CN101090989B - 通过沉积低熔点合金制造承载至少一种活性材料的装置的方法 - Google Patents
通过沉积低熔点合金制造承载至少一种活性材料的装置的方法 Download PDFInfo
- Publication number
- CN101090989B CN101090989B CN2005800450854A CN200580045085A CN101090989B CN 101090989 B CN101090989 B CN 101090989B CN 2005800450854 A CN2005800450854 A CN 2005800450854A CN 200580045085 A CN200580045085 A CN 200580045085A CN 101090989 B CN101090989 B CN 101090989B
- Authority
- CN
- China
- Prior art keywords
- alloy
- band
- deposition
- active material
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000011149 active material Substances 0.000 title claims abstract description 19
- 230000008021 deposition Effects 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 229910000743 fusible alloy Inorganic materials 0.000 title abstract 2
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 30
- 239000000956 alloy Substances 0.000 claims description 30
- 230000008018 melting Effects 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 14
- 239000007769 metal material Substances 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 229910000846 In alloy Inorganic materials 0.000 claims 1
- 230000003116 impacting effect Effects 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 16
- 229910052751 metal Inorganic materials 0.000 abstract description 16
- 238000007654 immersion Methods 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910000645 Hg alloy Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- YZASAXHKAQYPEH-UHFFFAOYSA-N indium silver Chemical compound [Ag].[In] YZASAXHKAQYPEH-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- KOTMHBOWRMSVPU-UHFFFAOYSA-N [Ni].[Ag].[In] Chemical compound [Ni].[Ag].[In] KOTMHBOWRMSVPU-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910001261 rose's metal Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
- C23C2/0035—Means for continuously moving substrate through, into or out of the bath
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
- C23C2/0038—Apparatus characterised by the pre-treatment chambers located immediately upstream of the bath or occurring locally before the dipping process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/006—Pattern or selective deposits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
- H01J7/14—Means for obtaining or maintaining the desired pressure within the vessel
- H01J7/18—Means for absorbing or adsorbing gas, e.g. by gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
- H01J7/14—Means for obtaining or maintaining the desired pressure within the vessel
- H01J7/20—Means for producing, introducing, or replenishing gas or vapour during operation of the tube or lamp
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2209/00—Apparatus and processes for manufacture of discharge tubes
