CN101048460B - 含有醇官能的有机硅树脂或者酸酐官能的有机硅树脂的可模塑组合物 - Google Patents

含有醇官能的有机硅树脂或者酸酐官能的有机硅树脂的可模塑组合物 Download PDF

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Publication number
CN101048460B
CN101048460B CN2005800365546A CN200580036554A CN101048460B CN 101048460 B CN101048460 B CN 101048460B CN 2005800365546 A CN2005800365546 A CN 2005800365546A CN 200580036554 A CN200580036554 A CN 200580036554A CN 101048460 B CN101048460 B CN 101048460B
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CN
China
Prior art keywords
sio
silicone resin
group
composition
alcohol
Prior art date
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Expired - Fee Related
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CN2005800365546A
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English (en)
Chinese (zh)
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CN101048460A (zh
Inventor
G·V·高登
R·G·施密特
G·M·威贝尔
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Dow Silicones Corp
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Dow Corning Corp
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Publication date
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Publication of CN101048460A publication Critical patent/CN101048460A/zh
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Publication of CN101048460B publication Critical patent/CN101048460B/zh
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04Epoxynovolacs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
CN2005800365546A 2004-10-25 2005-10-20 含有醇官能的有机硅树脂或者酸酐官能的有机硅树脂的可模塑组合物 Expired - Fee Related CN101048460B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62178004P 2004-10-25 2004-10-25
US60/621,780 2004-10-25
PCT/US2005/037963 WO2006047318A1 (en) 2004-10-25 2005-10-20 Moldable compositions containing carbinol functional silicone reisins or anhydride functional silicone resins

Publications (2)

Publication Number Publication Date
CN101048460A CN101048460A (zh) 2007-10-03
CN101048460B true CN101048460B (zh) 2011-04-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800365546A Expired - Fee Related CN101048460B (zh) 2004-10-25 2005-10-20 含有醇官能的有机硅树脂或者酸酐官能的有机硅树脂的可模塑组合物

Country Status (6)

Country Link
EP (1) EP1809701B1 (enExample)
JP (1) JP2008518049A (enExample)
CN (1) CN101048460B (enExample)
AT (1) ATE438689T1 (enExample)
DE (1) DE602005015884D1 (enExample)
WO (1) WO2006047318A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5134962B2 (ja) * 2004-10-25 2013-01-30 ダウ・コーニング・コーポレイション 照射もしくは熱硬化性組成物、及びコーティング方法
JP4674112B2 (ja) * 2005-04-28 2011-04-20 出光興産株式会社 エポキシ樹脂組成物及びそれを用いた光学電子部材
CN100441649C (zh) * 2006-08-23 2008-12-10 领胜电子科技(深圳)有限公司 一种热熔粘接工艺
TWI422638B (zh) * 2009-08-25 2014-01-11 臺灣永光化學工業股份有限公司 含矽樹脂封裝組成物
US8926787B2 (en) * 2009-10-07 2015-01-06 Stella Chemifa Corporation Surface-modified film, process for producing same, and laminated film and process for producing same
CN103265704B (zh) * 2013-05-28 2015-12-23 卢儒 一种有机硅改性丙烯酸紫外光固化水性树脂及其制备方法
CN104371635A (zh) * 2014-10-31 2015-02-25 青岛昌安达药业有限公司 一种改进的热固型胶黏剂
TWI715798B (zh) * 2016-08-31 2021-01-11 日商東麗股份有限公司 聚矽氧烷、半導體用材料、半導體及太陽能電池製備方法
CN115029100B (zh) * 2022-05-27 2023-07-18 湖北平安电工科技股份公司 一种热固化硬质云母板修补剂及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015700A (en) * 1989-08-18 1991-05-14 Wacker-Chemie Gmbh Anhydride-functional organo/(poly)siloxanes, a process for preparing the same and uses thereof
US5814679A (en) * 1996-10-18 1998-09-29 General Electric Company Premium release photo-curable silicone compositions
US5939491A (en) * 1997-08-01 1999-08-17 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes
CN1534074A (zh) * 2002-10-07 2004-10-06 ͨ�õ�����˾ 环氧树脂组合物用其包封的固态器件及方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015700A (en) * 1989-08-18 1991-05-14 Wacker-Chemie Gmbh Anhydride-functional organo/(poly)siloxanes, a process for preparing the same and uses thereof
US5814679A (en) * 1996-10-18 1998-09-29 General Electric Company Premium release photo-curable silicone compositions
US5939491A (en) * 1997-08-01 1999-08-17 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes
CN1534074A (zh) * 2002-10-07 2004-10-06 ͨ�õ�����˾ 环氧树脂组合物用其包封的固态器件及方法

Also Published As

Publication number Publication date
JP2008518049A (ja) 2008-05-29
EP1809701B1 (en) 2009-08-05
DE602005015884D1 (de) 2009-09-17
ATE438689T1 (de) 2009-08-15
WO2006047318A1 (en) 2006-05-04
EP1809701A1 (en) 2007-07-25
CN101048460A (zh) 2007-10-03

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