CN101144979B - 光致抗蚀剂用溶剂以及采用它的狭缝涂敷用光致抗蚀剂组合物 - Google Patents
光致抗蚀剂用溶剂以及采用它的狭缝涂敷用光致抗蚀剂组合物 Download PDFInfo
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- CN101144979B CN101144979B CN2007101460093A CN200710146009A CN101144979B CN 101144979 B CN101144979 B CN 101144979B CN 2007101460093 A CN2007101460093 A CN 2007101460093A CN 200710146009 A CN200710146009 A CN 200710146009A CN 101144979 B CN101144979 B CN 101144979B
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 40
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- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 13
- 238000009835 boiling Methods 0.000 claims description 12
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- 239000003513 alkali Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 2
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- 238000004519 manufacturing process Methods 0.000 description 6
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- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 5
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 239000000839 emulsion Substances 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
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- 125000001153 fluoro group Chemical class F* 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 3
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- 239000007788 liquid Substances 0.000 description 3
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 3
- 229940100630 metacresol Drugs 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 3
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- 238000004528 spin coating Methods 0.000 description 3
- 239000000080 wetting agent Substances 0.000 description 3
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 125000005599 alkyl carboxylate group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 150000001983 dialkylethers Chemical class 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
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- 125000000524 functional group Chemical group 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- -1 polysiloxane Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- RFFFKMOABOFIDF-UHFFFAOYSA-N Pentanenitrile Chemical compound CCCCC#N RFFFKMOABOFIDF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- GIMBWMBFSHKEQU-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O.CCCCCC(C)=O GIMBWMBFSHKEQU-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000000852 hydrogen donor Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 1
- ROMWNDGABOQKIW-UHFFFAOYSA-N phenyliodanuidylbenzene Chemical compound C=1C=CC=CC=1[I-]C1=CC=CC=C1 ROMWNDGABOQKIW-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Images
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Paints Or Removers (AREA)
Abstract
Description
固体成分含量(重量%) | 溶剂*1(混合比:重量%) | 粘度(25℃单位cp) | 粘度变化*2(%) | |
比较例1 | 14.9 | EL(100) | 8.75 | - |
比较例2 | 14.9 | PGME(100) | 6.26 | - |
比较例3 | 14.9 | PGMEA(100) | 3.94 | 0 |
实施例1 | 14.9 | AA(100) | 2.12 | -46 |
实施例2 | 14.9 | AA(40)+BA(60) | 2.14 | -46 |
实施例3 | 14.9 | AA(40)+DEC(60) | 2.32 | -41 |
实施例4 | 14.9 | MAK(100) | 2.49 | -37 |
固体成分含量(重量%) | 溶剂*1(混合比:重量%) | 粘度(25℃单位cp) | 粘度变化*2(%) | |
比较例4 | 16.4 | PGMEA(100) | 4.71 | 0 |
实施例5 | 16.4 | PGMEA(33)+AA(67) | 2.96 | -37 |
实施例6 | 16.4 | PGMEA(33)+BA(67) | 2.87 | -39 |
实施例7 | 16.4 | PGMEA(33)+MAK(67) | 3.12 | -34 |
实施例8 | 16.4 | PGMEA(33)+DEC(67) | 3.27 | -31 |
实施例9 | 16.4 | PGMEA(33)+DIBK(67) | 4.25 | -10 |
固体成分含量(重量%) | 溶剂*1(混合比:重量%) | 粘度(25℃单位cp) | |
比较例5 | 11.4 | PGMEA(100) | 2.79 |