- H01J2209/38—Control of maintenance of pressure in the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/24—Means for obtaining or maintaining the desired pressure within the vessel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Coating With Molten Metal (AREA)
- Photovoltaic Devices (AREA)
Abstract
描述了一种通过在金属网(12)或微孔拉伸金属板(12)的带(1″)上连续沉积液态低熔点合金条来制造承载活性材料的装置(21,21″)的方法,其中带的表面已经借助于例如去氧化而预先处理过,并优选地准备好连续切割成具有活性材料的单个部件或者装置(21,21’)。可以通过浸入层状波中,或者通过小液滴喷射或液体分配器浸入恒定的喷流中来实现沉积。
Description
技术领域
本发明涉及用于基于低熔点合金的沉积来制造承载活性材料的装置的方法,尤其是在其侧缘上承载活性材料的装置。
背景技术
现有技术中已知多种应用,这些应用需要在所制造产品内引入具有特定活性的材料,该特定活性是修正所制造产品本身的功能所必要的。这些应用中特别相关的是灯的生产,由此在下面的参考文献中参照在煤气灯中使用的装置,但是应当记住,根据本发明的方法还可有利地用来制造用于不同应用的装置。
在煤气灯厂中,已知需要将各种活性材料引入灯中,例如用来释放汞的化合物、在荧光灯的情形下用于该成分压力控制的汞合金、从灯内气氛中去除可能破坏其功能的不需要的气体的吸气材料、或者散发特定气体如氧气的材料。这些材料的使用以及允许将其引入灯内的装置是许多文献的主题,例如美国专利3,764,842、3,794,402、4,056,750、4,182,971、4,278,908、4,282,455、4,542,319、4,754,193和4,823,047及日本专利申请A-60-193253、A-06-096728和A-06-076796都涉及用来在灯内部引入元素汞或者能够释放该元素的材料;专利US3,525,009、4,461,981和4,855,643涉及在灯中使用的吸气装置;专利US 5,825,127和US 6,043,603以及公开文献EP-A-0359724涉及将释放汞和吸气两个功能彼此组合集成在一起的装置;专利US 5,789,855和US 5,798,618涉及用于控制灯内部汞压力的汞合金;专利US 3,519,864和US 6,169,361涉及用于在灯内部释放氧的装置。
这些专利中描述的装置通常通过如下方法制造:将活性材料引入容器或将其涂覆在支承件的表面上,然后将所述容器或支承件固定到适当的支架上,然后将支架安装在灯内的预定位置中。
但是,这些装置的制造通常相当复杂,需要机械成型小尺寸零件(通常为金属的),再将这些零件以各种方式彼此组装起来。当考虑到现在灯厂中小型化的趋势(这也促使上述装置小型化)时,该问题更加严重。因为在完成的灯中,这些装置都布置在相同的区域内(灯的终端部分或者在管灯的情形下至多两个终端部分),同时必须避免这些装置与电极或其支承件接触,所以该小型化另外还涉及对这些装置的几何形状和尺寸方面更多的控制。这类接触实际上会改变灯的性能。此外,采用通过组装(机械地或者通过焊接)预成型零件来制造装置的生产工艺导致所完成装置的形状和尺寸的可重复性问题。
在生产所述装置中产生的另一个问题(该问题由于小型化而更加严重)是,在某些情况下可能会具有存在损坏半成品风险的极精密加工步骤.例如,在必须制造带有汞合金的装置以控制汞压力的情形下,将汞合金引入(或者附于)最终工件成为复杂的操作,这些操作需要通常具有非平面形状的工件进行机械运动.相反,加工其上已经有汞合金的零件,例如在该零件与其支承件之间进行焊接,可能损坏汞合金本身在所述零件上的粘附.最终,所有这些构造问题导致该装置相对较高的成本,尤其是涉及低售价的灯时,因此常常由于经济原因限制了其应用.
发明内容
本发明的目的是提供一种制造承载活性材料的装置的方法,其中避免了现有技术中上述问题的方法。
所述目的根据本发明利用包括下列步骤的方法实现:准备金属材料带,并沿着所述金属材料带的侧边沉积至少一个形式为熔态低熔点合金的活性材料条,其特征在于所述金属材料带由经过预处理以消除钝化表面层的金属网或有孔金属带材形成。
然后可通过切割所述金属材料带的适当部分来获得所述单个装置,其中所述金属材料带可通过引入平行的横向弱化线的预冲压步骤来为切割事先做好准备。
附图说明
参考附图,从下面通过非限制性实例给出的描述能够更加清楚根据本发明的方法的这些及其它目的、优点和特征,其中:
图1示出了实施根据本发明方法的实例的示意性俯视平面图;
图2示出了根据图1中所示本发明等效方法之一在沉积活性材料层之后根据本发明的方法中使用的带的一段的示意图,从该带通过切割形成某些装置(图中示出了三件)。
具体实施方式
带可以是简单的金属网,或者可选择地为所谓“拉伸式微孔金属板”;此后一产品(在下文中简称为拉伸金属板)可通过以下这样获得,即在金属带材中形成微孔,这些微孔优选在带材上以规则图案排列,然后拉伸带材以使孔加宽。在根据本发明的方法中使用金属网或拉伸金属板允许避免将支承件固定到装置中设有活性材料的部分上的所有步骤,以及在那些需要的装置中包含活性材料的步骤。实际上,形式为处于其熔化状态的低熔点合金的所关注材料由于这些孔的尺寸特征以及孔之间金属带区域的形态而确保了其完美地粘附于有孔基底上,其中由于穿孔步骤,这些区域具有非平面而在相邻的孔之间稍微有些下凹的表面,由此导致形成熔化的材料由于类似于毛细管的现象而沿其上升的优先路径,从而润湿了必须涂覆活性产品的整个表面。
在根据本发明的方法中使用的金属网和拉伸金属板都可从例如意大利米兰的Fratelli Mariani S.p.A公司商业地获得或购买。对于本发明的目的很重要的是,对形成待制造装置基底的网或拉伸金属带材之前进行处理,来去除金属上常有的钝化表面层(主要是氧化层及油污物质),以便允许沉积合金在带本身上的良好粘附。为此,可使用适于去除钝化表面层的机械表面研磨步骤或者酸溶液或腐蚀成分。为此,已知脱氧剂或酸蚀液或粉,其能够侵蚀金属表面上的氧化薄膜和可能存在的油污。
另外很重要的是,基底具有最优尺寸特征以在其有孔结构中以精确和可重复的方式捕获一定量的熔化合金.孔的大小必须足够小,以防止液体合金形成液滴或渗透.已经发现,优选的几何特征(尤其是利用毛细管现象来用合金填充孔和通道)涉及基底的厚度、孔的尺寸以及孔的行和/或列与相邻的行和/或列之间的中心距.与厚度相关的第一值在0.20与0.50mm之间;与形成基底的金属板的带的孔相关的第二尺寸值使得孔的内切圆的直径小于0.45mm;而上述中心距在0.55与1.10mm之间,整个表面的有孔面积与实体材料之间的比在12与25%之间.
