CN201230403Y - 印刷电路板 - Google Patents
印刷电路板 Download PDFInfo
- Publication number
- CN201230403Y CN201230403Y CNU200820301435XU CN200820301435U CN201230403Y CN 201230403 Y CN201230403 Y CN 201230403Y CN U200820301435X U CNU200820301435X U CN U200820301435XU CN 200820301435 U CN200820301435 U CN 200820301435U CN 201230403 Y CN201230403 Y CN 201230403Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- printed circuit
- pcb
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09545—Plated through-holes or blind vias without lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
一种印刷电路板,包括一顶层、一底层及一中间层,所述印刷电路板上开设一穿透所述顶层、底层及中间层的通孔,所述中间层包括至少两个层面,所述通孔仅在所述中间层的两个层面上设有焊盘。本实用新型印刷电路板省去通孔在电路板顶层和底层的焊盘,有利于实现更紧凑的印刷电路板布局设计。
Description
技术领域
本实用新型涉及一种印刷电路板,尤指一种具特殊过孔的印刷电路板。
背景技术
在多层PCB(Printed Circuit Board,印刷电路板)设计中,由于布线密度、拓扑结构的要求,信号走线经常需要在层间切换,如果它所参考的地平面也发生变化,那么该信号的回流路径将发生变化,从而产生一定的EMI(Electro Magnetic Interference,电磁干扰)问题,解决这一问题最简单有效的方法就是合理添加电容或过孔,在信号走线换层的附近多设置一些接地通孔(或电源孔)和电容能为信号提供完整的低阻抗的回路,保证信号和回流之间的耦合,从而抑制EMI。
传统的接地通孔或其它信号孔在PCB的每一层面上都具有焊盘(见图1),以实现通孔的电镀内层与印刷电路板表面(或内部)的走线的电气连接。但是,在实际应用中,PCB顶层和底层的通孔焊盘有些是空置无用的,对PCB的空间造成不必要的浪费,不利于更紧凑的印刷电路板布局设计。
实用新型内容
鉴于以上内容,有必要提供一种可紧凑布局的印刷电路板。
一种印刷电路板,包括一顶层、一底层及一中间层,所述印刷电路板上开设一穿透所述顶层、底层及中间层的通孔,所述中间层包括至少两个层面,所述通孔仅在所述中间层的两个层面上设有焊盘。
本实用新型印刷电路板上开设的通孔省去了在印刷电路板顶层及底层的焊盘,节省了电路板的空间,有利于实现更紧凑的印刷电路板布局设计。
附图说明
图1为传统印刷电路板及其通孔的示意图。
图2为本实用新型较佳实施方式印刷电路板及其通孔的示意图。
具体实施方式
请参阅图1,本实用新型较佳实施方式印刷电路板包括一顶层、一底层及设于所述顶层及底层之间的两接地层,一通孔1垂直穿设于所述印刷电路板的顶层、两接地层及底层,所述通孔1仅在所述两接地层上具有焊盘2,所述通孔1的钻孔直径为14mil(1mil=千分之一寸),所述焊盘2的外径为20mil。
在制板过程中,先以所述焊盘2所在位置的中心轴线为准钻孔(钻孔直径为14mil),再在该钻孔内壁镀上涂层,使之成为具有导电性的通孔1,实现所述两接地层之间的层间电气连通,由于涂层的厚度大致在1mil-2mil之间,因此所述通孔1完工后的内径在12mil-10mil之间。
在本实用新型较佳实施方式中,所述通孔1为接地孔,设置于高速信号换层的过孔附近为信号提供完整的低阻抗的回路,以保证信号和回流之间的耦合,从而抑制EMI。所述通孔1在接地层上的焊盘2与高速信号换层走线有连接关系,在顶层和底层未设置焊盘,与电路板的走线没有连接关系。
由于省去了顶层及底层的通孔焊盘,印刷电路板的空间能更紧凑的运用,且通过仿真验证,所述通孔1不但能实现传统通孔的电气性能,而且在传输频率在10GHZ以上的信号时较传统通孔性能更佳。
所述印刷电路板亦可为其它层数的多层印刷电路板,由顶层、中间层及底层组成,其中间层可以包括接地层、电源层及信号层等。
所述通孔1亦可为其它实现电路板层间互连的信号孔,所述信号孔在电路板的顶层、底层和中间层的某些层面无需与电路板的走线连接,因此可以省去在这些层面上的焊盘。
Claims (6)
- 【权利要求1】一种印刷电路板,包括一顶层、一底层及设于所述顶层及底层之间的中间层,所述印刷电路板上开设一穿透所述顶层、底层及中间层的通孔,所述中间层包括至少两个层面,其特征在于:所述通孔仅在所述中间层的两个层面上设有焊盘。
- 【权利要求2】如权利要求1所述的印刷电路板,其特征在于:所述通孔为信号孔。
- 【权利要求3】如权利要求2所述的印刷电路板,其特征在于:所述通孔为设于高速信号换层的过孔附近的接地孔。
- 【权利要求4】如权利要求3所述的印刷电路板,其特征在于:所述中间层包括两接地层,所述通孔仅在所述两接地层上设有焊盘。
- 【权利要求5】如权利要求2所述的印刷电路板,其特征在于:所述通孔为设于高速信号换层的过孔附近的电源孔。
- 【权利要求6】如权利要求5所述的印刷电路板,其特征在于:所述中间层包括两电源层,所述通孔仅在所述电源层上设有焊盘。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200820301435XU CN201230403Y (zh) | 2008-07-03 | 2008-07-03 | 印刷电路板 |
US12/205,151 US20100000778A1 (en) | 2008-07-03 | 2008-09-05 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200820301435XU CN201230403Y (zh) | 2008-07-03 | 2008-07-03 | 印刷电路板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201230403Y true CN201230403Y (zh) | 2009-04-29 |
