CN101123835A - 液状体喷出方法、配线衬底、滤色器及有机el发光元件的制法 - Google Patents
液状体喷出方法、配线衬底、滤色器及有机el发光元件的制法 Download PDFInfo
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- CN101123835A CN101123835A CNA2007101408427A CN200710140842A CN101123835A CN 101123835 A CN101123835 A CN 101123835A CN A2007101408427 A CNA2007101408427 A CN A2007101408427A CN 200710140842 A CN200710140842 A CN 200710140842A CN 101123835 A CN101123835 A CN 101123835A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electroluminescent Light Sources (AREA)
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Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006220016 | 2006-08-11 | ||
JP2006-220016 | 2006-08-11 | ||
JP2006220016A JP4305478B2 (ja) | 2006-08-11 | 2006-08-11 | 液状体の吐出方法、配線基板の製造方法、カラーフィルタの製造方法、有機el発光素子の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2009101740394A Division CN101698373B (zh) | 2006-08-11 | 2007-08-10 | 液状体喷出方法、配线衬底、滤色器及有机el发光元件的制法 |
Publications (2)
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CN101123835A true CN101123835A (zh) | 2008-02-13 |
CN101123835B CN101123835B (zh) | 2010-06-23 |
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CN2009101740394A Active CN101698373B (zh) | 2006-08-11 | 2007-08-10 | 液状体喷出方法、配线衬底、滤色器及有机el发光元件的制法 |
CN2007101408427A Active CN101123835B (zh) | 2006-08-11 | 2007-08-10 | 液状体喷出方法、配线衬底、滤色器及有机el发光元件的制法 |
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Application Number | Title | Priority Date | Filing Date |
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CN2009101740394A Active CN101698373B (zh) | 2006-08-11 | 2007-08-10 | 液状体喷出方法、配线衬底、滤色器及有机el发光元件的制法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080286442A1 (zh) |
JP (1) | JP4305478B2 (zh) |
KR (1) | KR100907737B1 (zh) |
CN (2) | CN101698373B (zh) |
TW (2) | TW201029851A (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103257390A (zh) * | 2012-02-15 | 2013-08-21 | 住友化学株式会社 | 导光板及其制造方法、面光源装置和透射式图像显示装置 |
CN103367123A (zh) * | 2013-06-27 | 2013-10-23 | 中国科学院上海微系统与信息技术研究所 | 一种提高稀铋半导体材料热稳定性的方法 |
CN103456621A (zh) * | 2012-05-29 | 2013-12-18 | 富士通半导体股份有限公司 | 半导体器件及其制造方法 |
CN111791591A (zh) * | 2015-08-26 | 2020-10-20 | 东京毅力科创株式会社 | 液滴排出方法以及有机el装置的制造方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009245775A (ja) * | 2008-03-31 | 2009-10-22 | Sumitomo Chemical Co Ltd | 有機エレクトロルミネッセンス素子の製造方法、有機エレクトロルミネッセンス素子および表示装置 |
JP2009274063A (ja) * | 2008-04-18 | 2009-11-26 | Ulvac Japan Ltd | インクの吐出方法 |
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JP4096941B2 (ja) * | 2004-12-10 | 2008-06-04 | セイコーエプソン株式会社 | 電気配線の形成方法、配線基板の製造方法、電気光学素子の製造方法、電子機器の製造方法、配線基板、電気光学素子、および電子機器 |
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2006
- 2006-08-11 JP JP2006220016A patent/JP4305478B2/ja active Active
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- 2007-08-07 US US11/835,190 patent/US20080286442A1/en not_active Abandoned
- 2007-08-08 TW TW099104821A patent/TW201029851A/zh unknown
- 2007-08-08 TW TW096129234A patent/TWI331568B/zh not_active IP Right Cessation
- 2007-08-08 KR KR1020070079312A patent/KR100907737B1/ko active IP Right Grant
- 2007-08-10 CN CN2009101740394A patent/CN101698373B/zh active Active
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CN103257390A (zh) * | 2012-02-15 | 2013-08-21 | 住友化学株式会社 | 导光板及其制造方法、面光源装置和透射式图像显示装置 |
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CN103367123A (zh) * | 2013-06-27 | 2013-10-23 | 中国科学院上海微系统与信息技术研究所 | 一种提高稀铋半导体材料热稳定性的方法 |
CN103367123B (zh) * | 2013-06-27 | 2016-04-20 | 中国科学院上海微系统与信息技术研究所 | 一种提高稀铋半导体材料热稳定性的方法 |
CN111791591A (zh) * | 2015-08-26 | 2020-10-20 | 东京毅力科创株式会社 | 液滴排出方法以及有机el装置的制造方法 |
CN111791591B (zh) * | 2015-08-26 | 2022-09-02 | 东京毅力科创株式会社 | 液滴排出方法以及有机el装置的制造方法 |
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CN101123835B (zh) | 2010-06-23 |
US20080286442A1 (en) | 2008-11-20 |
TW200824915A (en) | 2008-06-16 |
KR100907737B1 (ko) | 2009-07-14 |
CN101698373B (zh) | 2012-07-04 |
TWI331568B (en) | 2010-10-11 |
JP2008043853A (ja) | 2008-02-28 |
JP4305478B2 (ja) | 2009-07-29 |
TW201029851A (en) | 2010-08-16 |
KR20080014626A (ko) | 2008-02-14 |
CN101698373A (zh) | 2010-04-28 |
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