CN101125414A - 内装有光传感器的抛光垫 - Google Patents

内装有光传感器的抛光垫 Download PDF

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Publication number
CN101125414A
CN101125414A CNA2007101423465A CN200710142346A CN101125414A CN 101125414 A CN101125414 A CN 101125414A CN A2007101423465 A CNA2007101423465 A CN A2007101423465A CN 200710142346 A CN200710142346 A CN 200710142346A CN 101125414 A CN101125414 A CN 101125414A
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CN
China
Prior art keywords
polishing pad
light
signal
optical
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101423465A
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English (en)
Chinese (zh)
Inventor
S·H·沃尔夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Strasbaugh Inc
Original Assignee
Strasbaugh Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Strasbaugh Inc filed Critical Strasbaugh Inc
Publication of CN101125414A publication Critical patent/CN101125414A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CNA2007101423465A 2000-06-09 2000-07-03 内装有光传感器的抛光垫 Pending CN101125414A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/590,470 2000-06-09
US09/590,470 US6485354B1 (en) 2000-06-09 2000-06-09 Polishing pad with built-in optical sensor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB008198004A Division CN100340372C (zh) 2000-06-09 2000-07-03 内装有光传感器的抛光垫

Publications (1)

Publication Number Publication Date
CN101125414A true CN101125414A (zh) 2008-02-20

Family

ID=24362394

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA2007101423465A Pending CN101125414A (zh) 2000-06-09 2000-07-03 内装有光传感器的抛光垫
CNB008198004A Expired - Fee Related CN100340372C (zh) 2000-06-09 2000-07-03 内装有光传感器的抛光垫

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB008198004A Expired - Fee Related CN100340372C (zh) 2000-06-09 2000-07-03 内装有光传感器的抛光垫

Country Status (11)

Country Link
US (6) US6485354B1 (enExample)
EP (1) EP1296800B1 (enExample)
JP (1) JP5031170B2 (enExample)
KR (1) KR100766139B1 (enExample)
CN (2) CN101125414A (enExample)
AT (1) ATE297291T1 (enExample)
AU (1) AU2000260706A1 (enExample)
DE (1) DE60020746T2 (enExample)
SG (1) SG133404A1 (enExample)
TW (1) TW553804B (enExample)
WO (1) WO2001096062A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104000462A (zh) * 2013-02-25 2014-08-27 福特环球技术公司 具有无线功率传输的照明地垫
CN108630561A (zh) * 2017-03-15 2018-10-09 北京北方华创微电子装备有限公司 基片表面的检测装置和检测方法、传片腔室