Family
ID=40635342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU200820301435XU Expired - Fee Related CN201230403Y (zh) | 2008-07-03 | 2008-07-03 | 印刷电路板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100000778A1 (zh) |
CN (1) | CN201230403Y (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111338439A (zh) * | 2020-02-23 | 2020-06-26 | 苏州浪潮智能科技有限公司 | 适用于双列直插式存储模块的卡槽、主板及主板设计方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9545003B2 (en) * | 2012-12-28 | 2017-01-10 | Fci Americas Technology Llc | Connector footprints in printed circuit board (PCB) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6335494B1 (en) * | 2000-06-23 | 2002-01-01 | International Business Machines Corporation | Multiple power distribution for delta-I noise reduction |
US6643916B2 (en) * | 2001-05-18 | 2003-11-11 | Hewlett-Packard Development Company, L.P. | Method to assemble a capacitor plate for substrate components |
US7249337B2 (en) * | 2003-03-06 | 2007-07-24 | Sanmina-Sci Corporation | Method for optimizing high frequency performance of via structures |
US20090049414A1 (en) * | 2007-08-16 | 2009-02-19 | International Business Machines Corporation | Method and system for reducing via stub resonance |
-
2008
- 2008-07-03 CN CNU200820301435XU patent/CN201230403Y/zh not_active Expired - Fee Related
- 2008-09-05 US US12/205,151 patent/US20100000778A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111338439A (zh) * | 2020-02-23 | 2020-06-26 | 苏州浪潮智能科技有限公司 | 适用于双列直插式存储模块的卡槽、主板及主板设计方法 |
CN111338439B (zh) * | 2020-02-23 | 2021-07-27 | 苏州浪潮智能科技有限公司 | 适用于双列直插式存储模块的卡槽、主板及主板设计方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100000778A1 (en) | 2010-01-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100444702C (zh) | 具有轴向平行通孔的印刷电路板 | |
CN103188886B (zh) | 一种印制电路板及其制作方法 | |
CN101295585A (zh) | 电容器、包含该电容器的电路板及集成电路承载基板 | |
CN106376172B (zh) | 一种混压金属基微波印制板及设计方法 | |
CN103096613A (zh) | 印刷电路板及其制作方法 | |
CN105657962A (zh) | 一种多层pcb电路板 | |
CN203313514U (zh) | 多层数线路板 | |
CN103052281A (zh) | 嵌入式多层电路板及其制作方法 | |
CN201230403Y (zh) | 印刷电路板 | |
CN204350437U (zh) | 多层电路板 | |
CN105101642B (zh) | 一种增加多层pcb板金属箔面积的方法及多层pcb板 | |
CN107734859B (zh) | 一种pcb的制造方法及pcb | |
CN106341941A (zh) | 一种局部埋入铜块与内层导线导通制作方法 | |
CN106658959A (zh) | 柔性电路板及其制作方法 | |
CN203574934U (zh) | 一种pcb板 | |
CN201323703Y (zh) | 软硬复合电路板结构 | |
CN202998663U (zh) | 一种双盲孔的印刷电路板 | |
CN203015272U (zh) | 印制电路板 | |
CN202998662U (zh) | 一种带盲孔埋孔的印刷电路板 | |
CN211481587U (zh) | 一种服务器转接卡 | |
CN207897217U (zh) | 一种高信赖性碳墨线路板 | |
CN102223755A (zh) | 板边镀铜板 | |
CN203167416U (zh) | 一种多层pcb板 | |
CN202998643U (zh) | 一种多盲孔双埋孔的印刷电路板 | |
CN102510665A (zh) | 电路板加工方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090429 |