CN101164138B - 笛卡尔机械臂群集工具架构 - Google Patents

笛卡尔机械臂群集工具架构 Download PDF

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Publication number
CN101164138B
CN101164138B CN2006800133558A CN200680013355A CN101164138B CN 101164138 B CN101164138 B CN 101164138B CN 2006800133558 A CN2006800133558 A CN 2006800133558A CN 200680013355 A CN200680013355 A CN 200680013355A CN 101164138 B CN101164138 B CN 101164138B
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CN
China
Prior art keywords
assembly
mechanical arm
substrate
base material
vertical
Prior art date
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Expired - Fee Related
Application number
CN2006800133558A
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English (en)
Chinese (zh)
Other versions
CN101164138A (zh
Inventor
M·利斯
J·胡金斯
C·卡尔森
W·T·威弗
R·劳伦斯
E·英格哈特
D·C·鲁泽克
D·塞法缇
M·库查
K·范凯特
V·霍斯金
V·沙阿
S·洪乔姆
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
Priority claimed from US11/315,984 external-priority patent/US7651306B2/en
Priority claimed from US11/315,873 external-priority patent/US7374391B2/en
Priority claimed from US11/315,778 external-priority patent/US20060182535A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN101164138A publication Critical patent/CN101164138A/zh
Application granted granted Critical
Publication of CN101164138B publication Critical patent/CN101164138B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN2006800133558A 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构 Expired - Fee Related CN101164138B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US67384805P 2005-04-22 2005-04-22
US60/673,848 2005-04-22
US11/315,873 2005-12-22
US11/315,778 2005-12-22
US11/315,984 US7651306B2 (en) 2004-12-22 2005-12-22 Cartesian robot cluster tool architecture
US11/315,873 US7374391B2 (en) 2005-12-22 2005-12-22 Substrate gripper for a substrate handling robot
US11/315,984 2005-12-22
US11/315,778 US20060182535A1 (en) 2004-12-22 2005-12-22 Cartesian robot design
PCT/US2006/013164 WO2006115745A1 (en) 2005-04-22 2006-04-07 Cartesian robot cluster tool architecture

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201210342380.8A Division CN102867764B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构
CN 201110080003 Division CN102176425B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构

Publications (2)

Publication Number Publication Date
CN101164138A CN101164138A (zh) 2008-04-16
CN101164138B true CN101164138B (zh) 2012-10-17

Family

ID=36676525

Family Applications (3)

Application Number Title Priority Date Filing Date
CN2006800133558A Expired - Fee Related CN101164138B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构
CN 201110080003 Expired - Fee Related CN102176425B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构
CN201210342380.8A Expired - Fee Related CN102867764B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN 201110080003 Expired - Fee Related CN102176425B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构
CN201210342380.8A Expired - Fee Related CN102867764B (zh) 2005-04-22 2006-04-07 笛卡尔机械臂群集工具架构

Country Status (5)

Country Link
JP (2) JP5265343B2 (enExample)
KR (1) KR100960765B1 (enExample)
CN (3) CN101164138B (enExample)
TW (1) TWI345817B (enExample)
WO (1) WO2006115745A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
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KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
CN101332604B (zh) * 2008-06-20 2010-06-09 哈尔滨工业大学 人机相互作用机械臂的控制方法
SG181807A1 (en) * 2010-01-08 2012-07-30 Kla Tencor Corp Dual tray carrier unit
US9435826B2 (en) 2012-05-08 2016-09-06 Kla-Tencor Corporation Variable spacing four-point probe pin device and method
JP6182065B2 (ja) * 2013-12-27 2017-08-16 東京エレクトロン株式会社 基板処理装置
JP2015207622A (ja) * 2014-04-18 2015-11-19 株式会社ディスコ 搬送機構
EP2947686A1 (en) * 2014-05-19 2015-11-25 Meyer Burger AG Wafer processing method
US9555545B2 (en) * 2014-05-21 2017-01-31 Bot & Dolly, Llc Systems and methods for time-based parallel robotic operation
JP6559976B2 (ja) * 2015-03-03 2019-08-14 川崎重工業株式会社 基板搬送ロボットおよび基板処理システム
JP6425639B2 (ja) * 2015-04-08 2018-11-21 東京エレクトロン株式会社 基板処理システム
KR102478317B1 (ko) 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
KR101885257B1 (ko) * 2016-11-03 2018-08-03 포톤데이즈(주) 다수 매거진 구조의 광소자 신뢰성 및 특성 검사 장치
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
TWI678277B (zh) * 2017-03-21 2019-12-01 德律科技股份有限公司 障礙偵測方法及壓床防撞方法
JP6902379B2 (ja) 2017-03-31 2021-07-14 東京エレクトロン株式会社 処理システム
JP7576555B2 (ja) * 2019-02-14 2024-10-31 パーシモン テクノロジーズ コーポレイション ２リンクアームを有するリニアロボット
CN112582318B (zh) * 2019-09-30 2025-07-25 沈阳芯源微电子设备股份有限公司 涂胶显影设备
JP7536582B2 (ja) * 2020-10-01 2024-08-20 ニデックインスツルメンツ株式会社 搬送システム
US12162145B2 (en) * 2021-11-17 2024-12-10 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate conveying robot system
KR102870016B1 (ko) * 2021-12-29 2025-10-17 세메스 주식회사 기판 반송 장치 및 이를 가지는 기판 처리 설비

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5919529A (en) * 1995-02-13 1999-07-06 Dainippon Screen Mfg. Co., Ltd. Apparatus for and method of processing substrate
US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section
US6293713B1 (en) * 1999-07-02 2001-09-25 Tokyo Electron Limited Substrate processing apparatus
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling

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JP2000012656A (ja) * 1998-06-19 2000-01-14 Hitachi Ltd ハンドリング装置
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
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US6322312B1 (en) * 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
JP3957445B2 (ja) * 1999-07-02 2007-08-15 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4547524B2 (ja) * 2000-12-05 2010-09-22 川崎重工業株式会社 ワーク処理方法、ワーク処理装置およびロボット
JP2003124300A (ja) * 2001-10-15 2003-04-25 Tadamoto Tamai クランプ装置及び伸縮アーム
JP2005048877A (ja) * 2003-07-29 2005-02-24 Sumitomo Denko Brake Systems Kk ブレーキキャリパ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919529A (en) * 1995-02-13 1999-07-06 Dainippon Screen Mfg. Co., Ltd. Apparatus for and method of processing substrate
US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section
US6293713B1 (en) * 1999-07-02 2001-09-25 Tokyo Electron Limited Substrate processing apparatus
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling

Also Published As

Publication number Publication date
KR100960765B1 (ko) 2010-06-01
CN101164138A (zh) 2008-04-16
JP2013030787A (ja) 2013-02-07
TW200707621A (en) 2007-02-16
JP5329705B2 (ja) 2013-10-30
CN102176425A (zh) 2011-09-07
KR20070120175A (ko) 2007-12-21
WO2006115745A1 (en) 2006-11-02
TWI345817B (en) 2011-07-21
CN102867764A (zh) 2013-01-09
JP5265343B2 (ja) 2013-08-14
CN102867764B (zh) 2015-06-17
JP2008538654A (ja) 2008-10-30
CN102176425B (zh) 2013-02-06

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CB02 Change of applicant information

Address after: California, USA

Applicant after: APPLIED MATERIALS, Inc.

Address before: California, USA

Applicant before: APPLIED MATERIALS, Inc.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121017