CN101090994B - 掩模保持机构以及成膜装置 - Google Patents

掩模保持机构以及成膜装置 Download PDF

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Publication number
CN101090994B
CN101090994B CN2006800015782A CN200680001578A CN101090994B CN 101090994 B CN101090994 B CN 101090994B CN 2006800015782 A CN2006800015782 A CN 2006800015782A CN 200680001578 A CN200680001578 A CN 200680001578A CN 101090994 B CN101090994 B CN 101090994B
Authority
CN
China
Prior art keywords
mask
chuck
magnet
mentioned
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800015782A
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English (en)
Chinese (zh)
Other versions
CN101090994A (zh
Inventor
片冈达哉
长尾兼次
齐藤谦一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VIEETECH JAPAN CO Ltd
Original Assignee
Japan Microtop Technology Co ltd
Mitsui Engineering and Shipbuilding Co Ltd
Choshu Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Microtop Technology Co ltd, Mitsui Engineering and Shipbuilding Co Ltd, Choshu Industry Co Ltd filed Critical Japan Microtop Technology Co ltd
Publication of CN101090994A publication Critical patent/CN101090994A/zh
Application granted granted Critical
Publication of CN101090994B publication Critical patent/CN101090994B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN2006800015782A 2005-02-23 2006-02-22 掩模保持机构以及成膜装置 Expired - Fee Related CN101090994B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005047813A JP4609755B2 (ja) 2005-02-23 2005-02-23 マスク保持機構および成膜装置
JP047813/2005 2005-02-23
PCT/JP2006/303189 WO2006090747A1 (ja) 2005-02-23 2006-02-22 マスク保持機構および成膜装置

Publications (2)

Publication Number Publication Date
CN101090994A CN101090994A (zh) 2007-12-19
CN101090994B true CN101090994B (zh) 2010-05-19

Family

ID=36927385

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800015782A Expired - Fee Related CN101090994B (zh) 2005-02-23 2006-02-22 掩模保持机构以及成膜装置

Country Status (5)

Country Link
JP (1) JP4609755B2 (enExample)
KR (1) KR100884029B1 (enExample)
CN (1) CN101090994B (enExample)
TW (1) TW200639592A (enExample)
WO (1) WO2006090747A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5297046B2 (ja) * 2008-01-16 2013-09-25 キヤノントッキ株式会社 成膜装置
JP5192492B2 (ja) * 2008-03-28 2013-05-08 キヤノンアネルバ株式会社 真空処理装置、当該真空処理装置を用いた画像表示装置の製造方法及び当該真空処理装置により製造される電子装置
KR101215632B1 (ko) * 2008-04-09 2012-12-26 가부시키가이샤 알박 증발원 및 성막장치
KR101049804B1 (ko) * 2009-02-19 2011-07-15 삼성모바일디스플레이주식회사 증착 장치용 마스크 밀착 수단 및 이를 이용한 증착 장치
JP2011195907A (ja) * 2010-03-19 2011-10-06 Tokyo Electron Ltd マスク保持装置及び薄膜形成装置
JP2011233510A (ja) * 2010-04-05 2011-11-17 Canon Inc 蒸着装置
CN103201201B (zh) * 2011-02-28 2015-06-03 信越工程株式会社 薄板状工件的粘附保持方法和薄板状工件的粘附保持装置以及制造系统
KR101347546B1 (ko) * 2011-03-14 2014-01-03 엘아이지에이디피 주식회사 기판 척킹장치 및 이를 가지는 박막증착장비
KR102311586B1 (ko) * 2014-12-26 2021-10-12 삼성디스플레이 주식회사 증착 장치 및 증착 장치 내 기판 정렬 방법
KR102373326B1 (ko) * 2014-12-26 2022-03-11 삼성디스플레이 주식회사 증착 장치 및 증착 장치 내 기판 정렬 방법
JP6298110B2 (ja) * 2016-07-08 2018-03-20 キヤノントッキ株式会社 マスク支持体、成膜装置及び成膜方法
CN106399936B (zh) * 2016-12-09 2018-12-21 京东方科技集团股份有限公司 一种蒸镀设备及蒸镀方法
JP6448067B2 (ja) * 2017-05-22 2019-01-09 キヤノントッキ株式会社 基板載置方法、基板載置機構、成膜方法、成膜装置及び電子デバイスの製造方法
JP7202168B2 (ja) * 2018-12-13 2023-01-11 キヤノントッキ株式会社 成膜装置、有機ｅｌパネルの製造システム、及び成膜方法
KR102257008B1 (ko) * 2019-01-11 2021-05-26 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법 및 전자 디바이스 제조방법
KR102829388B1 (ko) * 2020-01-14 2025-07-03 한국알박(주) 트레이용 마그넷 클램프

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1426118A (zh) * 2001-12-10 2003-06-25 高级网络服务公司 制作电致发光显示器的、使用电磁铁的蒸镀装置及采用此装置的蒸镀方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3516346B2 (ja) * 1992-09-08 2004-04-05 大日本印刷株式会社 スパッタ用治具
JP3539125B2 (ja) * 1996-04-18 2004-07-07 東レ株式会社 有機電界発光素子の製造方法
JP3891805B2 (ja) * 2001-08-29 2007-03-14 株式会社Ｈｉｔｚハイテクノロジー 真空蒸着装置
JP2004183044A (ja) * 2002-12-03 2004-07-02 Seiko Epson Corp マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1426118A (zh) * 2001-12-10 2003-06-25 高级网络服务公司 制作电致发光显示器的、使用电磁铁的蒸镀装置及采用此装置的蒸镀方法

Also Published As

Publication number Publication date
JP4609755B2 (ja) 2011-01-12
KR100884029B1 (ko) 2009-02-17
KR20070089856A (ko) 2007-09-03
CN101090994A (zh) 2007-12-19
JP2006233257A (ja) 2006-09-07
WO2006090747A1 (ja) 2006-08-31
TW200639592A (en) 2006-11-16
TWI323291B (enExample) 2010-04-11

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C06 Publication
PB01 Publication
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20071221

Address after: Tokyo, Japan

Applicant after: Mitsui Shipbuilding Corporation

Co-applicant after: VIEETECH JAPAN CO LTD

Address before: Tokyo, Japan

Applicant before: Mitsui Shipbuilding Corporation

Co-applicant before: Weta Technology Corp.

Co-applicant before: VIEETECH JAPAN CO LTD

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100519

Termination date: 20150222

EXPY Termination of patent right or utility model