参考图1,通过示出经过穿孔的拉伸金属板的带1从卷轴10持续地展开而示意性地表示根据本发明的方法,其中卷轴10在垂直于附图的垂直面内沿箭头F的方向向前运动旋转。带1首先到达用于表面处理的站2,以如前所述通过机械或化学去氧化作用消除钝化表面层,这是使液态合金能够在沿着带1路径的下游由方块3示意性示出的站中发生沉积所必要的,沿着与图1中可见的相反的下缘在下侧缘的预设宽度上沉积有活性产物带1’从站3出来,然后卷绕在右侧的沿箭头F’的方向旋转的卷轴11上。当然,设置有驱动所述卷轴11旋转的装置,卷轴10也可能设有,或者相反不给卷轴10设置驱动其旋转的装置,而是由带自身拉动它旋转。
图2的正视图中更好地示出了带,其中将覆盖有由低熔点合金制成的活性材料的边13与带孔并可能经过表面预处理的基底12区分开,对应于图1的操作块3在熔化状态下涂覆所述低熔点合金。
适用于该目的的低熔点合金有,例如高铟含量的合金,如在以下任一情形下都包含重量至少为80%铟的二元铟银合金或铟锡合金或者三元铟银铜合金或铟银镍合金。具有适合特征的其它材料为铋合金,例如铋镍合金、铋锡合金或者如铋锡铅合金之类的三元合金,这些合金在任一情况下都包含重量至少为50%的铋。
仍参考图2,示意性地示出了随后如何沿着垂直于其纵向延伸的方向切割带1’,以获得所需的单个装置21、21’。为便于切割操作,在表面处理2之前或之后可使带1准备适当的弱化线或冲压线(punching line),沿着弱化线或冲压线可获得各装置的足部22、22’,除了一些可容易消除的切边,各足部比承载活性材料的头部区域13、13’...窄。
处于液体状态的低熔点合金的沉积步骤可以各种方式执行,其中可包括下列步骤:
a)局部浸入层状驻波中,如在某些焊接应用的技术中所知的;
b)局部浸入保持为恒定水平的液体喷射或液体涌流中;
c)从适当的喷嘴喷射小液滴;和
d)从适当的分配器分配液体。
当该过程结束时,沿着带1’的边稳定活性产物条13,通过使带在两边反置的情况下经过表面处理站2和液态合金沉积站3来使带本身经历如图1中的新过程,其中两边反置就是使已经沉积好的条13向上翻转(如图2),从而与条13相对的边可在图1的操作块中经历表面处理(如果在第一次沉积中未完成的话),以便在条13上获得根据前述方法之一的活性产物对称条。这样,带将在其相对的两边上都具有一条沉积的活性材料,从而通过轴向中间切割,能够具有两个对称的带,从这两个带可获得两串单个装置如21、21’...。
在进行上述切割金属带以获得所需单个装置之前,如果去氧化操作留下了残留物,那么可预见进一步的清洗步骤以消除这些残留物。
通过下列实例对本发明进行进一步解释。
实例1
拉伸式镀镍铁板的带的厚度为0.35mm,正方网格孔的各孔内切圆直径为0.28mm,各行孔之间的中心距等于0.71mm,各列孔之间的中心距等于0.85mm,其中镍层的厚度约为1μm,使该带经过表面去氧化处理,然后浸入重量百分比成分为铟94%-银6%的液态合金浴中,从而随后捕获量为110.8±6.0mg/cm2的材料。
实例2
重复实例1的试验,其区别仅在于通过将该带在垂直位置中穿过液态合金的层状波,而不是简单地将边浸入浴中,来用液态合金润湿带,从而实现捕获110.2±3.3mg/cm2的合金,即不定界限值更小。
实例3
重复实例1的试验,使用的拉伸式镀镍铁板的带的厚度为0.40mm,正方网格孔的各孔内切圆直径为0.26mm,各行孔之间的中心距等于0.84mm,各列孔之间的中心距等于0.95mm,其中镍层的厚度约为1μm;所捕获的铟银合金量等于112.8±5.4mg/cm2。
实例4
重复实例3的试验,但是在此情况中采用实例2的润湿方法(将金属带穿过液态合金的层状波)。同样在该实施例中也可获得更高的重复性,捕获量为110.8±3.5mg/cm2。
这些实例显示了本发明的方法能够制造具有所需材料的沉积物且不会形成任何液滴或异常材料沉积的金属网或微孔带,其特征在于高度可重复的材料沉积量,尤其是当使用将网或带穿过液态材料层状波的润湿方法时。
Claims (10)
1.一种用于大量制造承载至少一种活性材料的装置(21,21’)的方法,包括准备金属材料带(1)、以及沿着所述带的侧边沉积至少一个形式为熔态低熔点合金的活性材料条(13)的步骤,其特征在于,所述带(1)由经过预处理以消除钝化表面层的金属网或有孔金属带形成。
2.如权利要求1所述的方法,其特征在于,所述金属材料带的厚度在0.20与0.50mm之间;孔的尺寸使得其中的内切圆直径小于0.45mm;并且孔的相邻行或列之间的中心距在0.55与1.10mm之间。
3.如权利要求1所述的方法,其中使所述金属材料带的至少所述侧边在去氧化浴中连续地经过预处理,然后浸入低熔点液态合金的浴(3)中。
4.如权利要求1所述的方法,其中所述低熔点合金为包括重量至少80%的铟的二元或三元铟合金。
5.如权利要求1所述的方法,其中所述低熔点合金为包括重量至少50%的铋的二元或三元铋合金。
6.如权利要求3所述的方法,其中所述低熔点合金的沉积通过将所述带(1)的下边局部浸入、垂直保持在处于液态的所述合金的层状波中来实现。
7.如权利要求3所述的方法,其中所述低熔点合金的沉积通过将所述带(1)的下边保持在垂直位置并由处于液态的所述合金的涌流或喷射以恒定水平击打所述带来实现。
8.如权利要求1所述的方法,其中,在沉积之后,沿着与其纵向延伸垂直的平行线切割所述带(1’),以获得承载活性材料的所述单个装置(21,21’)。
9.如权利要求8所述的方法,其中通过沿着横向线冲压来准备用于所述切割操作的所述带(1’)。
10.如权利要求8所述的方法,其中,在所述沉积步骤之后且在所述切割操作之前,所述带(1’)经过清洗步骤,以去除去氧化步骤的残留物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2004A002516 | 2004-12-27 | ||
IT002516A ITMI20042516A1 (it) | 2004-12-27 | 2004-12-27 | Processo per produrre mediante deposizione di lega bassofondente dispositivi portanti almeno un materiale attivo |
