CN101163819A - 成膜装置,匹配器以及阻抗控制方法 - Google Patents
成膜装置,匹配器以及阻抗控制方法 Download PDFInfo
- Publication number
- CN101163819A CN101163819A CNA2006800040267A CN200680004026A CN101163819A CN 101163819 A CN101163819 A CN 101163819A CN A2006800040267 A CNA2006800040267 A CN A2006800040267A CN 200680004026 A CN200680004026 A CN 200680004026A CN 101163819 A CN101163819 A CN 101163819A
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- impedance
- matching circuit
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2242/00—Auxiliary systems
- H05H2242/20—Power circuits
- H05H2242/26—Matching networks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP028307/2005 | 2005-02-03 | ||
JP2005028307A JP4789234B2 (ja) | 2005-02-03 | 2005-02-03 | 成膜装置,整合器,及びインピーダンス制御方法 |
PCT/JP2006/301022 WO2006082731A1 (ja) | 2005-02-03 | 2006-01-24 | 成膜装置,整合器,及びインピーダンス制御方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105104297A Division CN102031504B (zh) | 2005-02-03 | 2006-01-24 | 成膜装置,匹配器以及阻抗控制方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101163819A true CN101163819A (zh) | 2008-04-16 |
CN101163819B CN101163819B (zh) | 2011-01-05 |
Family
ID=36777120
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800040267A Active CN101163819B (zh) | 2005-02-03 | 2006-01-24 | 成膜装置,匹配器以及阻抗控制方法 |
CN2010105104297A Active CN102031504B (zh) | 2005-02-03 | 2006-01-24 | 成膜装置,匹配器以及阻抗控制方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105104297A Active CN102031504B (zh) | 2005-02-03 | 2006-01-24 | 成膜装置,匹配器以及阻抗控制方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20090188430A1 (zh) |
JP (1) | JP4789234B2 (zh) |
KR (1) | KR101207170B1 (zh) |
CN (2) | CN101163819B (zh) |
AU (2) | AU2006211246A1 (zh) |
DE (1) | DE112006000320B4 (zh) |
RU (1) | RU2397274C2 (zh) |
TW (2) | TW200644738A (zh) |
WO (1) | WO2006082731A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103320773A (zh) * | 2012-03-23 | 2013-09-25 | 克朗斯股份公司 | 对产品容器例如瓶子进行等离子体涂覆的装置 |
CN103998649A (zh) * | 2011-12-27 | 2014-08-20 | 麒麟麦酒株式会社 | 薄膜的成膜装置 |
CN109814006A (zh) * | 2018-12-20 | 2019-05-28 | 北京北方华创微电子装备有限公司 | 一种蚀刻系统放电异常检测方法和装置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100895689B1 (ko) * | 2007-11-14 | 2009-04-30 | 주식회사 플라즈마트 | 임피던스 매칭 방법 및 이 방법을 위한 전기 장치 |
JP5211759B2 (ja) * | 2008-02-29 | 2013-06-12 | パナソニック株式会社 | 大気圧プラズマ処理方法 |
DE102009046754A1 (de) * | 2009-11-17 | 2011-05-19 | Hüttinger Elektronik GmbH + Co.KG | Verfahren zum Betrieb einer Plasmaversorgungseinrichtung |
JP5375985B2 (ja) * | 2012-01-25 | 2013-12-25 | パナソニック株式会社 | 大気圧プラズマ処理装置 |
TWI551712B (zh) | 2015-09-02 | 2016-10-01 | 財團法人工業技術研究院 | 容器內部鍍膜裝置及其方法 |
JP6879774B2 (ja) * | 2017-02-24 | 2021-06-02 | 三菱重工機械システム株式会社 | インピーダンス設定装置、成膜システム、制御方法及びプログラム |
JP7253415B2 (ja) * | 2019-03-22 | 2023-04-06 | 株式会社ダイヘン | インピーダンス整合装置及びインピーダンス整合方法 |
JP6919043B1 (ja) * | 2020-10-13 | 2021-08-11 | 積水化学工業株式会社 | 照射器具及びプラズマ装置 |
JP7489894B2 (ja) | 2020-10-20 | 2024-05-24 | 東京エレクトロン株式会社 | プラズマ生成装置、プラズマ処理装置及びプラズマ処理方法 |
JP7036999B1 (ja) | 2021-07-16 | 2022-03-15 | 株式会社アルバック | 成膜方法及び成膜装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0896992A (ja) | 1994-09-22 | 1996-04-12 | Nissin Electric Co Ltd | プラズマ処理装置の運転方法 |
JPH09260096A (ja) * | 1996-03-15 | 1997-10-03 | Hitachi Ltd | インピーダンス整合方法および装置ならびに半導体製造装置 |
TW200300649A (en) | 2001-11-27 | 2003-06-01 | Alps Electric Co Ltd | Plasma processing apparatus, its driving method, matching circuit design system, and plasma processing method |
JP3643813B2 (ja) * | 2001-12-13 | 2005-04-27 | 三菱重工業株式会社 | プラスチック容器内面への炭素膜形成装置および内面炭素膜被覆プラスチック容器の製造方法 |
