CN101106887A - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN101106887A
CN101106887A CN200610061647.0A CN200610061647A CN101106887A CN 101106887 A CN101106887 A CN 101106887A CN 200610061647 A CN200610061647 A CN 200610061647A CN 101106887 A CN101106887 A CN 101106887A
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radiator
radiating fin
air intake
base
admirable
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CN200610061647.0A
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CN101106887B (zh
Inventor
赖秀昌
吴弘毅
叶振兴
孙珂
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200610061647.0A priority Critical patent/CN101106887B/zh
Priority to US11/309,588 priority patent/US20080011452A1/en
Publication of CN101106887A publication Critical patent/CN101106887A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热器,包括若干散热鳍片,所述散热器具有一进风端及一出风端,所述每一散热鳍片的上表面自中部分别向靠近所述进风端及出风端的方向呈流线型降低。所述散热器的散热鳍片可增大流经所述散热鳍片的风流,从而更好满足整个系统的散热需求。

Description

散热器
技术领域
本发明涉及一种散热装置,特别涉及一种具较高散热效率的散热器。
背景技术
随着集成电路制造技术日新月异的发展,电子元件朝着更快的运算速度迈进。由于电子元件的运算速度越来越快,其高速运作过程中伴随产生的热量也越来越多。若电子元件产生的热量不被及时导出,将会导致电子元件的温度持续升高,从而影响其运行的稳定性,甚至会烧毁整个电子元件。为此,业界通常在产生热量较多的电子元件如中央处理器的顶面装设一个散热器,再通过系统风扇的协助排出热量。
请共同参照图1及图2,现有技术散热器10包括一个方形底座12及若干从所述底座12顶部向上延伸的方形散热鳍片14。当所述散热器10装设在计算机主板的某一个电子元件上时,所述电子元件即为发热源,所述发热源位于所述底座12底部的中央位置。
在所述散热器10一定距离处设置一个风扇(图未示)协助散热时,所述风扇产生的风流进入所述散热器10的一端为进风端13;风流流出所述散热器10的一端为出风端15。所述风流包括流向所述散热器10的散热鳍片14上部的第一风流110、流向所述散热鳍片14中部的第二风流112及流向所述底座12顶部与所述散热鳍片14底部之间的第三风流114。由于每一散热鳍片14面向所述进风端13的侧面大致垂直于所述风流的流动方向,此时所述第一风流110、第二风流112及第三风流114在流至所述散热器10的每一散热鳍片14时均受阻最大并产生回流,从而使得气流的流动不顺畅,进而增加气流进入所述散热器10的风阻,降低了散热效率。
发明内容
鉴于上述内容,有必要提供一种可提高散热效率的散热器。
本发明提供一种散热器,包括若干散热鳍片,所述散热器具有一进风端及一出风端,所述每一散热鳍片的上表面自中部分别向靠近所述进风端及出风端的方向呈流线型降低。
相较现有技术,所述散热鳍片的上表面自中部分别向靠近所述进风端及出风端的方向呈流线型降低,使得进风风流在流经进风端时与所述每一散热鳍片的相应侧端面不再垂直,故增大了进风端气流的流入量,从而提高了系统整体的散热效率。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为现有技术散热器的立体图。
图2为图1的主视图。
图3为本发明散热器的较佳实施方式的立体图。
图4为图3的主视图。
具体实施方式
请参照图3及图4,本发明散热器20的较佳实施方式包括一个底座22、若干从所述底座22向上延伸的散热鳍片24。在所述散热器20一定距离处设置一个风扇(图未示)协助散热时,所述风扇产生的风流进入所述散热器20的一端为进风端23;风流流出所述散热器20的一端为出风端25。所述每一散热鳍片24的上表面自中部分别向所述进风端23及出风端25的方向呈流线型降低直至与所述底座22的两相对侧边相交。在本较佳实施方式中,所述散热鳍片24的上表面的中部为一凸起的平坦部,所述散热鳍片24的上表面自其平坦部两端的底部分别向所述进风端23及出风端25方向的底座22呈流线型延伸。每一所述散热鳍片24靠近所述进风端23及出风端25处的侧端面均为平滑弧面。需要说明的是,所述每一散热鳍片24的上表面也可呈一中间上凸的平滑弧面;
本发明散热器20的较佳实施方式在使用时固定于一个计算机主板的某一个电子元件(图未示)上,用于给所述电子元件散热。所述电子元件即发热源位于所述底座22底部的中央位置。
所述风扇的风流包括流经所述散热器20的散热鳍片24上部的第一风流210及流经所述散热鳍片24中下部的第二风流212。由于所述散热鳍片24的上表面自中部分别向所述进风端23及出风端25的方向呈流线型降低,且在靠近所述进风端23及出风端25处与所述底座22的两相对侧边相交,故所述风流流向每一散热鳍片24对应于进风端23的侧端面220时,由于在所述进风端23处,所述第一风流210及第二风流21 2与所述侧端面220不再垂直,故所述第一风流210及第二风流212于所述进风端23处的风阻大大降低,从而更好的满足了系统的散热需求,提高了系统的整体散热效率。
本发明散热器的较佳实施方式的所述散热鳍片24的上表面自中部分别向所述进风端23及出风端25的方向呈流线型降低直至与所述底座22于两相对侧边处相交,可降低风阻,提高了整体散热系统的散热效率。