比较例6 | 13.7 | PGMEA(100) | 3.52 |
比较例7 | 15.9 | PGMEA(100) | 4.42 |
比较例8 | 18.2 | PGMEA(100) | 5.98 |
比较例9 | 25.0 | PGMEA(100) | 15.7 |
实施例10 | 15.0 | AA(100) | 2.21 |
实施例11 | 17.0 | AA(100) | 2.61 |
实施例12 | 19.0 | AA(100) | 3.19 |
实施例13 | 21.0 | AA(100) | 3.97 |
实施例14 | 23.0 | AA(100) | 4.96 |
固体成分含量(重量%) | 溶剂(混合比:重量%) | 粘度(25℃单位cp) | 最大涂敷速度(mm/s) | |
比较例3 | 14.9 | PGMEA(100) | 3.94 | 140 |
实施例1 | 14.9 | AA(100) | 2.12 | 250 |
实施例4 | 14.9 | MAK(100) | 2.49 | 230 |
比较例4 | 16.4 | PGMEA(100) | 4.71 | 100 |
实施例6 | 16.4 | PGMEA(33)+BA(67) | 2.87 | 230 |
实施例7 | 16.4 | PGMEA(33)+MAK(67) | 3.12 | 200 |
比较例5 | 11.4 | PGMEA(100) | 2.79 | 230 |
比较例7 | 15.9 | PGMEA(100) | 4.42 | 120 |
实施例11 | 17.0 | AA(100) | 2.61 | 230 |
实施例13 | 21.0 | AA(100) | 3.97 | 140 |
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-247223 | 2006-09-12 | ||
JP2006247223 | 2006-09-12 | ||
JP2006247223A JP2008070480A (ja) | 2006-09-12 | 2006-09-12 | フォトレジスト用溶媒とそれを用いたスリットコーティング用フォトレジスト組成物 |
Publications (2)
Publication Number | Publication Date |
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CN101144979A CN101144979A (zh) | 2008-03-19 |
CN101144979B true CN101144979B (zh) | 2012-04-04 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101460093A Active CN101144979B (zh) | 2006-09-12 | 2007-09-03 | 光致抗蚀剂用溶剂以及采用它的狭缝涂敷用光致抗蚀剂组合物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2008070480A (zh) |
KR (1) | KR20080024089A (zh) |
CN (1) | CN101144979B (zh) |
TW (1) | TW200813623A (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5329999B2 (ja) * | 2009-01-29 | 2013-10-30 | AzエレクトロニックマテリアルズIp株式会社 | パターン形成方法 |
JP4911248B2 (ja) * | 2009-09-10 | 2012-04-04 | 東レ株式会社 | 感光性樹脂組成物および感光性樹脂膜の製造方法 |
CN102375339B (zh) | 2010-08-20 | 2013-06-12 | 太阳油墨(苏州)有限公司 | 碱显影型感光性树脂组合物 |
CN102386084B (zh) * | 2010-09-01 | 2014-01-08 | 中芯国际集成电路制造(上海)有限公司 | 平坦化晶圆表面的方法 |
JP2014071373A (ja) * | 2012-09-28 | 2014-04-21 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物 |
KR20190037265A (ko) | 2016-08-03 | 2019-04-05 | 닛산 가가쿠 가부시키가이샤 | 박리층 형성용 조성물 및 박리층 |
KR101910157B1 (ko) * | 2018-08-06 | 2018-10-19 | 영창케미칼 주식회사 | 유무기 하이브리드 포토레지스트 공정액 조성물 |
CN113075862A (zh) * | 2021-03-03 | 2021-07-06 | 长春人造树脂厂股份有限公司 | 抗蚀刻组合物 |
Citations (1)
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CN1577089A (zh) * | 2003-07-16 | 2005-02-09 | 住友化学工业株式会社 | 着色感光性树脂组合物 |
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JP2004051651A (ja) * | 2002-07-16 | 2004-02-19 | Mitsubishi Chemicals Corp | 硬化性樹脂組成物、カラーフィルタ基板、カラーフィルタ基板の製造方法、および液晶表示装置 |
KR100973799B1 (ko) * | 2003-01-03 | 2010-08-03 | 삼성전자주식회사 | Mmn 헤드 코터용 포토레지스트 조성물 |
JP4028434B2 (ja) * | 2003-05-28 | 2007-12-26 | 東京応化工業株式会社 | 感光性組成物のコーティング方法 |
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- 2006-09-12 JP JP2006247223A patent/JP2008070480A/ja active Pending
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2007
- 2007-06-15 TW TW096121732A patent/TW200813623A/zh unknown
- 2007-09-03 CN CN2007101460093A patent/CN101144979B/zh active Active
- 2007-09-11 KR KR1020070092171A patent/KR20080024089A/ko not_active Application Discontinuation
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CN1577089A (zh) * | 2003-07-16 | 2005-02-09 | 住友化学工业株式会社 | 着色感光性树脂组合物 |
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Publication number | Publication date |
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TW200813623A (en) | 2008-03-16 |
KR20080024089A (ko) | 2008-03-17 |
JP2008070480A (ja) | 2008-03-27 |
CN101144979A (zh) | 2008-03-19 |
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