JP2008518049A - カルビノール官能基シリコーン樹脂もしくは無水物官能基シリコーン樹脂を含有している成型可能な組成物 - Google Patents
カルビノール官能基シリコーン樹脂もしくは無水物官能基シリコーン樹脂を含有している成型可能な組成物 Download PDFInfo
- Publication number
- JP2008518049A JP2008518049A JP2007538081A JP2007538081A JP2008518049A JP 2008518049 A JP2008518049 A JP 2008518049A JP 2007538081 A JP2007538081 A JP 2007538081A JP 2007538081 A JP2007538081 A JP 2007538081A JP 2008518049 A JP2008518049 A JP 2008518049A
- Authority
- JP
- Japan
- Prior art keywords
- sio
- anhydride
- group
- silicone resin
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- SKPUPCBFIIMALK-UHFFFAOYSA-N CC(C1C(O2)=O)C=C(C)CC1C2=O Chemical compound CC(C1C(O2)=O)C=C(C)CC1C2=O SKPUPCBFIIMALK-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62178004P | 2004-10-25 | 2004-10-25 | |
| PCT/US2005/037963 WO2006047318A1 (en) | 2004-10-25 | 2005-10-20 | Moldable compositions containing carbinol functional silicone reisins or anhydride functional silicone resins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008518049A true JP2008518049A (ja) | 2008-05-29 |
| JP2008518049A5 JP2008518049A5 (enExample) | 2011-07-21 |
Family
ID=35690365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007538081A Withdrawn JP2008518049A (ja) | 2004-10-25 | 2005-10-20 | カルビノール官能基シリコーン樹脂もしくは無水物官能基シリコーン樹脂を含有している成型可能な組成物 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1809701B1 (enExample) |
| JP (1) | JP2008518049A (enExample) |
| CN (1) | CN101048460B (enExample) |
| AT (1) | ATE438689T1 (enExample) |
| DE (1) | DE602005015884D1 (enExample) |
| WO (1) | WO2006047318A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006307062A (ja) * | 2005-04-28 | 2006-11-09 | Idemitsu Kosan Co Ltd | エポキシ樹脂組成物及びそれを用いた光学電子部材 |
| JP2008518050A (ja) * | 2004-10-25 | 2008-05-29 | ダウ・コーニング・コーポレイション | カルビノール官能基シリコーン樹脂もしくは無水物官能基シリコーン樹脂を含有しているコーティング組成物 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100441649C (zh) * | 2006-08-23 | 2008-12-10 | 领胜电子科技(深圳)有限公司 | 一种热熔粘接工艺 |
| TWI422638B (zh) * | 2009-08-25 | 2014-01-11 | 臺灣永光化學工業股份有限公司 | 含矽樹脂封裝組成物 |
| EP2487197B1 (en) * | 2009-10-07 | 2020-04-15 | Stella Chemifa Corporation | Process for producing a laminated film and solar cell backsheet |
| CN103265704B (zh) * | 2013-05-28 | 2015-12-23 | 卢儒 | 一种有机硅改性丙烯酸紫外光固化水性树脂及其制备方法 |
| CN104371635A (zh) * | 2014-10-31 | 2015-02-25 | 青岛昌安达药业有限公司 | 一种改进的热固型胶黏剂 |
| US10738218B2 (en) * | 2016-08-31 | 2020-08-11 | Toray Industries, Inc. | Polysiloxane, material for semiconductor, and preparation method for semiconductor and solar cell |
| CN115029100B (zh) * | 2022-05-27 | 2023-07-18 | 湖北平安电工科技股份公司 | 一种热固化硬质云母板修补剂及其制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3927312A1 (de) * | 1989-08-18 | 1991-02-21 | Wacker Chemie Gmbh | Anhydridfunktionelle organo(poly)siloxane, verfahren zu ihrer herstellung und verwendung dieser organo(poly)siloxane |
| US5814679A (en) * | 1996-10-18 | 1998-09-29 | General Electric Company | Premium release photo-curable silicone compositions |
| US5939491A (en) * | 1997-08-01 | 1999-08-17 | Ppg Industries Ohio, Inc. | Curable compositions based on functional polysiloxanes |
| US6800373B2 (en) * | 2002-10-07 | 2004-10-05 | General Electric Company | Epoxy resin compositions, solid state devices encapsulated therewith and method |
-
2005
- 2005-10-20 CN CN2005800365546A patent/CN101048460B/zh not_active Expired - Fee Related
- 2005-10-20 WO PCT/US2005/037963 patent/WO2006047318A1/en not_active Ceased
- 2005-10-20 EP EP05809997A patent/EP1809701B1/en not_active Expired - Lifetime
- 2005-10-20 JP JP2007538081A patent/JP2008518049A/ja not_active Withdrawn
- 2005-10-20 DE DE602005015884T patent/DE602005015884D1/de not_active Expired - Lifetime
- 2005-10-20 AT AT05809997T patent/ATE438689T1/de not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008518050A (ja) * | 2004-10-25 | 2008-05-29 | ダウ・コーニング・コーポレイション | カルビノール官能基シリコーン樹脂もしくは無水物官能基シリコーン樹脂を含有しているコーティング組成物 |
| JP2006307062A (ja) * | 2005-04-28 | 2006-11-09 | Idemitsu Kosan Co Ltd | エポキシ樹脂組成物及びそれを用いた光学電子部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE602005015884D1 (de) | 2009-09-17 |
| ATE438689T1 (de) | 2009-08-15 |
| CN101048460A (zh) | 2007-10-03 |
| EP1809701B1 (en) | 2009-08-05 |
| EP1809701A1 (en) | 2007-07-25 |
| WO2006047318A1 (en) | 2006-05-04 |
| CN101048460B (zh) | 2011-04-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080717 |
|
| A524 | Written submission of copy of amendment under article 19 pct |
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| A977 | Report on retrieval |
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| A602 | Written permission of extension of time |
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| A601 | Written request for extension of time |
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| A761 | Written withdrawal of application |
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