CN101032847A - 半导体器件的制造方法 - Google Patents

半导体器件的制造方法 Download PDF

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Publication number
CN101032847A
CN101032847A CNA2007100043929A CN200710004392A CN101032847A CN 101032847 A CN101032847 A CN 101032847A CN A2007100043929 A CNA2007100043929 A CN A2007100043929A CN 200710004392 A CN200710004392 A CN 200710004392A CN 101032847 A CN101032847 A CN 101032847A
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CN
China
Prior art keywords
pressing mold
resin
mould
clean resin
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007100043929A
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English (en)
Chinese (zh)
Inventor
土田清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Publication of CN101032847A publication Critical patent/CN101032847A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
CNA2007100043929A 2006-03-09 2007-01-24 半导体器件的制造方法 Pending CN101032847A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006063954A JP2007242924A (ja) 2006-03-09 2006-03-09 半導体装置の製造方法
JP063954/2006 2006-03-09

Publications (1)

Publication Number Publication Date
CN101032847A true CN101032847A (zh) 2007-09-12

Family

ID=38478134

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007100043929A Pending CN101032847A (zh) 2006-03-09 2007-01-24 半导体器件的制造方法

Country Status (5)

Country Link
US (1) US20070210468A1 (https=)
JP (1) JP2007242924A (https=)
KR (1) KR20070092634A (https=)
CN (1) CN101032847A (https=)
TW (1) TW200735237A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101964314A (zh) * 2010-08-21 2011-02-02 山东开元电子有限公司 自校准工件灌胶胶接方法
CN102350803A (zh) * 2011-06-24 2012-02-15 中国航空工业集团公司北京航空制造工程研究所 一种减少复合材料成型中真空渗漏的封装方法
CN112077984A (zh) * 2020-08-12 2020-12-15 周贵宏 一种汽车制动片热压气体回收系统及回收方法
CN114074392A (zh) * 2020-08-18 2022-02-22 东和株式会社 树脂成形装置及树脂成形品的制造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5121549B2 (ja) * 2008-04-21 2013-01-16 株式会社東芝 ナノインプリント方法
KR101007320B1 (ko) * 2008-07-25 2011-01-13 김종윤 반도체 몰드 금형의 세정용 더미
TWI381496B (zh) 2009-01-23 2013-01-01 億光電子工業股份有限公司 封裝基板結構與晶片封裝結構及其製程
JP5741398B2 (ja) * 2011-11-21 2015-07-01 日立化成株式会社 金型クリーニングシート
US10960583B2 (en) 2016-07-19 2021-03-30 Asm Technology Singapore Pte Ltd Molding system for applying a uniform clamping pressure onto a substrate
TWI633639B (zh) * 2016-11-15 2018-08-21 致伸科技股份有限公司 具有發光功能的指紋辨識模組及其製造方法
KR102337659B1 (ko) * 2018-02-21 2021-12-09 삼성전자주식회사 금형 검사 장치 및 금형 검사 방법
CN108556233B (zh) * 2018-04-20 2023-05-12 天津昌润鹏科技有限公司 一种手机电池胶带吸取夹具挂胶治具
KR102074463B1 (ko) * 2019-09-30 2020-02-06 이정우 반도체 패키지 제조 장치용 클리닝 지그
JP2022173612A (ja) * 2021-05-10 2022-11-22 Ｔｏｗａ株式会社 樹脂成形品の製造方法、成形型、及び樹脂成形装置
CN115284535B (zh) * 2022-07-22 2026-02-10 杭州巨星科技股份有限公司 一种分层注塑浇道装置及采用该装置的注塑成型工艺
CN116130471B (zh) * 2022-11-02 2025-11-25 深圳市同一方光电技术有限公司 多色光源点胶方法
WO2025013590A1 (ja) * 2023-07-10 2025-01-16 東北物流株式会社 クリーニング用シート、半導体装置の製造方法およびクリーニング用シートの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950012839B1 (ko) * 1986-12-11 1995-10-23 닛또오 덴끼고교 가부시끼가이샤 금형 세정 조성물, 금형 세정용 쉬이트 및, 세정쉬이트를 사용한 금형 세정방법
MY101701A (en) * 1986-12-23 1991-12-31 Nitto Electric Ind Co Mold-releasing sheet and method for applying mold- releasing agent onto mold surface using said sheet.
JPH07304044A (ja) * 1994-05-11 1995-11-21 Toshiba Chem Corp 金型のクリーニング材およびクリーニング方法
JPH0982737A (ja) * 1995-09-13 1997-03-28 Hitachi Cable Ltd 半導体素子のトランスファモールド方法及びそれに使用する金型
JP3764239B2 (ja) * 1996-12-10 2006-04-05 日東電工株式会社 半導体装置成形用金型洗浄剤組成物およびそれを用いた金型クリーニング方法
JP4769380B2 (ja) * 2001-05-18 2011-09-07 ルネサスエレクトロニクス株式会社 クリーニング用シートおよびそれを用いた半導体装置の製造方法
WO2004052610A1 (ja) * 2002-12-06 2004-06-24 Nippon Carbide Kogyo Kabushiki Kaisha 成形金型用クリーニング材及びクリーニング方法
CN1925966B (zh) * 2004-05-28 2010-12-08 日本碳化物工业株式会社 成型模具用脱模回复片和脱模回复方法
JP4373291B2 (ja) * 2004-06-24 2009-11-25 株式会社ルネサステクノロジ 半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101964314A (zh) * 2010-08-21 2011-02-02 山东开元电子有限公司 自校准工件灌胶胶接方法
CN102350803A (zh) * 2011-06-24 2012-02-15 中国航空工业集团公司北京航空制造工程研究所 一种减少复合材料成型中真空渗漏的封装方法
CN112077984A (zh) * 2020-08-12 2020-12-15 周贵宏 一种汽车制动片热压气体回收系统及回收方法
CN114074392A (zh) * 2020-08-18 2022-02-22 东和株式会社 树脂成形装置及树脂成形品的制造方法

Also Published As

Publication number Publication date
US20070210468A1 (en) 2007-09-13
TW200735237A (en) 2007-09-16
JP2007242924A (ja) 2007-09-20
KR20070092634A (ko) 2007-09-13

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: RENESAS ELECTRONICS CO., LTD.

Free format text: FORMER OWNER: RENESAS TECHNOLOGY CORP.

Effective date: 20100925

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20100925

Address after: Kanagawa

Applicant after: Renesas Electronics Corporation

Address before: Tokyo, Japan, Japan

Applicant before: Renesas Technology Corp.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20070912