CN101075635A - 图像显示系统 - Google Patents

图像显示系统 Download PDF

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CN101075635A
CN101075635A CNA2007100980851A CN200710098085A CN101075635A CN 101075635 A CN101075635 A CN 101075635A CN A2007100980851 A CNA2007100980851 A CN A2007100980851A CN 200710098085 A CN200710098085 A CN 200710098085A CN 101075635 A CN101075635 A CN 101075635A
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CN101075635B (zh
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詹川逸
曾章和
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Chi Mei Optoelectronics Corp
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Abstract

本发明提供一种图像显示系统,包括:有源矩阵式电激发光元件,包括:像素区,包括多个次像素,且每一个次像素包括:开关区以及驱动区;开关薄膜晶体管,置于该开关区,且包括第一硅层,其中该第一硅层具有第一厚度;以及驱动薄膜晶体管,置于该驱动区,且包括第二硅层,其中该第二硅层具有第二厚度;其中,该第一厚度与该第二厚度的差异至少超过10%。本发明亦提供上述图像显示系统的制造方法。

Description

图像显示系统
技术领域
本发明关于一种电激发光元件及其制造方法,特别是关于一种具有不同沟道厚度的有源矩阵式有机电激发光元件及其制造方法。
背景技术
近年来,随着电子产品(例如,行动电话、个人数字助理、笔记型电脑)的发展及广泛应用,对于低耗能及更轻薄的平面显示元件的需求日益加增。有机电激发光元件由于具有自发光、高亮度、更广的视角、更快的应答速度、及工艺简单的优点,因此成为显示科技产业中的绝佳选择。
有机电激发光元件采用一有机电激发光层,使得其本身在显示科技产业中相较于其它显示器而言具有更高的发光效率及更长的寿命。有源矩阵式有机电激发光元件具有面发光且自发光的功能,并具有轻薄特性、以及高发光效率、低驱动电压、广视角、高对比、高应答速度、可挠曲、与全彩化的优点。所以,随着使用者对于更大尺寸与更高解析度的显示器的需求日益提高,有源矩阵式有机电激发光元件正好符合主流市场的趋势。
就传统电激发光元件工艺而言,基于简化工艺的考量,通常会形成单一厚度的半导体层。也就是说,在同一个次像素区域内,面板周边驱动电路、薄膜晶体管、与储存电容器的半导体层会同时形成至一所欲的厚度。例如,美国专利案第6,337,232号揭示一种具有薄沟道区的结晶硅薄膜半导体。在所揭露的电激发光元件中,形成一包含硅的半导体膜。在半导体膜的结晶工艺后,进行结晶化半导体膜的图案化工艺,而同时形成一标记(marker)部分与一孤立的(insular)部分。尤其是,一部分欲作为沟道形成区域的半导体膜被薄化至300埃或更小的厚度。
传统电激发光元件遭遇到所谓“显示不均(mura)”的问题,而这个问题是由于次像素之间的驱动晶体管具有不同场效迁移率所引起的。因此,业界亟需一种可以解决上述问题的电激发光元件。
发明内容
有鉴于上述问题,本发明一优选实施例提供一种图像显示系统,包括:有源矩阵式电激发光元件,包括:像素区,包括多个次像素,且每一个次像素包括:开关区以及驱动区;开关薄膜晶体管,置于该开关区,且包括第一硅层,其中该第一硅层具有第一厚度;以及驱动薄膜晶体管,置于该驱动区,且包括第二硅层,其中该第二硅层具有第二厚度;其中,该第一厚度与该第二厚度的差异至少超过10%。在其它实施例中,该第一厚度与该第二厚度的差异可以介于10%与200%之间、10%与150%之间、10%与100%之间、10%与70%之间、或10%与40%之间。
