TW553804B - Polishing pad with built-in optical sensor - Google Patents

Polishing pad with built-in optical sensor Download PDF

Info

Publication number
TW553804B
TW553804B TW089120611A TW89120611A TW553804B TW 553804 B TW553804 B TW 553804B TW 089120611 A TW089120611 A TW 089120611A TW 89120611 A TW89120611 A TW 89120611A TW 553804 B TW553804 B TW 553804B
Authority
TW
Taiwan
Prior art keywords
patent application
hub
polishing pad
power
polishing
Prior art date
Application number
TW089120611A
Other languages
English (en)
Chinese (zh)
Inventor
Stephan H Wolf
Original Assignee
Strasbaugh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Strasbaugh filed Critical Strasbaugh
Application granted granted Critical
Publication of TW553804B publication Critical patent/TW553804B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW089120611A 2000-06-09 2000-10-04 Polishing pad with built-in optical sensor TW553804B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/590,470 US6485354B1 (en) 2000-06-09 2000-06-09 Polishing pad with built-in optical sensor

Publications (1)

Publication Number Publication Date
TW553804B true TW553804B (en) 2003-09-21

Family

ID=24362394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089120611A TW553804B (en) 2000-06-09 2000-10-04 Polishing pad with built-in optical sensor

Country Status (11)

Country Link
US (6) US6485354B1 (enExample)
EP (1) EP1296800B1 (enExample)
JP (1) JP5031170B2 (enExample)
KR (1) KR100766139B1 (enExample)
CN (2) CN101125414A (enExample)
AT (1) ATE297291T1 (enExample)
AU (1) AU2000260706A1 (enExample)
DE (1) DE60020746T2 (enExample)
SG (1) SG133404A1 (enExample)
TW (1) TW553804B (enExample)
WO (1) WO2001096062A1 (enExample)

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US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6726528B2 (en) * 2002-05-14 2004-04-27 Strasbaugh Polishing pad with optical sensor
US6976901B1 (en) * 1999-10-27 2005-12-20 Strasbaugh In situ feature height measurement
US6485354B1 (en) * 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor
US20020137431A1 (en) * 2001-03-23 2002-09-26 Labunsky Michael A. Methods and apparatus for polishing and planarization
US6780085B2 (en) * 2001-11-23 2004-08-24 Stephan H. Wolf Fiber optical sensor embedded into the polishing pad for in-situ, real-time, monitoring of thin films during the chemical mechanical planarization process
US7074110B1 (en) 2001-11-23 2006-07-11 Stephan H Wolf Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide
US6878039B2 (en) * 2002-01-28 2005-04-12 Speedfam-Ipec Corporation Polishing pad window for a chemical-mechanical polishing tool
US20030181136A1 (en) * 2002-03-22 2003-09-25 Billett Bruce H. CMP pad platen with viewport
US7040957B2 (en) * 2002-08-14 2006-05-09 Novellus Systems Inc. Platen and manifold for polishing workpieces
CN100561182C (zh) * 2003-10-31 2009-11-18 应用材料公司 使用摩擦传感器的抛光终点检测系统
US7513818B2 (en) * 2003-10-31 2009-04-07 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
US7727049B2 (en) 2003-10-31 2010-06-01 Applied Materials, Inc. Friction sensor for polishing system
US7235154B2 (en) * 2004-01-08 2007-06-26 Strasbaugh Devices and methods for optical endpoint detection during semiconductor wafer polishing
USD559063S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
US7059936B2 (en) * 2004-03-23 2006-06-13 Cabot Microelectronics Corporation Low surface energy CMP pad
US7091053B2 (en) * 2004-03-26 2006-08-15 Taiwan Semiconductor Manufacturing Company In-line wafer surface mapping
US20050277841A1 (en) * 2004-06-10 2005-12-15 Adnan Shennib Disposable fetal monitor patch
US20060030782A1 (en) * 2004-08-05 2006-02-09 Adnan Shennib Heart disease detection patch
US20060030781A1 (en) * 2004-08-05 2006-02-09 Adnan Shennib Emergency heart sensor patch
WO2006089291A1 (en) * 2005-02-18 2006-08-24 Neopad Technologies Corporation Use of phosphorescent materials for two-dimensional wafer mapping in a chemical mechanical polishing
US7169016B2 (en) * 2005-05-10 2007-01-30 Nikon Corporation Chemical mechanical polishing end point detection apparatus and method
US8688189B2 (en) * 2005-05-17 2014-04-01 Adnan Shennib Programmable ECG sensor patch
US20070255184A1 (en) * 2006-02-10 2007-11-01 Adnan Shennib Disposable labor detection patch
US20070191728A1 (en) * 2006-02-10 2007-08-16 Adnan Shennib Intrapartum monitor patch
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
US7887392B2 (en) * 2007-06-06 2011-02-15 Novellus Systems, Inc. Platen assembly and work piece carrier head employing flexible circuit sensor
TWM347669U (en) * 2008-06-19 2008-12-21 Bestac Advanced Material Co Ltd Polishing pad and polishing device
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
CN102371540B (zh) * 2010-08-19 2013-12-04 中芯国际集成电路制造(上海)有限公司 抛光垫清理器
US20140020829A1 (en) * 2012-07-18 2014-01-23 Applied Materials, Inc. Sensors in Carrier Head of a CMP System
US9347634B2 (en) * 2013-02-25 2016-05-24 Ford Global Technologies, Llc Illuminating floor mat with wireless power transfer
US20140329439A1 (en) * 2013-05-01 2014-11-06 Applied Materials, Inc. Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing
US9347822B2 (en) * 2014-05-07 2016-05-24 Tyco Electronics Corporation Photocell receptacle having variably positionable cap and base
CN104057395B (zh) * 2014-07-17 2016-04-13 成都精密光学工程研究中心 抛光模面形监测装置
US10034109B2 (en) * 2015-04-09 2018-07-24 Audera Acoustics Inc. Acoustic transducer systems with position sensing
US10160089B2 (en) * 2015-10-01 2018-12-25 Ebara Corporation Polishing apparatus
CN108630561B (zh) * 2017-03-15 2021-10-15 北京北方华创微电子装备有限公司 基片表面的检测装置和检测方法、传片腔室
JP7399155B2 (ja) 2018-08-31 2023-12-15 アプライド マテリアルズ インコーポレイテッド 静電容量式剪断センサを備えた研磨システム

