CN101001518A - Installation system and installation method of electronic element - Google Patents
Installation system and installation method of electronic element Download PDFInfo
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- CN101001518A CN101001518A CN 200710001411 CN200710001411A CN101001518A CN 101001518 A CN101001518 A CN 101001518A CN 200710001411 CN200710001411 CN 200710001411 CN 200710001411 A CN200710001411 A CN 200710001411A CN 101001518 A CN101001518 A CN 101001518A
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Abstract
The inventive mounting system includes an opening part position acquisition for acquiring a position information of the opening part formed on a mask from a manufacturing data of the mask; an installing position set device for setting the installing position of an electronic component on a base plate based on the acquired opening part position information; an installing device for installing the electronic component at a set installing position. The electronic component, using the invention, is able to be installed accurately at a positon where a paste is printed on the base plate, in order to reduce the illness of the installing. Moreover, the productive effect can be improved by determining the actual position where a paste is printed on the base plate, having no need for each base plate.
Description
Technical field
The present invention relates to a kind of with respect to the installation system of substrate installation electronic component and the installation method of electronic component.
Background technology
About the installation production of electronic component with respect to substrate, be with respect to the substrate that is formed with circuit pattern generally speaking, by press printing/coating paste scolder, by fitting machine electronic component is installed then.The electronic component installation site of fitting machine is normally set corresponding to the circuit pattern on the substrate.
But, recently, along with electronic component trends towards microminiaturization, to the installation site accuracy require highly, if having off normal between the circuit pattern on the substrate and the printed scolder, will cause the bad problems of installation such as loose contact.
Therefore, for example shown in the patent documentation 1 (Japan Patent open communique spy open 2002-271096 number), a kind of position at the scolder that is printed by printing machine at each basal lamina determination is disclosed, and the method that electronic component is installed corresponding to the position of the scolder of being measured by the fitting machine in downstream.
But above-mentioned patent documentation 1 disclosed method need so minute is longer, therefore also have room for improvement to the position of the printed scolder of each basal lamina determination aspect production efficiency.
Summary of the invention
The present invention does in view of the above problems, and its purpose is to provide and can reduces the installation condition of poor, the installation system of enhancing productivity simultaneously and the installation method of electronic component.
Installation system of the present invention, the matte that electronic component is installed in through being formed with peristome has printed on the substrate of paste, and it comprises, obtains the peristome position deriving means of the positional information of formed peristome on the matte from the manufacturing data of matte; According to the positional information of the peristome that is obtained, set the installation site setting device of the installation site of electronic component on substrate; Electronic component is installed in the erecting device on the installation site that sets.
Adopt above-mentioned installation system, owing to set the installation site of electronic component according to the position of formed peristome on the matte, so electronic component can be installed in the position that is printed with paste on the substrate exactly, to reduce condition of poor is installed.And, need not to have the position of paste, thereby can enhance productivity at actual print on each basal lamina determination substrate.
In above-mentioned installation system, comparatively it is desirable to, also can comprise, at having obtained the matte of peristome position by above-mentioned peristome position deriving means, the positional information that allows to determine the peristome of the information of each matte and each matte is managed mutually, and the peristome position storage device of being stored.
Adopt above-mentioned installation system, because the positional information to the peristome that obtained stores, therefore by using the positional information of this stored peristome, to obtaining the matte of positional information, need not to obtain once more positional information and just can directly carry out the setting of installation site, thereby can further improve production efficiency.
In addition, in above-mentioned installation system, comparatively it is desirable to, also can comprise, at the substrate that is coated with paste by printing machine, allow to determine that the information of each substrate is interrelated with the information that can determine each substrate employed matte when printing, and the use matte storage device of being stored.
Adopt above-mentioned installation system, can grasp each substrate employed matte when printing, therefore when the substrate of identical type employed matte when the printing being changed, can determine the matte of each substrate exactly, thereby can set the installation site according to the position that is printed with paste on each substrate in the actual use of when printing institute.
In addition, in the above-mentioned installation system, comparatively it is desirable to, also can comprise, make the coordinate system of above-mentioned matte corresponding mutually with the coordinate system of substrate, and with the printing machine of paste coating on substrate, above-mentioned installation site setting device, according to the positional information of the peristome that is obtained, and the corresponding relation of above-mentioned matte coordinate system and substrate coordinate system, set the installation site of electronic component on substrate.
