CN101151945B - 使用接地和信号pth反钻进行信号整形的孔 - Google Patents

使用接地和信号pth反钻进行信号整形的孔 Download PDF

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CN101151945B
CN101151945B CN200680010015.XA CN200680010015A CN101151945B CN 101151945 B CN101151945 B CN 101151945B CN 200680010015 A CN200680010015 A CN 200680010015A CN 101151945 B CN101151945 B CN 101151945B
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CN101151945A (zh
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雨瓦尔·巴史耳
迈克尔·戈波曼
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    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
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Abstract

一种方法和装置，用于采用标准反钻技术对经过镀通孔(PTH)传输的信号进行整形，以减小经反钻的信号PTH附近的接地PTH的谐振截线长度。

Description

使用接地和信号PTH反钻进行信号整形的孔
技术领域
本发明涉及使用接地和信号PTH反钻(back-drilling)进行信号整形(signal shaping)的孔。
背景技术
近年来的系统设计情况已经驱使专用工具和实践的需求来确保高速信号质量，特别是对于背板(backplane)和连接器过孔阵列。
工业中所用信号的速度以每两年两倍的平均速率增加。由此，背板和其他印刷电路板(PCB)所用信号的上升时间也减小，并且点对点发送这些信号所需的带宽增加(每两年就加倍)。现在板对板(board-to-board)应用场合中3.125G比特/秒(Gbps)的传输数据率已经是平常的事。随着数据率向5、6.25或10Gbps增加，必须对信道的每个部分进行检查以提高性能。
信道包括镀通孔(plated through holes，PTH)，镀通孔也称为过孔，其如图1所示将信号传输到多层PCB的内部层中。PTH对于许多器件封装很常见，这些封装例如球栅阵列(BGA)和其他连接器类型。通常，在背板系统中，发送器与接收器之间的信道包括若干个过孔或PTH。
PTH是通过穿透多层PCB钻孔来制造的。如本领域所知，多层PCB包括由电介质层分隔开的导电迹线。孔由导体(例如铜)覆盖，并形成有焊盘以将PTH连接到导电迹线中特定的迹线。如图1所示，PTH 10可以用于将信号从接触焊盘(capture pad)12传导到内部迹线16，所述接触焊盘12安装在PCB的表面14上。在此情况下，PTH在表面上带有用于与接触焊盘连接的焊盘，以及与所选内部迹线连接的另一焊盘。PTH与所有其他迹线绝缘。
在高频下，将表面焊盘接合到内部迹线的PTH会影响信号整形。取决于信号频率以及PTH的尺寸，信号能量可能从PTH反射或者被转换成辐射，从而造成信号功率损耗以及其他不良的副作用。
众所周知，PTH作为滤波器时所在的频率是由孔的未用部分确定的，所述未用部分称为谐振截线(resonant stub)。在图1中，延伸超过所选迹线层的PTH部分是谐振截线18。用于对截线的影响进行控制的一种技术是利用称为“反钻”的改变其尺寸的技术，在该技术中，如图2所示，通过从PCB的反面钻孔来除去PTH未用部分的镀层。反钻必须在制造成本与电性能之间进行权衡。其效果会受到钻孔深度精确性以及多深度钻孔的成本增大这些因素的影响。
