过环氧塑封料(EMC)将半导体芯片与粘合线密封的封装过程。
粘合膜或粘合剂通常用于在该半导体封装过程中进行诸如半导体芯片与衬底、引线框架与芯片和芯片与芯片等各种对应元件之间的粘结。近年来，随着电子学/电学领域的持续发展，在半导体封装过程中需要减小电子设备的重量、厚度、长度和大小，并提高其性能。而且为了促进微电路之间，或微小零件与微电路之间的接触，正在不断开发更精确可控的粘合剂。
然而，传统粘合剂是导致在粘合剂与诸如引线框架、衬底或其他芯片等支持部件之间的界面处形成气泡的原因，从而由于安装芯片时的热处理而造成封装界面的剥落。
此外，允许依赖于减小电子设备的重量、厚度、长度和大小而进行高密度安装的表面安装型日益得到主要应用，但由于在该表面安装封装体中所述引线直接粘合于印刷电路板，所以应当加热整个表面安装封装体。此时，因为该封装体暴露在200℃～270℃的高温中，因此所述封装体可能由于其内部的水分蒸发而破裂。也就是说，吸附至粘合膜中的水分在安装温度下蒸发，于是由蒸发压力所致而在粘合膜与支持部件之间形成裂纹。
发明内容
技术问题
因而，本发明经设计以解决现有技术的问题，本发明的一个目的是提供一种用于半导体封装领域中的粘合膜的粘合剂组合物，和使用该粘合剂组合物的粘合膜，该粘合剂组合物通过将表面张力控制在最佳条件下可以防止在所述粘合膜与支持部件之间形成气泡，并通过将粘性和粘合力控制在最佳条件下获得半导体封装的可靠性。
技术方案
为实现上述目的，本发明提供用于半导体封装的粘合膜，所述粘合膜包含粘合层；其中，所述粘合层在60℃具有的表面张力为19erg/cm2(尔格/平方厘米)～52erg/cm2。
优选的是，所述粘合层在60℃具有的粘性为50gf/5.0mm～400gf/5.0mm。
更优选的是，所述粘合层具有的粘合力为至少5gf/cm2。
同时，所述粘合层优选包含选自由环氧类树脂、有机填料、无机填料和固化剂组成的组的至少一种材料，还可以包含选自由氨基类化合物、硅烷类化合物、丙烯酸化合物、金属有机盐、二氧化硅和氧化钛组成的组的至少一种改性剂。
附图说明
本发明的优选实施方式的这些和其他特征、方面及优点将由下列结合附图的具体描述而更加清楚。在附图中：
图1是显示根据本发明的优选实施方式的粘合膜的截面图。
具体实施方式
下面，参考附图将对本发明的优选实施方式进行详细描述。在进行描述前应理解，在说明书和所附权利要求中使用的术语不应被认为限于通常和词典意义，而应该在允许本发明人适当地限定术语以最佳地说明这一原则的基础之上，基于与本发明的技术方面相对应的意义和概念进行解释。因而，此处提出的说明仅是用于描述的优选例，而非意图限制本发明的范围，因此应当理解可以对本发明进行其他的等价替换和修改而不脱离其精神和范围。
图1是显示根据本发明的优选实施方式的粘合膜的截面图。
参考图1，根据该实施方式的粘合膜100包括基膜110；与所述基膜110的一个表面粘合的粘合层120；和与所述粘合层120的另一个表面粘合的保护膜111。所述保护膜111的功能是保护所述粘合层120。
维持所述粘合膜的基本形式的基膜110可优选包含聚对苯二甲酸乙二醇酯(PET)或聚亚乙基-2，6-萘二羧酸酯(PEN)。
保护所述粘合层免受异物损害的保护膜111可优选包含聚乙烯或对苯二甲酸乙二醇酯(PET)。
在将基膜110和保护膜111除去之后，将粘合层120粘合在模具与诸如引线框架、衬底或其他模具等支持部件之间。
在60℃～80℃将粘合膜100层压至支持部件中，或者在110℃～130℃挤压至支持部件中。在该情况中，如果粘合膜100中的粘合层120的表面张力在层压过程中与支持部件的表面张力差别很大，则粘合膜与支持部件之间可能生成气泡。因此，将粘合层120的表面张力设定为支持部件的表面张力，例如19erg/cm2～52erg/cm2以提供支持部件的光滑表面和良好润湿性。
所述粘合层120的粘性优选设定为50gf/5.0mm～400gf/5.0mm。这是因为如果粘合层120的粘性小于50gf/5.0mm，支持部件与粘合膜100不能彼此充分粘合，导致在其界面处形成气泡，如果粘合层120具有的粘性为至少400gf/5.0mm，可能不利的是双面粘合膜与设备强力粘合而不能从设备上剥离。
所述粘合层120具有的粘合力更优选为至少5gf/cm2。如果其粘合力小于5gf/cm2，难以获得足够的粘合力以防止在粘合过程中在粘合层120的表面形成气泡。
同时，构成粘合层120的组合物可以包含选自由环氧类树脂、有机填料、固化剂和无机填料组成的组的至少一种材料。所述环氧类树脂优选通过混合固相环氧树脂和液相环氧树脂而使用。也可以使用双酚A、双酚F、苯氧基树脂或甲酚酚醛树脂。这样的环氧树脂可提供较高的粘合强度，并具有非常低的反应收缩性，且不生成挥发性物质。此外它还具有诸如机械性质、电绝缘性质、耐水性和耐热性等优异性质。