PCT/IT2005/000744 WO2006070426A2 (en) | 2004-12-27 | 2005-12-20 | Process for manufacturing devices carrying at least one active material by deposition of a low-melting alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101090989A CN101090989A (zh) | 2007-12-19 |
CN101090989B true CN101090989B (zh) | 2010-05-12 |
Family
ID=36579646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800450854A Active CN101090989B (zh) | 2004-12-27 | 2005-12-20 | 通过沉积低熔点合金制造承载至少一种活性材料的装置的方法 |
Country Status (17)
Country | Link |
---|---|
US (1) | US8071172B2 (zh) |
EP (1) | EP1834006B1 (zh) |
JP (1) | JP4988594B2 (zh) |
KR (1) | KR20070100767A (zh) |
CN (1) | CN101090989B (zh) |
AR (1) | AR051868A1 (zh) |
AT (1) | ATE508213T1 (zh) |
BR (1) | BRPI0519499A2 (zh) |
CA (1) | CA2590987A1 (zh) |
DE (1) | DE602005027902D1 (zh) |
IL (1) | IL183866A0 (zh) |
IT (1) | ITMI20042516A1 (zh) |
MX (1) | MX2007007875A (zh) |
MY (1) | MY139734A (zh) |
RU (1) | RU2395617C2 (zh) |
TW (1) | TW200639272A (zh) |
WO (1) | WO2006070426A2 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1399507B1 (it) | 2010-04-21 | 2013-04-19 | Getters Spa | Lampada a scarica migliorata |
RU2521187C2 (ru) * | 2012-10-25 | 2014-06-27 | ООО "Биметалл Плюс" | Устройство для диффузионной металлизации в среде легкоплавких жидкометаллических растворов |
US10356478B2 (en) * | 2015-01-08 | 2019-07-16 | The Directv Group, Inc. | Systems and methods for spotted advertising and control of corresponding user interfaces and transactions via user receiving devices and mobile devices |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3733194A (en) * | 1969-10-20 | 1973-05-15 | Getters Spa | Mercury generation |
US4529628A (en) * | 1979-07-31 | 1985-07-16 | Battelle Memorial Institute | Method for the continuous coating of at least one portion of at least one of the faces of a metallic substrate |
US5077094A (en) * | 1989-12-11 | 1991-12-31 | Battelle Development Corp. | Process for applying a metal coating to a metal strip by preheating the strip in a non-oxidizing atmosphere, passing the strip through a melt pool of the metal coating material, and rapidly cooling the back surface of the strip |
US5712048A (en) * | 1995-03-30 | 1998-01-27 | Wieland-Werke Ag | Partially hot-tin-plated strip and a method and apparatus for its manufacture |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3519864A (en) * | 1966-12-29 | 1970-07-07 | Sylvania Electric Prod | High pressure electric discharge device with barium peroxide getter and getter mounting structure |
US3525009A (en) * | 1968-02-05 | 1970-08-18 | Tokyo Shibaura Electric Co | Low pressure mercury vapour discharge lamp including an alloy type getter coating |
NL162244C (nl) * | 1970-12-25 | 1980-04-15 | Philips Nv | Lagedrukkwikdampontladingslamp. |
NL158652B (nl) * | 1969-06-27 | 1978-11-15 | Philips Nv | Werkwijze voor de vervaardiging van een lagedrukkwikdampontladingslamp. |