本发明其它优选实施例的系统还包括电子元件,其中该电子元件包括:显示面板;以及耦接至该显示面板的输入单元,且该输入单元用以提供一输入信号至该显示面板,因而该显示面板显示图像。该电子元件可以是行动电话、数码相机、个人数字助理、笔记型电脑、桌上型电脑、电视、车上显示器或可携式数位多功能光碟播放机。
由于在同一个次像素中开关薄膜晶体管的沟道与驱动薄膜晶体管的沟道具有厚度差的缘故,因此薄膜晶体管的场效迁移率(field-effect mobility)得以调整。尤其是,当驱动薄膜晶体管形成一较开关薄膜晶体管厚的沟道时,则可以降低驱动薄膜晶体管的场效迁移率。因此,驱动薄膜晶体管会具有较好的驱动电流分布,而且有机电激发光二极管可以均一地发光。而且,依据不同的电性考量,显示面板的周边驱动电路可以采用各种多晶硅厚度。
附图说明
图1是绘示有源矩阵式有机电激发光元件中一个次像素的等效电路图;
图2a~2g是绘示本发明一优选实施例中包含有源矩阵式有机电激发光元件的图像显示系统的制造方法的剖面图;
图3a~3g是绘示本发明一优选实施例中包含有源矩阵式有机电激发光元件的图像显示系统的制造方法的剖面图;
图4a~4h是绘示本发明一优选实施例中包含有源矩阵式有机电激发光元件的图像显示系统的制造方法的剖面图;
图5绘示本发明一优选实施例中用于显示图像的系统。
主要元件符号说明
I~开关区;II~驱动区;100~次像素;102~开关薄膜晶体管;104~驱动薄膜晶体管;106~有机发光二极管;108~数据线;110~扫描线;112~储存电容;200~基板;202~缓冲层;204~非晶硅层;204a~图案化非晶硅层;204b~突出部;204c、204d~多晶硅层;206~准分子激光退火工艺;204c~多晶硅层;204d~多晶硅层;208~栅极绝缘层;210、212~栅极;214~层间介电层;216、218~导线;220~保护层;222~透明电极;300~基板;302~缓冲层;304~非晶硅层;304a~非晶硅层;304b~非晶硅层突出部;304c~图案化非晶硅层;304d~图案化非晶硅层;306~准分子激光退火工艺;308~栅极介电层;310~栅极;312~栅极;314~层间介电层;316、318~导线;320~保护层;322~透明电极;400~基板;402~缓冲层;404~非晶硅层;404a~图案化多晶硅层;406~非晶硅层;406’~多晶硅层;406a~多晶硅层突出部;406b~多晶硅层;408~准分子激光退火工艺;410~栅极绝缘层;412、414~栅极;416~层间介电层;418、420~导线;424~保护层;426~透明电极;500~电子元件;510~有机电激发光元件;520~显示面板;530~控制器;540~平面面板元件;550~输入元件;2000~有机电激发光元件;3000~有机电激发光元件;4000~有机电激发光元件;204b’~结晶化突出部;304c’~多晶硅层;304d’~多晶硅层。
具体实施方式
图1绘示一有源矩阵式有机电激发光元件中一个次像素的等效电路图。值得注意的是,在说明书内所指的每一个“次像素”包括一个开关薄膜晶体管(switching thin film transistor)区域I与驱动薄膜晶体管(driving thin fillmtransistor)区域II。其中,开关薄膜晶体管区域I上形成有开关薄膜晶体管;驱动薄膜晶体管区域II上形成有驱动薄膜晶体管。
如图1所示,在一包括多个次像素的像素区域(未显示)内,一次像素100包含开关薄膜晶体管102、驱动薄膜晶体管104、有机发光二极管106、数据线108、扫描线110以及储存电容112。有机发光二极管106还包含阳极电极、电激发光层与阴极(未显示)。
第一实施例
图2a~2g绘示本发明一优选实施例中包含有源矩阵式有机电激发光元件的图像显示系统的制造方法的剖面图。
如图2a所示,提供一上方具有缓冲层202的基板200。基板200例如是石英基板、玻璃基板或塑胶基板。基板200区分为开关区I与驱动区II。
如图2b所示,在缓冲层202上形成一非晶硅层204。
如图2c所示,藉由一光刻工艺(图未显示)而于驱动区II形成一图案化非晶硅层204a。此图案化非晶硅层204a包含一位于驱动区II的突出部204b。
如图2d所示,对图案化非晶硅层204a进行一准分子激光退火工艺206,使图案化非晶硅层204a结晶化。由于厚度的差异,因此经过同样激光能量密度的处理,结晶化突出部204b’的晶粒尺寸小于经结晶化的图案化非晶硅层204a’(也就是多晶硅层204a’)的晶粒尺寸。在其它实施例中,也可以使用其它结晶化处理,例如是固相结晶化(solid phase crystallization,SPC)或金属诱发侧向结晶化(metal-induced lateral crystallization,MILC)。