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US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
DE69632490T2 (de) * 1995-03-28 2005-05-12 Applied Materials, Inc., Santa Clara Verfahren und Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
US5838447A (en) 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
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US5913713A (en) 1997-07-31 1999-06-22 International Business Machines Corporation CMP polishing pad backside modifications for advantageous polishing results
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JP3183259B2 (ja) * 1998-06-03 2001-07-09 日本電気株式会社 半導体ウェハ研磨状態モニタリング装置及び研磨終了点検出方法
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US6146242A (en) * 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
US6485354B1 (en) * 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor

Also Published As

Publication number Publication date
CN101125414A (zh) 2008-02-20
EP1296800A4 (en) 2003-08-06
US20060217038A1 (en) 2006-09-28
US20040229545A1 (en) 2004-11-18
WO2001096062A1 (en) 2001-12-20
AU2000260706A1 (en) 2001-12-24
US20090061734A1 (en) 2009-03-05
JP2004503925A (ja) 2004-02-05
JP5031170B2 (ja) 2012-09-19
KR100766139B1 (ko) 2007-10-10
KR20030022142A (ko) 2003-03-15
US20030109196A1 (en) 2003-06-12
CN100340372C (zh) 2007-10-03
ATE297291T1 (de) 2005-06-15
US7195541B2 (en) 2007-03-27
US6485354B1 (en) 2002-11-26
US6695681B2 (en) 2004-02-24
US7052366B2 (en) 2006-05-30
EP1296800A1 (en) 2003-04-02
EP1296800B1 (en) 2005-06-08
CN1454131A (zh) 2003-11-05
US20100144244A1 (en) 2010-06-10
US7918712B2 (en) 2011-04-05
SG133404A1 (en) 2007-07-30
DE60020746T2 (de) 2006-03-16
DE60020746D1 (de) 2005-07-14

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