Adopt above-mentioned installation system, since can be under the coordinate system of matte and the mutual corresponding situation of the coordinate system of substrate with paste coating on substrate, therefore the position of the peristome of being represented with the matte coordinate system can be grasped by the coordinate system of substrate, thereby installation site can be set easily corresponding to the position that is printed with paste on each substrate.
In addition, in the above-mentioned installation system, comparatively it is desirable to, also can comprise, substrate at the electronic component installation exercise position that is positioned above-mentioned erecting device, measure the wherein position of a part of paste coated on this substrate, the coordinate system of employed matte is corresponding to the matte position deriving means of the position of above-mentioned erecting device when obtaining this coating of substrates paste, above-mentioned installation site setting device, positional information according to the peristome that is obtained, and the position of the matte coordinate system that is obtained, set the installation site of electronic component on substrate.
Adopt above-mentioned installation system, owing to obtain the position of matte coordinate system corresponding to erecting device by the wherein position of a part of measuring paste coated on the substrate, so can grasp the peristome represented with the matte coordinate system position, thereby can set installation site more accurately corresponding to the position of paste printed on each substrate corresponding to erecting device.And, need not to measure the position of whole pastes printed on the substrate, and then can enhance productivity.
Electronic component mounting method of the present invention, the matte that electronic component is installed in through being formed with peristome has printed on the substrate of paste, and it comprises, obtains the peristome position obtaining step of the positional information of formed peristome on the matte from the manufacturing data of matte; According to the positional information of the peristome that is obtained, set the installation site of the installation site of electronic component on substrate and set step; Electronic component is installed in the installation steps on the installation site that sets.
Adopt above-mentioned installation method, owing to set the installation site of electronic component according to the position of formed peristome on the matte, so electronic component can be installed in the position that is printed with paste on the substrate exactly, to reduce condition of poor is installed.And, need not position, thereby can enhance productivity at the paste of actual print on each basal lamina determination substrate.
Description of drawings
Fig. 1 is the structure key diagram of the related installation system of an embodiment of the invention.
Fig. 2 is the stereogram of an embodiment of expression printing machine.
Fig. 3 is the vertical view of an embodiment of expression fitting machine.
Fig. 4 is the functional-block diagram of an embodiment of the control system structure of expression fitting machine.
Fig. 5 (a) is the vertical view of an embodiment of expression matte.(b) be the vertical view of an embodiment of expression substrate.
Fig. 6 is the flow chart of an embodiment of the order of the expression peristome position data of obtaining matte.
Fig. 7 is the flow chart of an installation exercise embodiment in proper order of expression fitting machine.
Fig. 8 (a) is the key diagram according to the centre coordinate of the electronic component that the position calculated of the peristome of matte.(b) be electronic component installation site corresponding to the position of printing/being coated with paste on the substrate, and corresponding to the key diagram of the electronic component installation site of formed circuit pattern on the substrate.
Embodiment
Fig. 1 is the structure key diagram of the related installation system of an embodiment of the invention.As shown in the drawing, this installation system comprises the printing machine 2, a plurality of fitting machine 1 that constitute production line ..., inspection machine 3, reflow stove (reflow) 4.Above-mentioned each equipment is according to said sequence, from the upstream side side arrangement downstream setting of conveyance substrate.
Constitute each equipment of above-mentioned installation system, possess the control device 6 that constitutes by computer etc. respectively ..., by each control device 6 ... can control the driving of each equipment on the mounting production line.And, each control device 6 ..., interconnect by network communication devices such as LAN, and between each control device, carry out the transmission and the reception of signal mutually, drive each equipment with this, thus the running of in the whole erection system, unifying to control.In addition, in each equipment, be provided with the display unit 7 of the data of the state that is used to show relevant each equipment etc., be used to import input units 8 such as the keyboard of various information or mouse.
In addition, above-mentioned installation system also comprises the server 9 of each equipment on the centralized control production line.
Fig. 2 is the stereogram of an embodiment of expression printing machine.As shown in the drawing, this printing machine 2 comprises, keeps being printed the print station 21 of substrate W; Substrate W is moved into/takes out of the conveyer belt 22 of print station 21; Above print station 21, keep the matte of matte S to keep assembly 23; The scraper component 24 of expansion paste on matte S; Take the camera assembly 25 of substrate W and matte S; The cleaning assembly 26 of cleaning matte S.
