CN101113523A - 蚀刻液喷射装置及蚀刻方法 - Google Patents
蚀刻液喷射装置及蚀刻方法 Download PDFInfo
- Publication number
- CN101113523A CN101113523A CNA2006100618669A CN200610061866A CN101113523A CN 101113523 A CN101113523 A CN 101113523A CN A2006100618669 A CNA2006100618669 A CN A2006100618669A CN 200610061866 A CN200610061866 A CN 200610061866A CN 101113523 A CN101113523 A CN 101113523A
- Authority
- CN
- China
- Prior art keywords
- etching
- jet pipe
- etching solution
- pressure
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006100618669A CN101113523B (zh) | 2006-07-28 | 2006-07-28 | 蚀刻液喷射装置及蚀刻方法 |
US11/614,362 US8377252B2 (en) | 2006-07-28 | 2006-12-21 | Apparatus for spraying etchant onto printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006100618669A CN101113523B (zh) | 2006-07-28 | 2006-07-28 | 蚀刻液喷射装置及蚀刻方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101113523A true CN101113523A (zh) | 2008-01-30 |
CN101113523B CN101113523B (zh) | 2010-10-06 |
Family
ID=39022046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100618669A Expired - Fee Related CN101113523B (zh) | 2006-07-28 | 2006-07-28 | 蚀刻液喷射装置及蚀刻方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8377252B2 (zh) |
CN (1) | CN101113523B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101754583B (zh) * | 2008-12-18 | 2012-03-21 | 北大方正集团有限公司 | 一种消除水池效应的方法及装置 |
CN101962774B (zh) * | 2009-07-24 | 2012-10-17 | 富葵精密组件(深圳)有限公司 | 蚀刻装置及蚀刻方法 |
CN101985752B (zh) * | 2009-07-28 | 2013-01-09 | 富葵精密组件(深圳)有限公司 | 喷蚀装置 |
CN104330907A (zh) * | 2014-10-30 | 2015-02-04 | 深圳市华星光电技术有限公司 | Tft基板喷淋装置及蚀刻系统 |
CN105714296A (zh) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | 蚀刻介质的流量调节装置和蚀刻介质的流量调节方法 |
CN107295752A (zh) * | 2016-04-11 | 2017-10-24 | 嘉联益电子(昆山)有限公司 | 基材蚀刻处理方法 |
CN107993919A (zh) * | 2017-11-21 | 2018-05-04 | 长江存储科技有限责任公司 | 用于晶圆清洗的化学液喷淋管及清洗装置 |
CN110565170A (zh) * | 2019-08-30 | 2019-12-13 | 西安奕斯伟硅片技术有限公司 | 一种蚀刻装置及方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101559470B1 (ko) | 2009-06-04 | 2015-10-12 | 주성엔지니어링(주) | 화학 기상 증착 장치 |
KR101587053B1 (ko) * | 2009-11-23 | 2016-01-21 | 주성엔지니어링(주) | 기판처리장치 |
TW201130401A (en) * | 2009-11-23 | 2011-09-01 | Jusung Eng Co Ltd | Apparatus for processing substrate |
CN102256447B (zh) * | 2010-05-20 | 2013-08-07 | 富葵精密组件(深圳)有限公司 | 蚀刻装置及蚀刻电路板的方法 |
US9966281B2 (en) * | 2013-11-15 | 2018-05-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and systems for chemical mechanical polish cleaning |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3814321A (en) * | 1973-01-10 | 1974-06-04 | Homestead Ind Inc | Liquid heating feedback system |
TW579664B (en) * | 2000-01-11 | 2004-03-11 | Matsushita Electric Ind Co Ltd | Apparatus and method for manufacturing printed circuit board |
-
2006
- 2006-07-28 CN CN2006100618669A patent/CN101113523B/zh not_active Expired - Fee Related
- 2006-12-21 US US11/614,362 patent/US8377252B2/en active Active
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101754583B (zh) * | 2008-12-18 | 2012-03-21 | 北大方正集团有限公司 | 一种消除水池效应的方法及装置 |
CN101962774B (zh) * | 2009-07-24 | 2012-10-17 | 富葵精密组件(深圳)有限公司 | 蚀刻装置及蚀刻方法 |
CN101985752B (zh) * | 2009-07-28 | 2013-01-09 | 富葵精密组件(深圳)有限公司 | 喷蚀装置 |
CN104330907A (zh) * | 2014-10-30 | 2015-02-04 | 深圳市华星光电技术有限公司 | Tft基板喷淋装置及蚀刻系统 |
CN104330907B (zh) * | 2014-10-30 | 2017-06-06 | 深圳市华星光电技术有限公司 | Tft基板喷淋装置及蚀刻系统 |
CN105714296A (zh) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | 蚀刻介质的流量调节装置和蚀刻介质的流量调节方法 |
CN105714296B (zh) * | 2014-12-03 | 2018-06-05 | 北大方正集团有限公司 | 蚀刻介质的流量调节装置和蚀刻介质的流量调节方法 |
CN107295752A (zh) * | 2016-04-11 | 2017-10-24 | 嘉联益电子(昆山)有限公司 | 基材蚀刻处理方法 |
CN107993919A (zh) * | 2017-11-21 | 2018-05-04 | 长江存储科技有限责任公司 | 用于晶圆清洗的化学液喷淋管及清洗装置 |
CN110565170A (zh) * | 2019-08-30 | 2019-12-13 | 西安奕斯伟硅片技术有限公司 | 一种蚀刻装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080035603A1 (en) | 2008-02-14 |
US8377252B2 (en) | 2013-02-19 |
CN101113523B (zh) | 2010-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101006 Termination date: 20130728 |