JP4497811B2 (ja) | 2001-12-20 | 2010-07-07 | キヤノン株式会社 | プラズマ処理方法 |
JP4024053B2 (ja) | 2002-02-08 | 2007-12-19 | キヤノンアネルバ株式会社 | 高周波プラズマ処理方法及び高周波プラズマ処理装置 |
JP2004139710A (ja) * | 2002-08-21 | 2004-05-13 | Monolith Co Ltd | ディスク記録媒体および音楽再生装置 |
JP2004096019A (ja) * | 2002-09-04 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 高周波プラズマ発生方法と装置 |
-
2005
- 2005-02-03 JP JP2005028307A patent/JP4789234B2/ja active Active
-
2006
- 2006-01-24 CN CN2006800040267A patent/CN101163819B/zh active Active
- 2006-01-24 RU RU2007132912/02A patent/RU2397274C2/ru not_active IP Right Cessation
- 2006-01-24 WO PCT/JP2006/301022 patent/WO2006082731A1/ja not_active Application Discontinuation
- 2006-01-24 AU AU2006211246A patent/AU2006211246A1/en not_active Abandoned
- 2006-01-24 DE DE112006000320.8T patent/DE112006000320B4/de active Active
- 2006-01-24 CN CN2010105104297A patent/CN102031504B/zh active Active
- 2006-01-24 US US11/883,580 patent/US20090188430A1/en not_active Abandoned
- 2006-01-24 KR KR1020077019914A patent/KR101207170B1/ko active IP Right Grant
- 2006-01-27 TW TW095103556A patent/TW200644738A/zh unknown
- 2006-01-27 TW TW099131754A patent/TW201108868A/zh unknown
-
2010
- 2010-07-28 AU AU2010206014A patent/AU2010206014B2/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103998649A (zh) * | 2011-12-27 | 2014-08-20 | 麒麟麦酒株式会社 | 薄膜的成膜装置 |
CN103998649B (zh) * | 2011-12-27 | 2016-05-11 | 麒麟麦酒株式会社 | 薄膜的成膜装置 |
CN103320773A (zh) * | 2012-03-23 | 2013-09-25 | 克朗斯股份公司 | 对产品容器例如瓶子进行等离子体涂覆的装置 |
CN103320773B (zh) * | 2012-03-23 | 2015-11-18 | 克朗斯股份公司 | 对产品容器例如瓶子进行等离子体涂覆的装置 |
CN109814006A (zh) * | 2018-12-20 | 2019-05-28 | 北京北方华创微电子装备有限公司 | 一种蚀刻系统放电异常检测方法和装置 |
Also Published As
Publication number | Publication date |
---|---|
AU2010206014A1 (en) | 2010-08-19 |
JP2006213967A (ja) | 2006-08-17 |
TW200644738A (en) | 2006-12-16 |
TW201108868A (en) | 2011-03-01 |
KR101207170B1 (ko) | 2012-12-03 |
DE112006000320B4 (de) | 2018-05-17 |
JP4789234B2 (ja) | 2011-10-12 |
CN101163819B (zh) | 2011-01-05 |
WO2006082731A1 (ja) | 2006-08-10 |
US20090188430A1 (en) | 2009-07-30 |
AU2010206014B2 (en) | 2012-01-12 |
RU2397274C2 (ru) | 2010-08-20 |
KR20070106743A (ko) | 2007-11-05 |
CN102031504A (zh) | 2011-04-27 |
AU2006211246A1 (en) | 2006-08-10 |
RU2007132912A (ru) | 2009-03-10 |
CN102031504B (zh) | 2012-09-05 |
DE112006000320T5 (de) | 2008-01-10 |
TWI348879B (zh) | 2011-09-11 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170703 Address after: Hyogo Co-patentee after: KIRIN BEER Kabushiki Kaisha Patentee after: MITSUBISHI HEAVY INDUSTRIES MECHATRONICS SYSTEMS, Ltd. Address before: Aichi Prefecture, Japan Co-patentee before: KIRIN BEER Kabushiki Kaisha Patentee before: Mitsubishi Heavy Industries Food & Packaging Machinery Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Hyogo Co-patentee after: KIRIN BEER Kabushiki Kaisha Patentee after: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, Ltd. Address before: Hyogo Co-patentee before: KIRIN BEER Kabushiki Kaisha Patentee before: Mitsubishi Heavy Industries Mechatronics Systems, Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230518 Address after: Tokyo, Japan Patentee after: KIRIN BEER Kabushiki Kaisha Address before: Japan Hyogo Prefecture Patentee before: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, Ltd. Patentee before: KIRIN BEER Kabushiki Kaisha |
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TR01 | Transfer of patent right |