Above-mentioned print station 21 comprises, the main belt 211 of conveyance substrate W; The clamp assembly 212 that is fixedly clamped and is printed substrate W.Above-mentioned main belt 211 and clamp assembly 212, Y-axis workbench 213 by moving along the Y direction with X-direction (conveyance direction) quadrature of conveyance substrate with respect to pedestal 201, the X-axis workbench 214 that moves along X-direction with respect to Y-axis workbench 213, the R axle workbench 215 that rotates around vertical curve (Z-direction) with respect to X-axis workbench 214, the self-powered platform 216 etc. that carries out lifting with respect to R axle workbench 215 along Z-direction are supported, thereby can be moved along all directions of XYZR.
Above-mentioned matte keeps assembly 23, comprises, supports the matte brace table 232 that partly is formed with the matte S of peristome (pattern hole) corresponding to solder coating; The matte anchor clamps 233 of set fixedly matte S on the matte brace table 232.Matte brace table 232 is installed in upright being located on the support frame 202 of print station 21 left and right sides.
Above-mentioned camera assembly 25 comprises, matte is taken camera 251; Substrate imaging camera 252; Bar code reader 253.Above-mentioned matte is taken camera 251, substrate imaging camera 252 and bar code reader 253, is installed in camera head 254.In upright lower surface one side of being located at the support frame 202,202 of print station 21 left and right sides, set up camera brace summer 204.Camera head 254 is installed on this camera brace summer 204.The height and position of camera brace summer 204, be set in the print station 21 that is in the state of falling and matte S between.Camera head 254 can move along X-direction on camera brace summer 204, and camera brace summer 204 can move along Y direction with respect to support frame 202,202.Thus, camera head 254 can move and carry out the shooting of substrate and matte S on the XY plane.
Fig. 5 (a) is the vertical view of an embodiment of expression matte.As shown in the drawing, on matte S, be formed with, be used to adjust itself and a plurality of position reference mark S1 as the position of the substrate W of printing object ..., be used to apply the peristome S2 of pastes such as paste scolder ..., expression can carry out individual identification and the identification mark S3 of the id information determined to each matte S.The identification mark S3 of present embodiment is made of bar code.
Above-mentioned matte S usually according to the manufacturing data that are called as the Gerber data, forms position mark S1 or peristome S2 by laser processing etc. on film like half tone parts.
Fig. 5 (b) is the vertical view of an embodiment of expression substrate.As shown in the drawing, on substrate W, be formed with, be used to adjust a plurality of position reference mark W1 of the position of substrate W and matte S ..., electrode part (circuit pattern) W2 that exposes to substrate surface from the inner circuit that forms of substrate W ..., expression can carry out individual identification and the identification mark W3 of the id information determined to each substrate W.
Matte is taken camera 251, when new matte S is installed, takes matte S and goes up formed position reference mark S1 to measure the position of matte S.Substrate imaging camera 252 in order to adjust the position of substrate W and matte S, is taken substrate W and is gone up formed position reference mark W1 to measure the position of substrate W.In addition, substrate imaging camera 252 also detects substrate W and goes up formed identification mark W3.Bar code reader 253 reads matte S and goes up formed identification mark (bar code) S3.
Above-mentioned printing machine 2, when each substrate W being begun to print pastes such as paste scolder, can determine the substrate id information of each substrate W by control device 6, and the matte id information that can determine each substrate employed matte S when printing, send to server 9.
Fitting machine (fitting machine main body) 1 ..., as the erecting device of (lift-launch) electronic component being installed and being brought into play its function at the assigned position of substrate.
Fig. 3 is the vertical view of an embodiment of expression fitting machine.As shown in the drawing, fitting machine 1 comprises the conveyer belt 12 that is arranged on the pedestal 11 and is used for conveyance substrate W; Be arranged on the component feeding portion 13 of these conveyer belt both sides; Be arranged on the top of pedestal 11 and be used to install the head assembly 14 of electronic component.