JPS5530066B2 (zh) * | 1973-11-14 | 1980-08-08 | ||
US4056750A (en) * | 1976-12-17 | 1977-11-01 | Gte Sylvania Incorporated | Mercury dispenser for discharge lamps |
GB1575890A (en) * | 1978-03-31 | 1980-10-01 | Thorn Electrical Ind Ltd | Heating of dosing capsule |
US4182971A (en) * | 1978-07-10 | 1980-01-08 | Gte Sylvania Incorporated | Mercury-containing glass-capsule dispenser for discharge lamps |
US4282455A (en) * | 1979-11-07 | 1981-08-04 | Gte Products Corporation | Mercury dispenser for arc discharge lamps |
JPH0354430B2 (zh) * | 1980-10-22 | 1991-08-20 | ||
US4461981A (en) * | 1981-12-26 | 1984-07-24 | Mitsubishi Denki Kabushiki Kaisha | Low pressure inert gas discharge device |
US4855643A (en) * | 1983-03-10 | 1989-08-08 | Gte Products Corporation | Unsaturated vapor pressure type high pressure sodium lamp |
JPS60193253A (ja) | 1984-03-14 | 1985-10-01 | Toshiba Corp | 低圧水銀蒸気放電灯 |
US4754193A (en) * | 1985-11-08 | 1988-06-28 | Gte Products Corporation | Mercury dispenser for arc discharge lamps |
FR2607967B1 (fr) * | 1986-12-04 | 1989-02-03 | Accumulateurs Fixes | Procede de fabrication d'electrodes plastifiees pour accumulateurs |
CA1288473C (fr) * | 1987-03-11 | 1991-09-03 | Andre Belanger | Electrode mince supportee sur feuillard conducteur electronique et procede de fabrication |
US4823047A (en) * | 1987-10-08 | 1989-04-18 | Gte Products Corporation | Mercury dispenser for arc discharge lamps |
JPH01197959A (ja) * | 1988-02-02 | 1989-08-09 | Toshiba Corp | 低圧水銀蒸気放電灯用アマルガムおよびこのアマルガムを用いた低圧水銀蒸気放電灯 |
IT1227338B (it) | 1988-09-12 | 1991-04-08 | Getters Spa | Nastro getter atto ad emettere vapori di mercurio, utilizzabile nella formazione di catodi freddi per lampade fluorescenti. |
JP3294313B2 (ja) * | 1992-04-24 | 2002-06-24 | コーア株式会社 | 金属板の孔内面へのはんだメッキ方法 |
JP3205075B2 (ja) | 1992-07-27 | 2001-09-04 | 東芝ライテック株式会社 | 低圧水銀蒸気放電灯 |
JPH0676796A (ja) | 1992-08-31 | 1994-03-18 | Hitachi Ltd | 低圧放電灯 |
US5598069A (en) * | 1993-09-30 | 1997-01-28 | Diablo Research Corporation | Amalgam system for electrodeless discharge lamp |
JPH07169890A (ja) * | 1993-12-15 | 1995-07-04 | Hitachi Cable Ltd | 半導体装置用リードフレームおよびその製造方法 |
JPH08264154A (ja) * | 1995-03-24 | 1996-10-11 | Toshiba Lighting & Technol Corp | 低圧水銀蒸気放電ランプおよび照明装置 |
DE19521972A1 (de) * | 1995-06-16 | 1996-12-19 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Verfahren zur Herstellung eines Kappenbandes für Entladungslampen |
GB9521373D0 (en) * | 1995-10-18 | 1995-12-20 | Gen Electric | Electrodeless fluorescent lamp |
IT1277239B1 (it) | 1995-11-23 | 1997-11-05 | Getters Spa | Dispositivo per l'emissione di mercurio,l'assorbimento di gas reattivi e la schermatura dell'elettrodo all'interno di lampade |