但是，这些简单的反钻技术(用于减小截线影响)在某些情况下不适于保证2Gbps和更高速度下的高质量信号。
还有其他已知技术采用更加奇异的技术(例如在PCB中嵌入无源或有源滤波器)来减小反射并进行信号整形。但是，这些技术较昂贵，并且在多数情况下不适于PCB的大量生产。
随着对于具有更高简便性和更低成本的更多、更好技术的需要，高频传输领域中的挑战在继续增大。因此需要一种新的系统和方法来控制PTH造成的反射和信号整形。
发明内容
在本发明的一种实施例中，采用标准反钻技术来除去经反钻的信号PTH附近接地PTH的谐振截线，从而进行信号整形并减小反射。
在本发明的另一种实施例中，改变接地PTH的截线长度，从而对选定信号频率处的信号整形进行控制。
根据下面的详细说明以及附图，可以更加了解本发明的其他特征和优点。
附图说明
图1是镀通孔的立体剖视图；
图2包括图示了反钻处理的截面图；
图3是信号PTH和接地PTH的布局俯视图；
图4是图3中布局的侧视图；
图5是本发明一种实施例的立体剖视图；
图6是图示了本发明一种实施例操作的曲线图；
图7是描述本发明一种实施例所执行的步骤的流程图。
具体实施方式
现在将详细参考本发明的各种实施例。附图中图示了这些实施例的示例。尽管将结合这些实施例来说明本发明，但是应当明白，不应将本发明限制在任何实施例。相反，应当认为覆盖了由权利要求限定的本发明精神和范围内可以包括的那些变更、修改和等同形式。在下面的说明中，阐述了大量具体细节以提供对各种实施例的详尽理解。但是，在不采用这些具体细节中的一些或全部的情况下，也可以实施本发明。在其他情况下，并未对公知处理操作进行详细描述，以免不必要地使本发明模糊不清。
图3和图4图示了印刷电路板上的PTH布局。如本领域所知，信号PTH通常置于接地PTH之间，以减小信号间的串扰。在图3中，信号PTH 30被置于第一、第二、第三和第四接地PTH 32(1)-32(4)之间。图4是图示了信号PTH 30的侧视图，所述信号PTH 30已受到过反钻以减小谐振截线的尺寸，并被四个接地PTH 32(1)-32(4)围绕。
发明人已经发现，通过采用标准反钻技术来减小围绕信号PTH的接地PTH的谐振截线长度，可以使信道的信号质量以及经过各种板厚传输高频信号的能力提高。
图5图示了本发明的一种优选实施例，其中，接地PTH 32(1)-32(4)已受到过反钻，所以这些接地PTH的谐振截线的尺寸已减小。
图6是图示了各种频率下信号衰减的曲线图。点线表示了15GHz下信号衰减的显著增大。如虚线所示，在接地PTH受到反钻之后，这种信号衰减的显著程度大大降低。该曲线图所示接地PTH反钻的效果使得信道更加“平坦”，即，信道的谐振和反射大大减少。这对信道/过孔结构的输出信号质量有直接影响。
在上述实施例中采用了标准反钻技术。可以在相同的制造过程中对信号PTH和接地PTH进行反钻，而不会显著增加PCB制造的成本或复杂性。
在一种优选实施例中，对背板中的接地PTH进行反钻，但也可以对用于形成高频信号传输信道的任何板使用这种技术。
在本发明的另一种实施例中，可以改变信号PTH和接地PTH的谐振截线长度，以根据信道需求对所传输的信号进行整形。
在本发明的这种实施例中，将信号PTH反钻与接地PTH反钻相结合来对信号产生滤波器效果。如图7的流程图所示，通过调节信号PTH的反钻深度并将接地PTH反钻到相同或不同的深度，来改变滤波公式。
使用建模工具(例如Ansoft出品的HFSS)，可以针对每个反钻深度解算信道的变换公式，并可以设置所需的信号滤波或整形。这样，可以根据PTH结构的变换公式对输出信号进行控制、滤波和整形，并可以通过改变反钻深度来调节输出信号。
已经参考优选实施例对本发明进行了说明。但本领域技术人员可以想到替换和替代形式。例如，这些示意图图示了由四个接地PTH围绕的信号PTH，但是本发明不限于任何PTH的具体数目或构造。此外，也可以采用本领域技术人员所知除了HFSS之外的建模程序。因此，除了权利要求规定的那些之外，不应对本发明进行限制。

Claims (6)