And, in the both sides of conveyer belt 12, and the position between the component feeding portion 13 in upstream side and downstream, be provided with element and take camera 17,17.Element is taken camera 17, the state of the element that head shot assembly 14 is adsorbed, thereby the off normal of detecting element etc.
In addition, head assembly 14 is equipped with a plurality of heads 148 side by side along X-direction.Each head 148, by being the elevating mechanism of drive source with Z axle motor, (Z-direction) driven along the vertical direction, and by being the rotating drive mechanism of drive source with R axle motor, in rotational direction (R direction of principal axis) driven simultaneously.
At the front end of each head 148, be provided with and be used for stick electronic components and attach it to suction nozzle on the substrate, each suction nozzle, the attraction that the negative pressure of supplying with by not shown negative pressure device causes, stick electronic components.
And head assembly 14 is provided with the substrate imaging camera 18 that is made of CCD camera that possesses lighting mechanism etc.
This substrate imaging camera 18 is taken (with reference to Fig. 5) such as position reference mark W1 on the substrate W that moves into above-mentioned fitting machine 1, to measure the position of substrate W.Thus, can make the coordinate system (coordinate system of fitting machine 1) that is set on the fitting machine 1 and is used for the mobile control of head assembly 14 interrelated with the coordinate system of substrate W.This is operation associated, is implemented in the location of following step S43.In addition, substrate imaging camera 18 detects substrate W and goes up formed ID mark.Substrate W goes up formed ID mark, and expression can be carried out individual identification and the id information determined to each substrate W.
Fig. 4 is the functional-block diagram of an embodiment of the control system structure of expression fitting machine.As shown in the drawing, the control system of fitting machine 1, the control device 6 that constitutes by computer wherein, comprise calculation handling part 191, installation procedure storage device 192, conveyer data storage device 193, motor control part 194, outside output/input part 195, image treatment part 196, server communication device 197 etc.
Installation procedure storage device 192, storage are used for each electronic component is installed in production routine (installation procedure) on the substrate W.This production routine comprises, corresponding to installation site (coordinate) data of each electronic component of the circuit pattern of substrate W, be used to discern each electronic component shape data, supply with the position (coordinate) of the feed appliance etc. of each electronic component.
Conveyer data storage device 193, storage and the relevant various data of conveyance substrate W on production line.
Outside output/input part 195, and carry out the output/input of various information between the drive division of the various transducers that possessed of fitting machine 1, brake etc.
Turn back to Fig. 1, inspection machine 3 is checked by fitting machine 1 ... be installed in the installment state of each electronic component on the substrate W, thereby judge the quality of each substrate W.
From the substrate W that reflow stove 4 is taken out of, be housed in substrate successively and take out of in mechanism's (omitting diagram).
As shown in Figure 1, server 9 comprises production substrate data storage device 91, peristome position deriving means 92, peristome position storage device 93, uses matte storage device 94.
Production substrate data storage device 91, storage are used at fitting machine 1 each electronic component being installed in production routine on the substrate W.This production routine, comprise installation site (coordinate) data corresponding to each electronic component of the circuit pattern of substrate W, be used to discern each electronic component shape data, supply with the position (coordinate) of the feed appliance etc. of each electronic component.
Peristome position deriving means 92 is connected with the database 99 of the manufacturing data that store matte S (Gerber data), and obtains the manufacturing data of matte S.And peristome position deriving means 92 from the manufacturing data of the matte S that obtained, extracts the positional information that matte S goes up formed position reference mark S1 and peristome S2.
Peristome position storage device 93, as peristome position data, the position reference mark S1 of the matte S that storage is obtained and the positional information of peristome S2 etc.
Use matte storage device 94, at each substrate W that has printed by printing machine 2, allow to determine the substrate id information of each substrate W, interrelated with the matte id information that can determine each substrate W employed matte S when printing, and stored.Thus, can receive the substrate id information and give related information from printing machine 2 with the matte id information.
Followingly describe with reference to the order of flow chart with regard to the electronic component mounting method of the installation system of present embodiment.
In the present embodiment, before the 1 couple of substrate W of each fitting machine on the production line carries out the installation of electronic component,, obtain the peristome position data of employed matte S on the printing machine 2 by server 9.
Fig. 6 is the flow chart that an embodiment of matte peristome position data order is obtained in expression.