DE29616879U1 (de) * | 1996-09-30 | 1998-01-29 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Niederdruckentladungslampe |
IT1285988B1 (it) * | 1996-11-22 | 1998-06-26 | Getters Spa | Dispensatore di ossigeno per lampade a scarica ad alta pressione |
US6626439B1 (en) * | 1997-08-29 | 2003-09-30 | Interface Solutions, Inc. | Edge coated gaskets and method of making same |
JP3925591B2 (ja) * | 1997-10-31 | 2007-06-06 | 東芝ライテック株式会社 | 放電ランプ、放電ランプ装置、蛍光ランプおよび蛍光ランプ装置 |
US6080173A (en) * | 1999-05-26 | 2000-06-27 | Idx Medical Ltd. | Tissue punching instrument |
JP3878057B2 (ja) * | 2002-05-23 | 2007-02-07 | 冨士電子工業株式会社 | ストライプめっき条及びストライプめっき方法 |
-
2004
- 2004-12-27 IT IT002516A patent/ITMI20042516A1/it unknown
-
2005
- 2005-12-15 TW TW094144541A patent/TW200639272A/zh unknown
- 2005-12-20 AT AT05823860T patent/ATE508213T1/de not_active IP Right Cessation
- 2005-12-20 CN CN2005800450854A patent/CN101090989B/zh active Active
- 2005-12-20 KR KR1020077017274A patent/KR20070100767A/ko not_active Application Discontinuation
- 2005-12-20 WO PCT/IT2005/000744 patent/WO2006070426A2/en active Application Filing
- 2005-12-20 BR BRPI0519499-7A patent/BRPI0519499A2/pt not_active IP Right Cessation
- 2005-12-20 EP EP05823860A patent/EP1834006B1/en active Active
- 2005-12-20 DE DE602005027902T patent/DE602005027902D1/de active Active
- 2005-12-20 US US11/721,046 patent/US8071172B2/en not_active Expired - Fee Related
- 2005-12-20 RU RU2007128769/02A patent/RU2395617C2/ru not_active IP Right Cessation
- 2005-12-20 MX MX2007007875A patent/MX2007007875A/es active IP Right Grant
- 2005-12-20 JP JP2007547800A patent/JP4988594B2/ja not_active Expired - Fee Related
- 2005-12-20 CA CA002590987A patent/CA2590987A1/en not_active Abandoned
- 2005-12-23 MY MYPI20056193A patent/MY139734A/en unknown
- 2005-12-26 AR ARP050105529A patent/AR051868A1/es unknown
-
2007
- 2007-06-12 IL IL183866A patent/IL183866A0/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3733194A (en) * | 1969-10-20 | 1973-05-15 | Getters Spa | Mercury generation |
US4529628A (en) * | 1979-07-31 | 1985-07-16 | Battelle Memorial Institute | Method for the continuous coating of at least one portion of at least one of the faces of a metallic substrate |
US5077094A (en) * | 1989-12-11 | 1991-12-31 | Battelle Development Corp. | Process for applying a metal coating to a metal strip by preheating the strip in a non-oxidizing atmosphere, passing the strip through a melt pool of the metal coating material, and rapidly cooling the back surface of the strip |
US5712048A (en) * | 1995-03-30 | 1998-01-27 | Wieland-Werke Ag | Partially hot-tin-plated strip and a method and apparatus for its manufacture |
Also Published As
Publication number | Publication date |
---|---|
WO2006070426A3 (en) | 2007-06-07 |