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US6976901B1 (en) * 1999-10-27 2005-12-20 Strasbaugh In situ feature height measurement
US6485354B1 (en) * 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor
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US7074110B1 (en) 2001-11-23 2006-07-11 Stephan H Wolf Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide
US6780085B2 (en) * 2001-11-23 2004-08-24 Stephan H. Wolf Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process
US6878039B2 (en) * 2002-01-28 2005-04-12 Speedfam-Ipec Corporation Polishing pad window for a chemical-mechanical polishing tool
US20030181136A1 (en) * 2002-03-22 2003-09-25 Billett Bruce H. CMP pad platen with viewport
US7040957B2 (en) * 2002-08-14 2006-05-09 Novellus Systems Inc. Platen and manifold for polishing workpieces
CN100561182C (zh) * 2003-10-31 2009-11-18 应用材料公司 使用摩擦传感器的抛光终点检测系统
US7727049B2 (en) * 2003-10-31 2010-06-01 Applied Materials, Inc. Friction sensor for polishing system
JP4764825B2 (ja) * 2003-10-31 2011-09-07 アプライド マテリアルズ インコーポレイテッド 研磨終点検知システム及び摩擦センサを使用する方法
US7235154B2 (en) * 2004-01-08 2007-06-26 Strasbaugh Devices and methods for optical endpoint detection during semiconductor wafer polishing
USD559063S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
US7059936B2 (en) * 2004-03-23 2006-06-13 Cabot Microelectronics Corporation Low surface energy CMP pad
US7091053B2 (en) * 2004-03-26 2006-08-15 Taiwan Semiconductor Manufacturing Company In-line wafer surface mapping
US20050277841A1 (en) * 2004-06-10 2005-12-15 Adnan Shennib Disposable fetal monitor patch
US20060030781A1 (en) * 2004-08-05 2006-02-09 Adnan Shennib Emergency heart sensor patch
US20060030782A1 (en) * 2004-08-05 2006-02-09 Adnan Shennib Heart disease detection patch
WO2006089291A1 (en) * 2005-02-18 2006-08-24 Neopad Technologies Corporation Use of phosphorescent materials for two-dimensional wafer mapping in a chemical mechanical polishing
US7169016B2 (en) * 2005-05-10 2007-01-30 Nikon Corporation Chemical mechanical polishing end point detection apparatus and method
US8688189B2 (en) * 2005-05-17 2014-04-01 Adnan Shennib Programmable ECG sensor patch
US20070255184A1 (en) * 2006-02-10 2007-11-01 Adnan Shennib Disposable labor detection patch
US20070191728A1 (en) * 2006-02-10 2007-08-16 Adnan Shennib Intrapartum monitor patch
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
US7887392B2 (en) * 2007-06-06 2011-02-15 Novellus Systems, Inc. Platen assembly and work piece carrier head employing flexible circuit sensor
TWM347669U (en) * 2008-06-19 2008-12-21 Bestac Advanced Material Co Ltd Polishing pad and polishing device
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
CN102371540B (zh) * 2010-08-19 2013-12-04 中芯国际集成电路制造(上海)有限公司 抛光垫清理器
US20140020829A1 (en) * 2012-07-18 2014-01-23 Applied Materials, Inc. Sensors in Carrier Head of a CMP System
US20140329439A1 (en) * 2013-05-01 2014-11-06 Applied Materials, Inc. Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing
US9347822B2 (en) * 2014-05-07 2016-05-24 Tyco Electronics Corporation Photocell receptacle having variably positionable cap and base
CN104057395B (zh) * 2014-07-17 2016-04-13 成都精密光学工程研究中心 抛光模面形监测装置
US10034109B2 (en) * 2015-04-09 2018-07-24 Audera Acoustics Inc. Acoustic transducer systems with position sensing
US10160089B2 (en) * 2015-10-01 2018-12-25 Ebara Corporation Polishing apparatus
KR102709775B1 (ko) 2018-08-31 2024-09-26 어플라이드 머티어리얼스, 인코포레이티드 용량성 전단 센서를 갖는 연마 시스템

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DE69632490T2 (de) * 1995-03-28 2005-05-12 Applied Materials, Inc., Santa Clara Verfahren und Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104000462A (zh) * 2013-02-25 2014-08-27 福特环球技术公司 具有无线功率传输的照明地垫
CN108630561A (zh) * 2017-03-15 2018-10-09 北京北方华创微电子装备有限公司 基片表面的检测装置和检测方法、传片腔室
CN108630561B (zh) * 2017-03-15 2021-10-15 北京北方华创微电子装备有限公司 基片表面的检测装置和检测方法、传片腔室

Also Published As

Publication number Publication date
CN100340372C (zh) 2007-10-03
US7918712B2 (en) 2011-04-05
US20040229545A1 (en) 2004-11-18
CN1454131A (zh) 2003-11-05
JP5031170B2 (ja) 2012-09-19
WO2001096062A1 (en) 2001-12-20
SG133404A1 (en) 2007-07-30
US7195541B2 (en) 2007-03-27
EP1296800A1 (en) 2003-04-02
US20060217038A1 (en) 2006-09-28
KR20030022142A (ko) 2003-03-15
JP2004503925A (ja) 2004-02-05
ATE297291T1 (de) 2005-06-15
EP1296800B1 (en) 2005-06-08
TW553804B (en) 2003-09-21
US20090061734A1 (en) 2009-03-05
DE60020746T2 (de) 2006-03-16
US6695681B2 (en) 2004-02-24
US7052366B2 (en) 2006-05-30
DE60020746D1 (de) 2005-07-14
US6485354B1 (en) 2002-11-26
KR100766139B1 (ko) 2007-10-10
EP1296800A4 (en) 2003-08-06
US20030109196A1 (en) 2003-06-12
AU2000260706A1 (en) 2001-12-24
US20100144244A1 (en) 2010-06-10

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WD01 Invention patent application deemed withdrawn after publication