When obtaining the peristome position data of matte S, the peristome position deriving means 92 of server 9 is connected with database 99, visit the manufacturing data (Gerber data) of matte S then, information (step S10) such as the position of the peristome S2 of extraction matte S and size.
As mentioned above, after information such as position that obtains peristome S2 and size, peristome position deriving means 92 calculates and will be installed in substrate W and go up through matte S and go up the centre coordinate (step S11) of electronic component that formed peristome S2 is coated with the position of paste (paste scolder).During this calculates, with reference to installation site (coordinate) data of each electronic component that is stored in production substrate data storage device 91 and shape data etc.
Fig. 8 (a) is the key diagram according to the centre coordinate of the electronic component that the position calculated of matte peristome.As shown in the drawing, be crossed on substrate W and go up the centre coordinate C1 that is coated with the locational electronic component C of paste (paste scolder) through two peristome S2, S2, go up the position of formed peristome S2 according to matte S and obtained.At this, the centre coordinate C1 of the electronic component C that calculates is a benchmark with the position of peristome S2, below is referred to as " peristome centre coordinate ".
This peristome centre coordinate, it is coordinate system by matte S, it is the coordinate that the coordinate system of the position reference mark S1 defined of matte S is represented, when printing machine 2 prints, make it consistent by the coordinate system position of adjusting matte S and substrate W, thus can be consistent with the coordinate that the coordinate system of position reference mark W1 defined by substrate W is represented.
So, calculate the peristome centre coordinate after, matte S goes up the position of formed position reference mark S1 and the peristome centre coordinate of each element, is stored in the peristome position storage device 93 of server 9 (step S12).
In addition, elongation takes place the side of matte S and substrate W or both sides and waits when being out of shape in printing machine 2, with regard to the whole printing object field of matte S and substrate W, can't make both coordinate systems consistent.At this moment, printing machine 2 can comparatively the installing area of responsive fine electronic element be adjusted the position of matte S and substrate W as priority condition with respect to the skew of the printing position of the circuit pattern on the substrate W to paste (paste scolder).Such adjustment can be passed through camera, take matte S that measures of institute and substrate W position reference mark S1, W1 the position and carry out automatically apart from (elongation).Perhaps, judge adjustment amount, and printing machine 2 is carried out input operation carry out the position adjustment with this by range estimations such as operators.Especially, during the production of substrate W of beginning new varieties, owing to will tackle the small foozle etc. of matte S and substrate W, therefore can also set the offset correction amount of adjusting with respect to according to the position reference mark S1 of matte S and substrate W, position that W1 carries out.
After printing machine 2 carries out the adjustment of above-mentioned position, the above-mentioned correcting value of the position corresponding relation of the coordinate system of expression matte S and the coordinate system of substrate W also is sent to server 9, use matte storage device 94 at server, make itself and substrate id information and matte id information interrelated, and stored.
Fig. 7 is the flow chart of an installation exercise embodiment in proper order of expression fitting machine.
The installation exercise of fitting machine 1 is at first selected production routine (installation procedure) (step S40) by the operator according to the kind of the production substrate W of institute.This is selected, and can be undertaken by network by the server 9 of management whole erection system.
Start fitting machine 1 back (step S41), program counter be initialised (step S42).Then, move into the substrate that is printed with paste (paste scolder) from printing machine or fitting machine of being positioned at upstream more etc., and the installation exercise position (step S43) that is positioned to stipulate.
After substrate W is positioned, use substrate imaging camera 18, read the identification mark W3 that is formed on the substrate W, and obtain substrate id information (step S44).Thus, be determined, and be mounted machine identification as the substrate W of mounting object.
Then, according to production routine (installation procedure), head assembly 14 is from component feeding portion 13 stick electronic components (step S45).Adsorbed electronic component is taken camera 17 by element and is taken, and at image processing part 196, the kind and the adsorbed state (absorption position) (step S46) of identification electronic component.
Then, calculation handling part 191, through server communication device 197, from the peristome position storage device 93 of server 9 obtain relevant with adsorbed electronic component the printing engineering of printing machine 2 the peristome centre coordinate (step S47) of employed matte S.Particularly,, detect the matte id information of determining this substrate W employed matte S when printing, and take out the peristome centre coordinate of this matte S from peristome position storage device 93 from the use matte storage device 94 of server 9.At this, when this substrate W is printed, carry out the position adjustment, the correction that the line position of going forward side by side is adjusted corresponding to the position reference mark S1 of matte S and substrate W, the position of W1, when this correcting value is stored in the use matte storage device 94, also can take out these correcting values from matte storage device 94 earlier.