如图2e所示,藉由一光刻工艺(图未显示)而同时形成位于开关区I的多晶硅层204d与位于驱动区II的多晶硅层204c。尤其是,多晶硅层204c的厚度大于多晶硅层204d的厚度。而且,多晶硅层204c与多晶硅层204d的厚度差超过10%。在其它实施例中,多晶硅层204c与多晶硅层204d的厚度差介于至10%与200%之间、10%与150%之间、10%与100%之间、10%与70%之间、或10%与40%之间。
如图2f所示,顺应性地沉积一栅极绝缘层208于多晶硅层204c与多晶硅层204d以及缓冲层202上。
如图2g所示,进行后续习知工艺以制得一有源矩阵式有机电激发光元件2000。此有源矩阵式有机电激发光元件4000包括一位于开关区I的开关薄膜晶体管、一位于驱动区II的驱动薄膜晶体管、一介电层214、一保护层220、一阳极222、以及其它元件(图未显示)。其中,开关薄膜晶体管包括多晶硅层204d、栅极绝缘层208、栅极210、介电层214、以及源/漏电极216;而驱动薄膜晶体管包括多晶硅层204c、栅极绝缘层208、栅极212、介电层214、以及源/漏电极218。
第二实施例
图3a~3g是绘示本发明一优选实施例中包含有源矩阵式有机电激发光元件的图像显示系统的制造方法的剖面图。
如图3a所示,提供一上方具有缓冲层302的基板300。基板300例如是石英基板、玻璃基板或塑胶基板。基板300区分为开关区I与驱动区II。
如图3b所示,在缓冲层302上形成一非晶硅层304。
如图3c所示,藉由一第一光刻工艺(图未显示)而于驱动区II形成一图案化非晶硅层304a。此图案化非晶硅层304a包含一位于驱动区II的突出部304b。
如图3d所示,藉由一第二光刻工艺(图未显示)而同时形成位于开关区I的非晶硅层304d与位于驱动区II的非晶硅层304c。尤其是,非晶硅层304c的厚度大于非晶硅层304d的厚度。而且,非晶硅层304c与非晶硅层304d的厚度差超过10%。在其它实施例中,非晶硅层304c与非晶硅层304d的厚度差介于至10%与200%之间、10%与150%之间、10%与100%之间、10%与70%之间、或10%与40%之间。
如图3e所示,对非晶硅层304c与非晶硅层304d进行一准分子激光退火工艺306,使非晶硅层304c与非晶硅层304d结晶化。由于厚度的差异,因此经过同样激光能量密度的处理后,多晶硅层304c’(也就是结晶化非晶硅层304c’)的晶粒尺寸小于多晶硅层304d’(也就是结晶化非晶硅层304d’)的晶粒尺寸。在其它实实施例中,也可以使用其它结晶化处理,例如是固相结晶化(solid phase crystallization,SPC)或金属诱发侧向结晶化(metal-inducedlateral crystallization,MILC)。
如图3f所示,顺应性地沉积一栅极绝缘层308于多晶硅层304c与多晶硅层304d以及缓冲层302上。
如图3g所示,进行后续习知工艺以制得一有源矩阵式有机电激发光元件3000。此有源矩阵式有机电激发光元件3000包括一位于开关区I的开关薄膜晶体管、一位于驱动区II的驱动薄膜晶体管、一介电层314、一保护层320、一阳极322、以及其它元件(图未显示)。其中,开关薄膜晶体管包括多晶硅层304d、栅极绝缘层308、栅极310、介电层314、以及源/漏电极316;而驱动薄膜晶体管包括多晶硅层304c、栅极绝缘层308、栅极312、介电层314、以及源/漏电极318。
第三实施例
图4a~4h是绘示本发明一优选实施例中包含有源矩阵式有机电激发光元件的图像显示系统的制造方法的剖面图。
如图4a所示,提供一上方具有缓冲层402的基板400。基板400例如是石英基板、玻璃基板或塑胶基板。基板400区分为开关区I与驱动区II。
如图4b所示,在缓冲层402上形成一非晶硅层404。
如图4c所示,藉由一第一光刻工艺(图未显示)而于驱动区II形成一图案化非晶硅层404a。
如图4d所示,于缓冲层402与非晶硅层404a上顺应性地沉积另一非晶硅层406。