Claims (4)

1.一种散热器,包括若干散热鳍片,所述散热器具有一进风端及一出风端,其特征在于:所述每一散热鳍片的上表面自中部分别向靠近所述进风端及出风端的方向呈流线型降低。
2.如权利要求1所述的散热器,其特征在于:所述散热器还包括一底座,所述散热鳍片自所述底座向上延伸,所述散热鳍片的上表面中部为一凸起的平坦部,所述上表面自其平坦部两端的底部分别向所述进风端及出风端方向的底座呈流线型延伸。
3.如权利要求1所述的散热器,其特征在于:所述散热器还包括一底座,所述散热鳍片自所述底座向上延伸,所述散热鳍片的上表面呈一中间上凸的平滑弧面。
4.如权利要求2或3所述的散热器,其特征在于:所述散热鳍片靠近所述进风端及出风端处的侧端面均为平滑弧面。
CN200610061647.0A 2006-07-14 2006-07-14 散热器 Expired - Fee Related CN101106887B (zh)

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CN200610061647.0A CN101106887B (zh) 2006-07-14 2006-07-14 散热器
US11/309,588 US20080011452A1 (en) 2006-07-14 2006-08-26 Heat sink

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CN101106887B CN101106887B (zh) 2010-09-29

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102413664A (zh) * 2011-07-28 2012-04-11 张文 风冷设计中的低反射气流原则
CN109768018A (zh) * 2019-02-28 2019-05-17 昆山新力精密五金有限公司 倾斜式散热片组

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Publication number Priority date Publication date Assignee Title
CN101155501B (zh) * 2006-09-27 2011-11-09 鸿富锦精密工业(深圳)有限公司 散热器
CN102927494A (zh) * 2011-08-09 2013-02-13 天津津港宇达电子科技有限公司 中华灯灯头
TWI454334B (zh) * 2012-03-16 2014-10-01 Inventec Corp 熱交換器及其製造方法
KR101388845B1 (ko) * 2012-07-10 2014-04-23 삼성전기주식회사 다단 히트 싱크를 구비한 냉각 시스템 및 그 제어방법
TWI710743B (zh) * 2018-03-30 2020-11-21 日商古河電氣工業股份有限公司 散熱器

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US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
US5709263A (en) * 1995-10-19 1998-01-20 Silicon Graphics, Inc. High performance sinusoidal heat sink for heat removal from electronic equipment
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CN2575851Y (zh) * 2002-10-15 2003-09-24 新富国际股份有限公司 具有增加散热面积的散热片
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102413664A (zh) * 2011-07-28 2012-04-11 张文 风冷设计中的低反射气流原则
CN109768018A (zh) * 2019-02-28 2019-05-17 昆山新力精密五金有限公司 倾斜式散热片组

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CN101106887B (zh) 2010-09-29
US20080011452A1 (en) 2008-01-17

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