Then, by calculation handling part 191, set and be adsorbed the installation site (lift-launch coordinate) (step S48) of element on substrate W.The setting of this installation site is by the element centre coordinate that the position calculated according to the peristome S2 of matte S, revises the installation coordinate corresponding to the circuit pattern of predefined substrate W in production routine (installation procedure).In the present embodiment, calculation handling part 191 as the position according to the peristome S2 of matte S, is set the installation site setting device of the installation site of electronic component on substrate W.At this, when substrate W prints, carry out the position adjustment corresponding to the position reference mark S1 of matte S and substrate W, the position of W1, the correction that the line position of going forward side by side is adjusted, divide into Dingan County holding position in the situation of considering above-mentioned correcting value this moment.That is, when under the not corresponding to situation of the coordinate system of matte S and substrate W, printing, can set the installation site according to the corresponding relation of two coordinate systems.
Fig. 8 (b) is the electronic component installation site corresponding to the position of printing/being coated with paste on the substrate, and corresponding to the key diagram of the electronic component installation site of formed circuit pattern on the substrate.
The position that is coated with paste (paste scolder) on the substrate W is identical with the peristome S2 of matte S.And the position of this paste P on substrate W comparatively it is desirable to, and be consistent with circuit pattern (electrode part) W2 of substrate W.But because there are distortion such as elongation in matte S or substrate W, so in the middle of the reality, there are not quite identical situation in the position of paste P on substrate W and the circuit pattern W2 of substrate W.
At this, present embodiment is shown in Fig. 8 (b), according to the peristome centre coordinate C1 of the position of expression paste P on substrate W, installation coordinate C2 in the production routine that correction is set according to the circuit pattern W2 of substrate W sets the installation site of electronic component with this.This substrate W carries out the position adjustment corresponding to the position reference mark S1 of matte S and substrate W, the position of W1 when printing, if no longer carry out the correction that the position is adjusted, then the installation site is set in peristome centre coordinate C1.
After the coordinate that adsorbed electronic component should be installed on substrate W (installation site) is set, make the suction nozzle that is adsorbed with electronic component move (step S49) to this installation site.At this moment, on the basis of further considering the electronic component adsorbed state (absorption position) that the photography result that takes camera 17 according to electronic component is judged, the amount of movement of control suction nozzle is so that the center of the adsorbed electronic component of suction nozzle arrives the installation coordinate (installation site) of above-mentioned setting.
If adsorbed electronic component has moved to the installation site that sets, suction nozzle is descended, and this electronic component is installed in substrate W goes up (step S50), after the fitting operation of this electronic component finished, the numerical value of program counter increased by 1 (increment) (step S51).
(step S45～S51) is until install (being NO) of whole electronic components in step S52 to carry out the fitting operation of above-mentioned electronic component repeatedly.If all the installing of electronic components (being YES in step S52) then taken out of the substrate W (step S53) that installs electronic component, finish a series of electronic component installation exercise of this fitting machine 1.
As mentioned above, adopt the installation system of present embodiment, owing to set the installation site of electronic component according to the position of the peristome S2 that is obtained from the manufacturing data of matte S, therefore electronic component can be installed on the position that is printed with paste P such as paste scolder on the substrate W exactly, condition of poor be installed to reduce.And need not to go up actual print at each basal lamina determination substrate W has the position of paste P, thereby can enhance productivity.
In addition, on detecting substrate W during printed pastes such as paste scolder, be vulnerable to the background that the material, color etc. of substrate W constitute, perhaps substrate W goes up the influence of formed circuit pattern etc., and can't obtain higher mensuration accuracy.For this point, in the above-described embodiment, it or not paste according to institute's actual print on the substrate W, but obtain the positional information of peristome S2 according to the manufacturing data that are used to make matte S (Gerber data), therefore can obtain the position of peristome S2 exactly, thereby electronic component can be installed on the position that is printed with paste P on the substrate W exactly.And, also need not to be provided for to measure more exactly optical instruments such as the great number ligthing paraphernalia of the position that is printed with pastes such as paste scolder on the substrate W and camera.