如图4e所示,对非晶硅层406与下方的非晶硅层404a进行一准分子激光退火工艺408,使非晶硅层406与下方的非晶硅层404a结晶化,并转化为一包含突出部406a的多晶硅层406’。由于厚度的差异,因此经过同样激光能量密度的处理后,突出部406a的晶粒尺寸小于多晶硅层406’其它部分的晶粒尺寸。在其它实施例中,也可以使用其它结晶化处理,例如是固相结晶化(solid phase crystallization,SPC)或金属诱发侧向结晶化(metal-inducedlateral crystallization,MILC)。
如图4f所示,藉由一光刻工艺(图未显示)而同时形成位于开关区I的多晶硅层406b与位于驱动区II的多晶硅层406a。尤其是,多晶硅层406a的厚度大于多晶硅层406b的厚度。而且,多晶硅层406a与多晶硅层406b的厚度差超过10%。在其它实施例中,多晶硅层406a与多晶硅层406b的厚度差介于至10%与200%之间、10%与150%之间、10%与100%之间、10%与70%之间、或10%与40%之间。
如图4g所示,顺应性地沉积一栅极绝缘层410于多晶硅层406a与多晶硅层406b以及缓冲层402上。
如图4h所示,进行后续习知工艺以制得一有源矩阵式有机电激发光元件4000。此有源矩阵式有机电激发光元件4000包括一位于开关区I的开关薄膜晶体管、一位于驱动区II的驱动薄膜晶体管、一介电层416、一保护层424、一阳极426、以及其它元件(图未显示)。其中,开关薄膜晶体管包括多晶硅层406b、栅极绝缘层410、栅极412、介电层416、以及源/漏电极418;而驱动薄膜晶体管包括多晶硅层406a、栅极绝缘层410、栅极414、介电层416、以及源/漏电极420。
图5绘示本发明一优选实施例中用于显示图像的系统。在此,此系统可以是显示面板520、平面面板元件540或电子元件500。上述有机电激发光元件可以装配于显示面板而做成有机电激发光二极管面板。如图5所示,显示面板520包含有机电激发光元件510,例如图2g、3g与4h分别所示的有机电激发光元件2000、3000与4000。在其它实施例中,平面面板元件540可由显示面板520与控制器530所构成。在其它实施例中,显示面板520也可以构成众多电子元件的一部分(例如,在此为电子元件500)。一般而言,电子元件500可以包含平面面板元件540,而平面面板元件540具有显示面板520、控制器530与输入元件550。而且,输入元件550与平面面板元件540耦接,且提供输入信号(例如,图像信号)至显示面板520以产生图像。电子元件500可以是行动电话、数码相机、个人数字助理(personal digitalassistant;PDA)、笔记型电脑、桌上型电脑、电视、车上显示器或可携式数位多功能光碟(Digital Versatile Disc;DVD)播放机。

Claims (12)

1、一种图像显示系统,包括:
有源矩阵式电激发光元件,包括:
像素区,包括多个次像素,且每一个次像素包括:
开关区以及驱动区;
开关薄膜晶体管,置于该开关区,且包括第一硅层,其中该第一硅层具有第一厚度;以及
驱动薄膜晶体管,置于该驱动区,且包括第二硅层,其中该第二硅层具有第二厚度;
其中,该第一厚度与该第二厚度的差异至少超过10%。
2、如权利要求1所述的图像显示系统,其中该第一厚度与该第二厚度的差异介于10%至200%之间。
3、如权利要求1所述的图像显示系统,其中该第一厚度与该第二厚度的差异介于10%至150%之间。
4、如权利要求1所述的图像显示系统,其中该第一厚度与该第二厚度的差异介于10%至100%之间。
5、如权利要求1所述的图像显示系统,其中该第一厚度与该第二厚度的差异介于10%至70%之间。
6、如权利要求1所述的图像显示系统,其中该第一厚度与该第二厚度的差异介于10%至40%之间。
7、如权利要求1所述的图像显示系统,其中该第二厚度大于该第一厚度。
8、如权利要求7所述的图像显示系统,还包括与该驱动薄膜晶体管电性连接的有机电激发光二极管。
9、如权利要求8所述的图像显示系统,其中该有机电激发光二极管包括阳极电极、电激发光层与阴极电极。
10、如权利要求9所述的图像显示系统,还包括显示面板,其中该有源矩阵式电激发光元件形成该显示面板的一部分。
11、如权利要求10所述的图像显示系统,还包括电子元件,其中该电子元件包括:
该显示面板;以及
耦接至该显示面板的输入单元,且该输入单元用以提供一输入信号至该显示面板,因而该显示面板显示图像。
12、如权利要求11所述的图像显示系统,其中该电子元件为行动电话、数码相机、个人数字助理、笔记型电脑、桌上型电脑、电视、车上显示器或可携式数位多功能光碟播放机。