1.一种用于制造印刷电路板的方法，所述方法包括：
对于将表面连接器与所述印刷电路板的第一内部导电层耦合的信号镀通孔进行反钻以除去所述信号镀通孔的谐振截线的至少一部分，所述印刷电路板具有由电介质层分隔的多个内部导电层并采用所述信号镀通孔将所述印刷电路板表面上的焊盘连接到不是接地层的所述第一内部导电层，其中，镀通孔的谐振截线是指延伸超过所耦合的导电层的镀通孔部分；
对多个接地镀通孔中的每个接地镀通孔进行反钻以除去每个所述接地镀通孔的谐振截线的至少一部分，其中，每个所述接地镀通孔都与所述接地层耦合并被布置为围绕所述信号镀通孔以减小信号镀通孔之间的串扰。
2.根据权利要求1所述的方法，还包括：
将所述多个接地镀通孔中的第一接地镀通孔的所述谐振截线除去指定长度，以改善选定高频下的信号传输。
3.一种印刷电路板，其具有
由电介质层分隔的多个内部导电层；
信号镀通孔，所述信号镀通孔将表面连接器与不是接地层的第一内部导电层耦合并具有谐振截线，对所述信号镀通孔的谐振截线进行反钻，以使选定频率或频带上的信号传输得到改善，其中，镀通孔的谐振截线是指延伸超过所耦合的导电层的镀通孔部分；以及
多个接地镀通孔，每个所述接地镀通孔都被布置为围绕所述信号镀通孔以减小信号镀通孔之间的串扰，并且对每个所述接地镀通孔的谐振截线都进行反钻，以使所述选定频率或频带上的信号传输得到进一步改善。
4.根据权利要求3所述的印刷电路板，其中：
第一接地镀通孔的所述谐振截线具有选定的长度，以使所述选定频率或频带上的信号传输得到改善。
5.一种对信号进行整形的方法，所述方法包括：
针对谐振截线长度的不同构造，对选定频率或频带的信号传输特性进行计算机建模，每个构造包括与印刷电路板的不是接地层的内部导电层耦合的信号镀通孔以及与所述印刷电路板的所述接地层耦合的多个接地镀通孔，其中，镀通孔的谐振截线是指延伸超过所耦合的导电层的镀通孔部分；
选择谐振截线长度的优选构造，所述谐振截线长度的优选构造具有适于所选频率或频带传输的信号特性；
对在所述印刷电路板中形成的镀通孔的构造进行反钻，使所述印刷电路板上的每个镀通孔的构造具有的谐振截线长度等于由计算机建模确定的所述谐振截线长度优选构造中的相应谐振截线长度。
6.一种对信号进行整形的系统，所述系统包括：
用于计算机建模的装置，其针对谐振截线长度的不同组合，对选定频率或频带的信号传输特性进行计算机建模并确定优选构造，每个构造包括与印刷电路板的不是接地层的内部导电层耦合的信号镀通孔以及与所述印刷电路板的所述接地层耦合的多个接地镀通孔，其中，镀通孔的谐振截线是指延伸超过所耦合的导电层的镀通孔部分；以及
用于对在所述印刷电路板中形成的镀通孔的构造进行反钻的装置，使所述印刷电路板上的每个镀通孔具有的谐振截线长度等于由计算机建模确定的所述谐振截线长度优选构造中的相应谐振截线长度。
CN200680010015.XA 2005-05-02 2006-04-26 使用接地和信号pth反钻进行信号整形的孔 Active CN101151945B (zh)

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Application Number Priority Date Filing Date Title
US11/121,821 US7291790B2 (en) 2005-05-02 2005-05-02 Apertures for signal shaping using ground and signal PTH back-drilling
US11/121,821 2005-05-02
PCT/US2006/015838 WO2006118908A2 (en) 2005-05-02 2006-04-26 Apertures for signal shaping using ground and signal pth back-drilling

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CN101151945B true CN101151945B (zh) 2010-12-22

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US20060243481A1 (en) 2006-11-02
US7291790B2 (en) 2007-11-06
WO2006118908A3 (en) 2007-02-01
WO2006118908A2 (en) 2006-11-09
CN101151945A (zh) 2008-03-26
EP1878328A4 (en) 2011-08-03

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