In addition, because the positional information of the peristome that is obtained is stored in the peristome position storage device 93, therefore so long as matte S through once measuring, afterwards if substrate W is printed by this matte S, then need not to obtain the positional information of peristome S2, and then can further improve production efficiency from making data (Gerber data).
And, because the information stores of each substrate W employed matte S when printing is being used in the matte S storage device 94, therefore when the substrate W of identical type employed matte S when the printing being changed, can determine the matte S of each substrate W exactly, and can set the installation site according to the position that is printed with paste on each substrate W in the actual use of when printing institute.
In addition, because printing machine 2 is under the corresponding mutually situation of the coordinate system of the coordinate system of matte S and substrate W paste P to be coated on the substrate W, therefore can grasp the position of the peristome S2 that is represented with the coordinate system of matte S by the coordinate system of substrate W, thereby can set easily corresponding to the installation site that is printed with the position of paste P on each substrate W.
In addition, in the above-mentioned execution mode, printing machine 2 is to print under the coordinate system of matte S and substrate W situation consistent with each other, or the position corresponding relation of the coordinate system of the coordinate system of storage matte S and substrate W, set the installation site of electronic component on substrate W by the position that the coordinate system of substrate W is grasped the peristome S2 of matte S thus.But also can directly obtain the coordinate system of matte S by fitting machine (erecting device) 1.
For example, at fitting machine 1, at the substrate W that is positioned the installation exercise position, measure the wherein position of a part that this substrate W goes up coated paste P, the coordinate system of employed matte S is corresponding to the position of this fitting machine 1 when obtaining this substrate W coating paste P.
Particularly, by the substrate imaging camera 18 on the head assembly 14 that is arranged on fitting machine 1, take the two paste P of place that substrate W goes up printed/coating, thereby measure its position.These positions, therefore the peristome S2 of employed matte S can know the position of the coordinate system of matte S corresponding to fitting machine 1 corresponding to the position of fitting machine 1 during these pastes of expression printing P.So known the coordinate system of matte S, just can grasp whole peristome S of being represented by the coordinate system of matte S position corresponding to fitting machine 1.So grasped the position of each peristome S2, can set the installation site of electronic component according to the position of paste P on substrate W of being printed by each peristome S2 corresponding to fitting machine 1.
In addition, obtain the position of the coordinate system of matte S corresponding to this fitting machine, can carry out at the calculation handling part 191 of fitting machine 1, therefore, calculation handling part 191 also can be used as matte position deriving means.
As mentioned above, obtain the position of the coordinate system of matte S by the wherein position of a part of measuring the upward coated paste P of substrate W corresponding to fitting machine 1, each peristome S2 of being represented with the coordinate system of matte S position can be grasped, thereby the installation site of going up the position of printed paste P corresponding to each substrate W can be set more exactly corresponding to fitting machine 1.In addition, in these cases, in order only need to measure the position of a few paste P of place in the position of the coordinate system of judging matte S, and need not to measure the position that substrate W goes up printed whole paste P, therefore can enhance productivity.
And, in the above-mentioned execution mode, server 9 obtains the positional information of the peristome S2 of matte S from the database 99 of storage matte manufacturing data, but also can peristome position deriving means be set at fitting machine 1, makes fitting machine 1 obtain the positional information of peristome S2.
And, obtain the mode of the positional information of peristome S2, also can be without accessing database, but from store storage devices such as the CD-ROM that makes data (Gerber data) or DVD-ROM, read.
In addition, in the above-described embodiment, the positional information of the peristome S2 of the matte S that is obtained is stored in the server 9, but also can peristome position storage device be set, fitting machine 1 is stored at fitting machine 1.
And, in the above-described embodiment, it is the installation site of setting electronic component by fitting machine 1 according to the position of the peristome S2 that is measured, but also can the installation site setting device be set at server 9, make server 9 installation sites such as calculating/setting such as grade, and make fitting machine 1 carry out the installation exercise of electronic component according to this result.
And, in the above-described embodiment, be printed with the related substrate id information that can determine substrate of substrate W of paste, and the matte id information that can determine this substrate W employed matte S when printing, be stored in the server 9, use the matte storage device but also can wait to be provided with in other equipment at printing machine 2 or fitting machine 1, thus can be in printing machine 2 or fitting machine 1 storage and the relevant information of employed matte S.
And, the positional information of the peristome that peristome position storage device is stored, as long as can carry out the setting of the installation site of electronic component, as described in above-mentioned execution mode, both can be mounted in the centre coordinate of the electronic component on the paste scolder (paste) that is applied by each peristome S2, also can be data such as the coordinate of each peristome S2 self or shape.
And, can obtain the wherein positional information of a part that matte S goes up formed peristome S2 therefrom only at a part of setting the electronic component of installation site corresponding to the position of peristome S2.For example, the wherein positional information of a part of peristome S2 can be that the accuracy of will install the installation site requires the paste of high delicate elements to be printed on the positional information of the peristome S2 on the substrate W.
And the positional information of the peristome S2 of matte S is as long as obtained before fitting operation, for example before to substrate W print paste, all can afterwards.
And, in the above-described embodiment, to fitting machine 1 ... and the concrete structure of printing machine 2 is illustrated, and wherein makes mechanism that substrate, camera, matte, head assembly etc. relatively move etc. can adopt the mechanism of any type.
Claims (6)
1. installation system is characterized in that:
The matte that electronic component is installed in through being formed with peristome has printed on the substrate of paste,
This installation system comprises,
Peristome position deriving means obtains the positional information of formed peristome on the matte from the manufacturing data of matte;
The installation site setting device according to the positional information of the peristome that is obtained, is set the installation site of electronic component on substrate;
Erecting device is installed in electronic component on the installation site that sets.
2. installation system according to claim 1 is characterized in that:
Comprise that also peristome position storage device at having obtained the matte of peristome position by above-mentioned peristome position deriving means, allows to determine that the positional information of peristome of the information of each matte and each matte is interrelated, and stored.
3. installation system according to claim 1 is characterized in that:
Also comprise, use the matte storage device,, allow to determine that the information of each substrate is interrelated with the information that can determine each substrate employed matte when printing, and stored at the substrate that is coated with paste by printing machine.
4. installation system according to claim 1 is characterized in that:
Comprise that also printing machine makes the coordinate system of above-mentioned matte corresponding mutually with the coordinate system of substrate, and with paste coating on substrate,
Above-mentioned installation site setting device, according to the positional information of the peristome that is obtained, and the corresponding relation of above-mentioned matte coordinate system and substrate coordinate system, set the installation site of electronic component on substrate.
5. installation system according to claim 1 is characterized in that:
Also comprise, matte position deriving means, substrate at the electronic component installation exercise position that is positioned above-mentioned erecting device, measure the wherein position of a part of paste coated on this substrate, the coordinate system of employed matte is corresponding to the position of above-mentioned erecting device when obtaining this coating of substrates paste
Above-mentioned installation site setting device, according to the positional information of the peristome that is obtained, and the position of the matte coordinate system that is obtained, set the installation site of electronic component on substrate.
6. the installation method of an electronic component is characterized in that:
The matte that electronic component is installed in through being formed with peristome has printed on the substrate of paste,
This installation method comprises,
Peristome position obtaining step obtains the positional information of formed peristome on the matte from the manufacturing data of matte;
Step is set in the installation site, according to the positional information of the peristome that is obtained, sets the installation site of electronic component on substrate;
Installation steps are installed in electronic component on the installation site that sets.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006002230 | 2006-01-10 | ||
| JP2006002230A JP4629584B2 (en) | 2006-01-10 | 2006-01-10 | Mounting system and electronic component mounting method |
| JP2006-002230 | 2006-01-10 |
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| Publication Number | Publication Date |
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| CN101001518A true CN101001518A (en) | 2007-07-18 |
| CN101001518B CN101001518B (en) | 2010-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100014112A Active CN101001518B (en) | 2006-01-10 | 2007-01-05 | Installation system and installation method of electronic element |
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| Country | Link |
|---|---|
| JP (1) | JP4629584B2 (en) |
| CN (1) | CN101001518B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101001518B (en) | 2010-10-20 |
| JP2007184450A (en) | 2007-07-19 |
| JP4629584B2 (en) | 2011-02-09 |
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