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102054874A (zh) * 2010-11-01 2011-05-11 友达光电股份有限公司 薄膜晶体管及其制造方法
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US8260252B2 (en) * 2006-10-02 2012-09-04 The Nielsen Company (Us), Llc Method and apparatus for collecting information about portable device usage
JP5443588B2 (ja) * 2010-06-22 2014-03-19 パナソニック株式会社 発光表示装置及びその製造方法
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Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6337232B1 (en) 1995-06-07 2002-01-08 Semiconductor Energy Laboratory Co., Ltd. Method of fabrication of a crystalline silicon thin film semiconductor with a thin channel region
BE1012454A3 (fr) * 1999-01-29 2000-11-07 Roberto Jean Jose Postelmans Appareil d'assistance ou de suppleance du genou.
US8853696B1 (en) * 1999-06-04 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and electronic device
JP4406540B2 (ja) * 2003-03-28 2010-01-27 シャープ株式会社 薄膜トランジスタ基板およびその製造方法
KR100496300B1 (ko) 2003-04-02 2005-06-17 삼성에스디아이 주식회사 박막 트랜지스터를 구비한 평판표시장치
TWI247169B (en) 2004-03-24 2006-01-11 Toppoly Optoelectronics Corp Planar display panel structure and its producing method

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US10818795B2 (en) 2013-12-27 2020-10-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US11380795B2 (en) 2013-12-27 2022-07-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising an oxide semiconductor film
US11757041B2 (en) 2013-12-27 2023-09-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN104701265A (zh) * 2015-03-27 2015-06-10 深圳市华星光电技术有限公司 低温多晶硅tft基板结构及其制作方法
WO2016155056A1 (zh) * 2015-03-27 2016-10-06 深圳市华星光电技术有限公司 低温多晶硅tft基板结构及其制作方法
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US10084000B2 (en) 2015-10-23 2018-09-25 Boe Technology Group Co., Ltd. Array substrate, manufacturing method therefor, display panel, and display apparatus
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