WO2006070426A2 (en) | 2006-07-06 |
JP4988594B2 (ja) | 2012-08-01 |
WO2006070426A8 (en) | 2007-08-02 |
CA2590987A1 (en) | 2006-07-06 |
ITMI20042516A1 (it) | 2005-03-27 |
CN101090989A (zh) | 2007-12-19 |
IL183866A0 (en) | 2007-10-31 |
AR051868A1 (es) | 2007-02-14 |
EP1834006B1 (en) | 2011-05-04 |
US20090022892A1 (en) | 2009-01-22 |
MX2007007875A (es) | 2007-07-13 |
DE602005027902D1 (de) | 2011-06-16 |
RU2395617C2 (ru) | 2010-07-27 |
BRPI0519499A2 (pt) | 2009-02-03 |
RU2007128769A (ru) | 2009-02-10 |
MY139734A (en) | 2009-10-30 |
KR20070100767A (ko) | 2007-10-11 |
TW200639272A (en) | 2006-11-16 |
EP1834006A2 (en) | 2007-09-19 |
US8071172B2 (en) | 2011-12-06 |
JP2008527163A (ja) | 2008-07-24 |
ATE508213T1 (de) | 2011-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2235991C (en) | Method and apparatus for dispensing small amounts of liquid material | |
US5747102A (en) | Method and apparatus for dispensing small amounts of liquid material | |
KR102551975B1 (ko) | 다수의 나노와이어들을 제공하기 위한 시스템 및 방법 | |
CN101090989B (zh) | 通过沉积低熔点合金制造承载至少一种活性材料的装置的方法 | |
US5268331A (en) | Stabilizer/spacer for semiconductor device lead frames | |
JP3353814B2 (ja) | 配量される溶融はんだの液滴を安定性強化する装置及びその方法 | |
CN101479405A (zh) | 无电解镀Ni-P的方法和电子部件用基板 | |
JP4858826B2 (ja) | 金属材料製造方法及び装置 | |
WO1996008337A1 (de) | Verfahren zur belotung von anschlussflächen, sowie verfahren zur herstellung einer lotlegierung | |
JP3621089B1 (ja) | はんだ領域形成装置および方法、ならびに連続めっき装置 | |
EP1640108A1 (de) | Kontaktherstellungsverfahren | |
JP3626170B1 (ja) | はんだ上がり防止帯の形成装置および形成方法、ならびにコネクター部材 | |
EP3538314B1 (de) | Verfahren zum erzeugen einer strukturierten keimschicht unter verwendung eines laserstrahles ; entsprechende vorrichtung | |
EP3511108B1 (de) | Verfahren zur herstellung eines lotmittels | |
JP2008023584A (ja) | ロウ材付加工品の製造方法及び装置 | |
DE202023100049U1 (de) | Vakuumvorrichtung und Vakuumvorrichtung-Komponente | |
AT410449B (de) | Verfahren zur herstellung von lötfähigen aluminium-fliesspressteilen | |
WO2004094111A1 (de) | Verfahren zur herstellung eines abrasiven werkzeugs | |
JP2562744B2 (ja) | 半田付装置 | |
WO2011127907A2 (de) | Verfahren und vorrichtung zur ausbildung von lotdepots | |
WO2019175204A1 (de) | Verfahren zur herstellung eines leiterbahnabschnitts eines anschlussträgers, derartig hergestellter leiterbahnabschnitt, verfahren zur herstellung eines anschlussträgers, derartig hergestellter anschlussträger und optoelektronisches halbleiterbauteil | |
US20040028891A1 (en) | Porous media and method of manufacturing same | |
JPS63448A (ja) | 金属帯の表面処理におけるガスワイピングノズル | |
DE4436071A1 (de) | Verfahren zum Vergolden von bandförmigem Halbzeug, insbesondere für Leadframes | |
WO2004013369A1 (en) | Porous media and method of manufacturing same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |