CN103582314B - Automatic capping machine platform system and automatic capping method - Google Patents
Automatic capping machine platform system and automatic capping method Download PDFInfo
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- CN103582314B CN103582314B CN201210262854.8A CN201210262854A CN103582314B CN 103582314 B CN103582314 B CN 103582314B CN 201210262854 A CN201210262854 A CN 201210262854A CN 103582314 B CN103582314 B CN 103582314B
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Abstract
The present invention proposes a kind of automatic capping machine platform system and automatic capping method, automatic capping machine platform system carries out at least second time reflow for putting after multiple metal cap body has the circuit motherboard of the sub-plate of multiple circuit in one, and this automatic capping machine platform system comprises a worktable, a location seat, a load bearing seat, help weldering pallet and an absorbing unit. Location seat is for putting described multiple metal cap body and is covered in a shade of described multiple metal cap body. Load bearing seat is for putting this circuit motherboard. Help weldering pallet for holding soldering flux. Absorbing unit comprises a permanent seat being arranged on this worktable, one is arranged at the moving assembly of this permanent seat and multiple adsorption piece being arranged at this moving assembly removablely, this moving assembly move back and forth in this location seat, this help weldering pallet and this load bearing seat between. It is uneven and be misplaced the problem of skew that the automatic capping machine platform system that the present invention proposes and automatic capping method can avoid sticking during artificial upper cover soldering flux, it is to increase produces good rate.
Description
Technical field
The present invention relates to a kind of automatic capping machine platform system and automatic capping method, espespecially a kind of in order to put multiple metal cap body in the automatic capping machine platform system of circuit motherboard and automatic capping method.
Background technology
General circuit motherboard, it has the sub-plate of multiple circuit, and the packaging component on the sub-plate of each circuit needs underfill (Underfill), and underfill solidification value is 165 degree, takes more than 105 minutes, could solidify completely. But the reflow temperature of surface adhering technical (SMT) technique is about 250 degree, the reflow time is 5 minutes, therefore when the first time reflow of SMT technique, just cannot directly add upper cover body, need to wait that underfill is after toasting and solidify, add upper cover body more separately on the sub-plate of each circuit, to carry out at least second time reflow.
Existing upper cover method is upper cover to manually, as shown in Figure 1, first provides a carrying platform 10 ", and put a circuit motherboard 20 " in carrying platform 10 " on. As shown in Figure 2, put a shade 30 " in circuit motherboard 10 ", and detain tool 101 with two first " detain shade 30 ". As shown in Figure 3, a vacuum is taken to inhale pen 40 to manually " primary sorption metal cap body 50 " go to stick soldering flux 60 ". As shown in Figure 4, put metal cap body 50 " in circuit motherboard 20 " and on a sub-plate 201 of circuit ". The step of Fig. 3 to Fig. 4 need to repeat 24 times, to put each metal cap body 50 " in the sub-plate 201 of each circuit " on. As shown in Figure 5, Figure 6, put a pressing element 70 " in described multiple metal cap body 50 " on, and detain tool 102 with four the 2nd " detain, to carry out second time reflow.
But, existing upper cover method has many following stated to lack fraud:
(1) adsorbing metal lid body goes to stick soldering flux to manually, the soldering flux sticked bottom metal cap body is often inconsistent, stick excessive soldering flux circuit card to be caused contaminated and affect its electrical specification, stick very few soldering flux and metal cap body can be caused to float the situation producing missing solder.
(2) put metal cap body to manually on the sub-plate of circuit, metal cap body often can be caused to put skew, and at substantial man-hour, reducing production efficiency, quality also cannot be guaranteed.
(3) after repeatedly reflow, because the overdraft of shade and pressing element is inconsistent, and a large amount of tin cream is easily caused to stick the side in metal cap body, and it is excessive to put pressure, it is easy to some soldering paste is squeezed out and forms tin pearl.
So, it is an object of the invention to propose automatic capping machine platform system and the automatic capping method of a kind of reasonable in design and effective above-mentioned defect of improvement.
Summary of the invention
It is an object of the present invention to provide a kind of automatic capping machine platform system and automatic capping method, avoid sticking during artificial upper cover soldering flux uneven and be misplaced the problem of skew, and production efficiency and good rate can be improved.
In order to reach described above, the present invention provides a kind of automatic capping machine platform system, carries out at least second time reflow for putting after multiple metal cap body has the circuit motherboard of the sub-plate of multiple circuit in one, and this automatic capping machine platform system comprises a worktable, one location seat, is arranged at the side of this worktable, for putting described multiple metal cap body and be covered in a shade of described multiple metal cap body, one load bearing seat, is arranged at another side of this worktable, for this circuit motherboard of storing, one helps weldering pallet, is arranged at this worktable, for accommodation soldering flux, one absorbing unit, comprise a permanent seat being arranged on this worktable, one is arranged at the moving assembly of this permanent seat removablely, and multiple adsorption piece being arranged at this moving assembly, this moving assembly moves back and forth in this location seat, this helps weldering pallet, and between this load bearing seat, when this moving assembly by this location seat move to this help weldering pallet time, the described multiple metal cap body being positioned on this location seat and this shade of being covered in described multiple metal cap body are adsorbed to this and help weldering pallet by described multiple adsorption piece, bottom for described multiple metal cap body sticks this soldering flux, when this moving assembly helps weldering pallet to move to this load bearing seat by this, described multiple adsorption piece puts described multiple metal cap body and this shade being covered in described multiple metal cap body this circuit motherboard on this load bearing seat, so that described multiple metal cap body respectively put by the sub-plate of described multiple circuit of this circuit motherboard.
The present invention also provides a kind of automatic capping method, comprises the following steps:
One worktable is provided, and arranges and one help weldering pallet on this worktable, be positioned at this and help weldering pallet both sides that one location seat and a load bearing seat are set, and put a circuit motherboard with the sub-plate of multiple circuit in this load bearing seat; Put multiple metal cap body on this location seat; Lid establishes a shade in the described multiple metal cap body being positioned on this location seat; An absorbing unit is utilized the described multiple metal cap body being positioned on this location seat and this shade of being covered in described multiple metal cap body to be adsorbed in the lump and move to this and help weldering pallet, and the bottom making described multiple metal cap body sticks the soldering flux being positioned at this and helping weldering pallet; This absorbing unit is utilized described multiple metal cap body and this shade of being covered in described multiple metal cap body to be adsorbed in the lump and move this circuit motherboard being placed on this load bearing seat, so that described multiple metal cap body respectively put by the sub-plate of described multiple circuit of this circuit motherboard; And this circuit motherboard on this load bearing seat, the described multiple metal cap body being placed on this circuit motherboard and this shade of being covered in described multiple metal cap body are carried out secondary returning weldering in the lump.
From the above, by automatic capping machine platform system and the automatic capping method of the present invention, man-hour can be saved in a large number, significantly promote production efficiency and produce good rate, avoid the situation causing quality instability because of manual type upper cover.
Technology, method and effect that set object takes is reached in order to further understand the present invention, refer to following detailed explanation for the present invention, accompanying drawing, believe the object of the present invention, feature and feature, when can thus be goed deep into and concrete understanding, but appended accompanying drawing only provides with reference to and use is described, not it is used for this being created in addition restriction person.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the carrying platform of prior art.
Fig. 2 is the schematic diagram of the shade of prior art.
Fig. 3 is the schematic diagram of a vacuum suction adsorbing metal lid body of prior art.
Fig. 4 is the schematic diagram of the metal cap body storing of prior art.
Fig. 5 is the schematic diagram that metal cap body pushed down by the pressing element of prior art.
Fig. 6 is the cross-sectional schematic of prior art.
Fig. 7 is the schematic perspective view of the automatic capping machine platform system of the present invention.
The location seat that Fig. 8 is the automatic capping machine platform system of the present invention puts the schematic perspective view having metal cap body.
Fig. 9 is the schematic perspective view that the metal cap body of the automatic capping machine platform system of the present invention is coated with shade.
Figure 10 be the automatic capping machine platform system of the present invention absorbing unit start in locate seat time schematic diagram.
Figure 10 A be the automatic capping machine platform system of the present invention absorbing unit in the lump adsorbing metal lid body and shade time cross-sectional schematic.
Figure 11 be the automatic capping machine platform system of the present invention absorbing unit start in help weldering pallet time schematic diagram.
Figure 12 is the absorbing unit start of the automatic capping machine platform system of the present invention schematic diagram when load bearing seat.
Figure 12 A is cross-sectional schematic during absorbing unit storing metal cap body and the shade of the automatic capping machine platform system of the present invention.
Figure 13 is that the absorbing unit of the automatic capping machine platform system of the present invention completes to put and resets in the schematic diagram of starting position.
Figure 14 is the schema of the automatic capping method of the present invention.
Wherein, description of reference numerals is as follows:
(prior art)
Carrying platform 10 "
Circuit motherboard 20 "
The sub-plate 201 of circuit "
Shade 30 "
Vacuum inhales pen 40 "
Metal cap body 50 "
Soldering flux 60 "
Pressing element 70 "
First button tool 101 "
2nd button tool 102 "
(the present invention)
Worktable 10
Location seat 20
Location groove 201
Positioning pin 202
Load bearing seat 30
Help weldering pallet 40
Soldering flux 401
Smear dish 45
Accommodating groove 451
Scraper 452
Absorbing unit 50
Permanent seat 501
Moving assembly 502
First moves part 5021
2nd moves part 5022
Adsorption piece 5023
Metal cap body 60
Shade 70
Pilot hole 701
Opening 702
Circuit motherboard 80
The sub-plate 801 of circuit
Start button 90
Embodiment
Refer to Fig. 7 to Figure 10, the present invention provides a kind of automatic capping machine platform system, this automatic capping machine platform system is applicable to have the circuit motherboard of the sub-plate of multiple circuit after first time reflow, put metal cap body in the sub-plate of each circuit, to carry out at least second time reflow, this automatic capping machine platform system comprises worktable 10, location seat 20, load bearing seat 30, and helps weldering pallet 40 and an absorbing unit 50.
Location seat 20 is arranged at the side of worktable 10. Specifically, location seat 20 has 24 location grooves 201 and four positioning pins 202,24 metal cap body 60 are placed in described multiple location groove 201 respectively, so that (such as Fig. 8) is put in described multiple metal cap body 60 location, and described multiple metal cap body 60 is coated with a shade 70 (such as Fig. 9), this shade 70 has four pilot holes 701, described multiple pilot hole 701 is corresponding four positioning pins 202 respectively, and described multiple positioning pin 202 is placed through described multiple pilot hole 701, so that this shade 70 location is put. By described multiple location groove 201 and described multiple positioning pin 202, make described multiple metal cap body 60 and this shade 70 can not produce the situation being misplaced or offseting. It should be noted that, the number of above-mentioned location groove 210 and metal cap body 60 does not limit, and can determine quantity according to the design requirement of circuit card, and the present embodiment signal metal cap body 60 and location groove 210 are respectively 24.
Again, shade 70 has multiple opening 702, and described multiple opening 702 corresponds respectively to described multiple metal cap body 60, and described multiple opening 702 is not more than the top surface area of described multiple metal cap body 60.
Load bearing seat 30 is arranged at another side of worktable 10, for putting a circuit motherboard 80. Specifically, the circuit motherboard 80 of the present embodiment has 24 sub-plates 801 of circuit, and the sub-plate 801 of described multiple circuit takes advantage of four row modes to arrange with six row, and aforementioned location groove 201 is also arrange in the same manner, with the sub-plate 801 of each circuit of correspondence.
Weldering pallet 40 is helped to be arranged at worktable 10 and between location seat 20 and load bearing seat 30, help weldering pallet 40 for accommodation soldering flux 401. In more detail, help weldering pallet 40 comprise one can be arranged at moving horizontally this help weldering pallet 40 smear dish 45, this smears the accommodating groove 451 that dish 45 has an accommodation soldering flux 401. In addition, smearing dish 45 and more can arrange a scraper 452 (such as Figure 10), the effect for evenly floating soldering flux 401 is better.
Absorbing unit 50 comprises a permanent seat being arranged on worktable 10 501, and is arranged at the moving assembly 502 of this permanent seat 501 and multiple adsorption piece 5023 (such as Figure 10 A) being arranged at this moving assembly 502 removablely. Moving assembly 502 moves back and forth in location seat 20, helps between weldering pallet 40 and load bearing seat 30. Illustrate in detail, moving assembly 502 have one move along X-axis direction first move that part 5021 and moves along Y-axis direction the 2nd move part 5022, and this moving assembly 502 drives by servomotor (figure is slightly), but is not limited. Adsorption piece 5023 is be installed in the 2nd of moving assembly 502 to move the bottom of part 5022 and correspond respectively to described multiple metal cap body 60 (such as Figure 10 A), in the present embodiment, adsorption piece 5023 is multiple vacuum slot, but do not limit in this, only must tool identical function, such as sucker or magnetic attraction element. Again, in the present embodiment, the quantity of vacuum slot is the quantity of corresponding described multiple metal cap body 60, by arranging 24 vacuum slots, 24 metal cap body 60 can be adsorbed simultaneously, removed from and manually once can only adsorb a metal cap body 60, man-hour can be saved in a large number.
In addition, worktable 10 more arranges two startup buttons 90, need to press two startup buttons 90 simultaneously, just can make absorbing unit 50 start, can really reach fool proof effect.
Function mode and the principle of the present invention are as follows:
Refer to Figure 10 to Figure 13, when automatic capping machine platform system of the present invention moving assembly 502 by location seat 20 above move to help weldering pallet 40 time, the described multiple metal cap body 60 being positioned on the seat 20 of location and the shade 70 that is covered in described multiple metal cap body 60 are adsorbed to and help weldering pallet 40 by described multiple adsorption piece 5023 together, for sticking soldering flux 401. in more detail, the top surface area of described multiple metal cap body 60 it is not more than by described multiple opening 702, described multiple adsorption piece 5023 can adsorb described multiple metal cap body 60 through described multiple opening 702, and and then take up the shade 70 being covered in described multiple metal cap body 60, and while adsorption piece 5023 adsorbs, smear the scraper 452 on dish 45 and evenly floating can be extruded into the soldering flux 401 helped in weldering pallet 40 in accommodating groove 451, the bottom of described multiple metal cap body 60 is made can evenly to stick soldering flux 401, whereby, metal cap body 60 can not be made to stick excessive soldering flux 401 and cause circuit motherboard 80 contaminated and affect its electrical specification, also metal cap body 60 can not be made to stick very few soldering flux 401 and produce the situation of missing solder after causing second time reflow.
When moving assembly 502 is by when helping weldering pallet 40 to move to load bearing seat 30, described multiple adsorption piece 5023 puts described multiple metal cap body 60 and the shade 70 being covered in described multiple metal cap body 60 circuit motherboard 80 on load bearing seat 30, so that the sub-plate of each circuit 801 of this circuit motherboard 80 is respectively put described multiple metal cap body 60, and it is covered in described multiple metal cap body 60 by shade 70, described multiple metal cap body 60 can be pushed down in reflow process, described multiple metal cap body 60 can be avoided to produce unsettled and cause the situation of missing solder, moving assembly 502 resets in starting position after completing above-mentioned storing.
Referring to Figure 14, the present invention separately provides a kind of automatic capping method, comprises the following steps:
S101: as shown in Figure 7, one worktable 10 is provided, arranging one helps weldering pallet 40 on worktable 10, and arranges a location seat 20 and load bearing seat 30 being positioned at and helping weldering pallet 40 both sides, and puts a circuit motherboard 80 with the sub-plate 801 of multiple circuit in load bearing seat 30.
S103: as shown in Figures 7 and 8, puts multiple metal cap body 60 on the seat 20 of location. In more detail, putting before multiple metal cap body 60, form multiple location groove 201 and multiple positioning pin 202 in location seat 20, then put and locate described multiple metal cap body 60 in described multiple location groove 201.
S105: as can be seen from figures 8 and 9, lid establishes a shade 70 in the above-mentioned metal cap body 60 being positioned to locate on seat 20. In more detail, form multiple opening 702 in shade 70, described multiple opening 702 is corresponding described multiple metal cap body 60 respectively, and described multiple opening 702 is not more than the top surface area of described multiple metal cap body 60, and multiple pilot holes 701 of shade 70 are corresponded respectively to described multiple positioning pin 202.
S107: as shown in Figures 9 to 11, an absorbing unit 50 is utilized the described multiple metal cap body 60 being positioned on the seat 20 of location and the shade 70 that is covered in described multiple metal cap body 60 to be adsorbed in the lump and move to and help weldering pallet 40, and the bottom making described multiple metal cap body 60 sticks the soldering flux 401 being positioned at and helping weldering pallet 40. Explanation is in detail, absorbing unit 50 comprises multiple adsorption piece 5023 (such as Figure 10 A), described multiple adsorption piece 5023 can be multiple vacuum slot, utilize vacuum slot to pass described multiple opening 702 vacuum suck and play described multiple metal cap body 60, and and then take up the shade 70 being covered in described multiple metal cap body 60, in addition, one brush dish 45 is more set in helping weldering pallet 40, utilizes and smear that scraper 452 on dish 45 is evenly floating is extruded into the soldering flux 401 helped in weldering pallet 40 in an accommodating groove 451.
S109: as shown in Figure 12 to Figure 13, absorbing unit 50 is utilized described multiple metal cap body 60 and the shade 70 that is covered in described multiple metal cap body 60 to be adsorbed in the lump and move to load bearing seat 30, and put described multiple metal cap body 60 and shade 70 circuit motherboard 80 (such as Figure 12 A) on load bearing seat 30, so that the sub-plate of multiple circuit 801 of this circuit motherboard 80 is respectively put described multiple metal cap body 60.
S110: as shown in Figure 12 to Figure 13, crosses tin stove in the lump by the circuit motherboard 80 on load bearing seat 30, the described multiple metal cap body 60 being placed on this circuit motherboard 80 and the shade 70 that is covered in described multiple metal cap body 60 and carries out secondary returning weldering.
Moving assembly 502 resets in starting position after completing above-mentioned storing.
In sum, the advantage of the present invention is at least: the automatic capping machine platform system utilizing the present invention, put described multiple metal cap body on the sub-plate of each circuit simultaneously, man-hour can be saved in a large number, significantly promote production efficiency, moreover, can avoid putting because of artificial, produce problems and cause the situation of quality instability. And the automatic capping machine platform system operation of the present invention is easy, only need to press two startup buttons simultaneously, just can complete automatic capping.
Only the foregoing is only the better embodiment of the present invention, it is not intended to limit to the right of this creation, therefore the equivalent technique variation such as using specification sheets of the present invention and accompanying drawing content to do, all it is included within the scope of the present invention, closes and give Chen Ming.
Claims (10)
1. an automatic capping machine platform system, carries out at least second time reflow for putting after multiple metal cap body has the circuit motherboard of the sub-plate of multiple circuit in one, it is characterised in that, this automatic capping machine platform system comprises:
One worktable;
One location seat, is arranged at the side of this worktable, is covered in the shade of described multiple metal cap body for storing described multiple metal cap body and;
One load bearing seat, is arranged at another side of this worktable, for this circuit motherboard of storing;
One helps weldering pallet, is arranged at this worktable, for accommodation soldering flux; And
One absorbing unit, comprise a permanent seat being arranged on this worktable, and be arranged at the moving assembly of this permanent seat and multiple adsorption piece being arranged at this moving assembly removablely, this moving assembly move back and forth in this location seat, this help weldering pallet and this load bearing seat between.
2. automatic capping machine platform system as claimed in claim 1, it is characterised in that, described multiple adsorption piece is multiple vacuum slot.
3. automatic capping machine platform system as claimed in claim 1, it is characterized in that, this location seat has multiple location groove and multiple positioning pin, and described multiple metal cap body is placed in described multiple location groove respectively, and this shade has multiple pilot hole, place for described multiple positioning pin.
4. automatic capping machine platform system as claimed in claim 1, it is characterised in that, this helps weldering pallet also to include one brush dish, and this is smeared dish and is arranged at this with moving horizontally helps weldering pallet.
5. automatic capping machine platform system as claimed in claim 1, it is characterised in that, this shade has multiple opening, and described multiple opening corresponds respectively to described multiple metal cap body, and described multiple opening is not more than the top surface area of described multiple metal cap body.
6. an automatic capping method, it is characterised in that, comprise the following steps:
One worktable is provided, and arranges and one help weldering pallet on this worktable, be positioned at this and help weldering pallet both sides that one location seat and a load bearing seat are set, and put a circuit motherboard with the sub-plate of multiple circuit in this load bearing seat;
Put multiple metal cap body on this location seat;
Lid establishes a shade in the described multiple metal cap body being positioned on this location seat;
An absorbing unit is utilized the described multiple metal cap body being positioned on this location seat and this shade of being covered in described multiple metal cap body to be adsorbed in the lump and move to this and help weldering pallet, and the bottom making described multiple metal cap body sticks the soldering flux being positioned at this and helping weldering pallet;
This absorbing unit is utilized described multiple metal cap body and this shade of being covered in described multiple metal cap body to be adsorbed in the lump and move this circuit motherboard being placed on this load bearing seat, so that described multiple metal cap body respectively put by the sub-plate of described multiple circuit of this circuit motherboard; And
This circuit motherboard on this load bearing seat, the described multiple metal cap body being placed on this circuit motherboard and this shade of being covered in described multiple metal cap body are carried out secondary returning weldering in the lump.
7. automatic capping method as claimed in claim 6, it is characterised in that, its step also comprises and arranges multiple adsorption piece in this absorbing unit, and utilizes described multiple adsorption piece described multiple metal cap body of absorption.
8. automatic capping method as claimed in claim 6, it is characterized in that, its step also comprises and forms multiple location groove and multiple positioning pin in this location seat, put and locate described multiple metal cap body in described multiple location groove, lid establishes this shade in described multiple metal cap body, and the multiple pilot holes making this shade correspond respectively to described multiple positioning pin.
9. automatic capping method as claimed in claim 6, it is characterised in that, its step also comprises and arranges one brush dish and help weldering pallet in this, utilize this scraper smearing on dish evenly floating this help this soldering flux in weldering pallet.
10. automatic capping method as claimed in claim 7, it is characterized in that, its step also comprises being formed and multiple is opened on this shade, described multiple opening corresponds respectively to described multiple metal cap body, and described multiple opening is not more than the top surface area of described multiple metal cap body, utilize described multiple adsorption piece to adsorb described multiple metal cap body through described multiple opening, and then take up this shade being covered in described multiple metal cap body.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210262854.8A CN103582314B (en) | 2012-07-26 | 2012-07-26 | Automatic capping machine platform system and automatic capping method |
| TW101128710A TWI487447B (en) | 2012-07-26 | 2012-08-09 | An auto-shielding lid mounting machine system and auto-shielding lid mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210262854.8A CN103582314B (en) | 2012-07-26 | 2012-07-26 | Automatic capping machine platform system and automatic capping method |
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| Publication Number | Publication Date |
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| CN103582314A CN103582314A (en) | 2014-02-12 |
| CN103582314B true CN103582314B (en) | 2016-06-08 |
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| CN201210262854.8A Active CN103582314B (en) | 2012-07-26 | 2012-07-26 | Automatic capping machine platform system and automatic capping method |
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| TW (1) | TWI487447B (en) |
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| TWI583609B (en) * | 2015-06-30 | 2017-05-21 | All Ring Tech Co Ltd | Method and mechanism of electronic component loading and unloading |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102248244A (en) * | 2010-07-29 | 2011-11-23 | 深圳科安达电子科技股份有限公司 | Fully-automatic tin soldering machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3803556B2 (en) * | 2001-03-26 | 2006-08-02 | 日本電気株式会社 | Ball transfer device and ball alignment device |
| KR20040033847A (en) * | 2002-10-16 | 2004-04-28 | 삼성전자주식회사 | Apparatus for fixing Lead frame for plating device |
| JP2006026759A (en) * | 2004-07-13 | 2006-02-02 | Ishikawajima Harima Heavy Ind Co Ltd | Welding system |
| CN2783708Y (en) * | 2005-01-31 | 2006-05-24 | 李贵宾 | Synthetic base board for SMT production line |
| JP2006339388A (en) * | 2005-06-01 | 2006-12-14 | Yamaha Motor Co Ltd | Method for managing packaging work, packaging line and packaging machine |
| JP4629584B2 (en) * | 2006-01-10 | 2011-02-09 | ヤマハ発動機株式会社 | Mounting system and electronic component mounting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102248244A (en) * | 2010-07-29 | 2011-11-23 | 深圳科安达电子科技股份有限公司 | Fully-automatic tin soldering machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI487447B (en) | 2015-06-01 |
| CN103582314A (en) | 2014-02-12 |
| TW201406247A (en) | 2014-02-01 |
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