所述有机填料可包括聚酰亚胺、聚酰胺酰亚胺、聚酯酰亚胺、尼龙或硅树脂等。所述无机填料可包括二氧化硅、氮化铝或氧化铝等。所述固化剂可包括胺、酸酐或酰胺等，还可包括潜伏性固化剂和具有高熔点的固化剂。优选所述粘合层还包含金属填料以提供导电性质。
另外，构成粘合层120的组合物优选包含选自由氨基类化合物、硅烷类化合物、丙烯酸化合物、金属有机盐、氧化硅和氧化钛组成的组的至少一种改性剂。可以添加该添加剂以将粘合层120的表面张力、粘性和粘合力调节至最佳条件。
然而，本发明并不限于所述物质，本领域的技术人员可以根据该详细描述而在本发明的精神和范围内进行各种变化和改进。
下面，将通过具体实例对本发明进行详细说明。然而应当理解，由于根据该详细说明而使得在本发明的精神和范围内的各种变化和改进对于本领域的技术人员将是显而易见的，因此根据本发明的优选实施方式的详细说明和具体实例仅是作为描述而给出。
在实施例1～3和比较例1和2中以恒定比率混合固相环氧树脂、液相环氧树脂、有机填料、环氧固化剂、UV固化剂和UV固化制剂，并且在实施例1～3中还可以加入各种改性剂。随后，将各混合物以约25μm的厚度涂布在50μm厚的聚酯膜上。实施例和比较例中这些组合物的比率如下列举在表1中。
表1
    实施例     比较例
    1     2     3     1     2
  固相环氧类     35     35     40     30     40
  液相环氧类     30     30     25     35     25
  有机填料     29     29     29     29     29
  改性剂     1phr     5phr     10phr     0phr     15phr
  环氧固化剂     4phr     4phr     4phr     4phr     4phr
  UV固化剂     6phr     6phr     6phr     6phr     6phr
  UV固化制剂     6     6     6     6     6
在表1中所列举的各实施例和比较例的组成比率中，基于以固相环氧类、液相环氧类、有机填料和UV固化制剂为100重量％，将所述改性剂、环氧固化剂和UV固化剂以“重量份”加入。
测定具有表1中所列组成的实施例1～3和比较例1和2的表面张力、粘性和180°剥离强度，结果列在表2中。
表2
    实施例   比较例
    1     2     3   1   2
    表面张力(60℃)(erg/cm2) 52 39 19 58 13
    粘性(60℃)(gf) 102 89 82 330 55
    180°剥离强度(gf/cm)(粘合力)     60℃     150     110     75   130   10
    固化后     1,100     1,120     580   450   320
    MRT测试(JEDEC水平1Pb-free) 通过 通过 通过 未通过 未通过
参考表2，当根据JEDEC中规定的步骤进行MRT测试时，具有表面张力为19erg/cm2～52erg/cm2的实施例1～3的组合物显示出优异的性质。即，支持部件的良好润湿性也可能防止在粘合膜与支持部件之间形成气泡，从而最终防止半导体封装体的破裂。此外如表2中所示，粘性和粘合力可以维持在适当的水平以防止由于粘合膜挤压过程中的过度粘性而导致粘合层残留在挤压机中。
已经对本发明进行了详细说明，不过应当理解，由于根据该详细说明而使得在本发明的精神和范围内的各种变化和改进对于本领域的技术人员将是显而易见的，因此根据本发明的优选实施方式的详细说明和具体实例仅是作为描述而给出。
工业实用性
如上所述，本发明的半导体用粘合膜通过将表面张力控制在最佳条件下可以防止在所述粘合膜与支持部件之间形成气泡，并通过将粘性和粘合力控制在最佳条件下还可在半导体封装中使用所述粘合膜时获得更高的可靠性。

Claims (5)

1.一种用于半导体封装中的半导体用粘合膜，所述粘合膜包含粘合层；
其中，所述粘合层在60℃具有的表面张力为19erg/cm2～52erg/cm2。
2.如权利要求1所述的半导体用粘合膜，
其中，所述粘合层在60℃具有的粘性为50gf/5.0mm～400gf/5.0mm。
3.如权利要求1所述的半导体用粘合膜，
其中，所述粘合层具有的粘合力为至少5gf/cm2。
4.如权利要求1～3任一项所述的半导体用粘合膜，
其中，所述粘合层包含选自由环氧类树脂、有机填料、无机填料和固化剂组成的组的至少一种材料。
5.如权利要求4所述的半导体用粘合膜，
其中，所述粘合层还包含选自由氨基类化合物、硅烷类化合物、丙烯酸化合物、金属有机盐、氧化硅和氧化钛组成的组的至少一种改性剂。
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