CN218783933U - Composite structure and high-temperature adhesive tape paper during heating and bonding of circuit piece - Google Patents

Abstract

The utility model relates to a composite construction and high temperature sticky tape paper during heating bonding formula circuit piece, wherein composite construction is including bonding subbase and circuit piece, the back of circuit piece through conductive silver glue with the bonding subbase bonds, still is equipped with the middleware, the middleware includes in close contact with's barrier layer and adsorbed layer, the barrier layer is polytetrafluoroethylene or high temperature sticky tape, the adsorbed layer is the paper, and the barrier layer closely laminates with the front of circuit piece, is equipped with in close contact with's briquetting at the barrier layer back of the body of adsorbed layer. To the circuit board that adopts the electrically conductive silver glue to bond, the utility model discloses can improve the work efficiency who handles the residue on the heating back circuit board to the human cost and time cost have been reduced by a wide margin.

Description

Composite structure and high-temperature adhesive tape paper during heating and bonding of circuit piece

Technical Field

The utility model relates to a when heating the circuit chip in the circuit chip bonding technology, a composite construction that circuit chip and relevant part formed, composite construction and high temperature sticky tape paper when specifically saying so the heating bonding type circuit chip.

Background

In the micro-assembly process of the circuit chip product, two schemes of adhering the circuit chip by conductive silver adhesive or welding the circuit chip by soldering tin are generally adopted; wherein in the scheme that adopts the electrically conductive silver glue to bond the circuit piece, at first the back coating electrically conductive silver glue of circuit piece, bond the back of circuit piece on the bonding base of forms such as bottom plate or cavity, because electrically conductive silver glue can pass through the hole in the middle of the circuit piece, and the gap between circuit piece and the bonding base spills over the front that the circuit piece spills over to be attached to the circuit, influence the function of circuit piece, consequently can adopt the structure of some separation electrically conductive silver glues to protect the positive circuit of circuit piece, prevent circuit and electrically conductive silver glue direct contact. This is typically done in one of several ways:

1. cutting and molding paper with the size of A4 along the shape of a pressing block or a circuit piece by using a cutter or laser, then paving the paper on the front side of the bonded circuit piece, pressing the pressing block on the paper, and integrally putting the paper into an oven for heating;

2. cutting and molding polytetrafluoroethylene along the shape of the pressing block or the circuit piece by using a cutter or laser, then paving the polytetrafluoroethylene on the front surface of the bonded circuit piece, pressing the pressing block on the polytetrafluoroethylene, and integrally putting the pressing block into an oven for heating;

3. bonding a high-temperature adhesive tape at the bottom of a pressing block, directly pressing the pressing block on the front side of the bonded circuit chip, and integrally putting the circuit chip into an oven for heating;

the above solutions have the following problems in practical production:

1. with the scheme of paper, after toasting the completion, can have very much, tiny wastepaper to glue on the circuit board with the in-process that paper was got rid of, need press from both sides with tweezers and get or the alcohol is wiped, need expend more time cost and human cost, and get rid of the effect not too good.

2. According to the scheme of polytetrafluoroethylene and the high-temperature adhesive tape, after baking is completed, due to the fact that epoxy resin exists in conductive silver adhesive, the epoxy resin volatilizes in the heating process, is adsorbed on a surface circuit of a circuit piece, needs to be wiped by alcohol, needs to consume more time cost and labor cost, and is not good in removing effect.

Therefore, a great deal of labor and time are needed for processing the bonded circuit pieces (removing the residual epoxy resin and paper residues on the baked circuit pieces), and the production efficiency is greatly reduced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a composite construction and high temperature sticky tape paper during heating bonding formula circuit piece to after the improvement adopted conductive silver glue bonding circuit piece and heating, the work efficiency of the last residue of treatment circuit piece, and reduce human cost and time cost.

The utility model discloses composite construction during heating bonding formula circuit piece, including bonding subbase and circuit piece, the back of circuit piece through conductive silver glue with the bonding subbase bonds, still is equipped with the middleware, the middleware includes close contact's barrier layer and adsorbed layer, the barrier layer is polytetrafluoroethylene or high temperature sticky tape, the adsorbed layer is the paper, and the barrier layer closely laminates with the front of circuit piece, is equipped with close contact's briquetting at the barrier layer back of the body of adsorbed layer.

The briquetting can also be compressed tightly through modes such as clip or C type clamp outside briquetting and bonding subbase, further guarantees the steadiness that the circuit piece bonded. The barrier layer of polytetrafluoroethylene or high temperature sticky tape is arranged in the separation electrically conductive silver glue and spills over to the front of circuit piece and adheres to the circuit on, and the paper through the adsorbed layer adsorbs the epoxy that volatilizees from polytetrafluoroethylene or high temperature sticky tape simultaneously, guarantees the positive clean of circuit piece. After the pressing block and the intermediate piece are removed finally, the front face of the circuit piece is free of paper scraps and epoxy resin pollution, manual cleaning is not needed, finished products are directly formed, and production efficiency is greatly improved.

In the above scheme, when the barrier layer is made of polytetrafluoroethylene or a common high-temperature adhesive tape, as the polytetrafluoroethylene or the common high-temperature adhesive tape is smooth and thin, in the process of stacking the polytetrafluoroethylene or the common high-temperature adhesive tape on the front surface of the circuit sheet, partial wrinkles may exist, which may cause the situation of voids, non-uniformity and the like between the polytetrafluoroethylene or the high-temperature adhesive tape and the circuit sheet, and the barrier layer cannot completely play a role in blocking, and finally affects circuit performance indexes. Therefore, it is preferable that the barrier layer is only provided as a high temperature adhesive tape, and the high temperature adhesive tape is a PET high temperature adhesive tape. The PET high-temperature adhesive tape has certain viscosity and certain hardness, is convenient to lay and level, and after being bonded with the front surface of a circuit piece, the surface of the circuit piece is level and smooth, and the conditions of cavities and the like can not occur.

On the basis of the structure, the PET high-temperature adhesive tape of the blocking layer is bonded with the paper of the adsorption layer into a whole. Thus, the paper is more favorable for adsorbing the epoxy resin volatilized by the PET high-temperature adhesive tape, and the integrated structure is more convenient for operating the middleware.

Furthermore, a plurality of holes are formed in the paper of the adsorption layer. Therefore, the area of the paper for adsorbing the epoxy resin can be increased, and the epoxy resin can be absorbed more fully.

The utility model also provides a high temperature sticky tape paper for above-mentioned composite construction has high temperature sticky tape and the paper of pasting as an organic whole, the appearance of high temperature sticky tape and paper suits with the appearance of circuit chip. The high-temperature adhesive tape and the paper which are stuck into a whole are more beneficial to the paper to adsorb the epoxy resin volatilized from the high-temperature adhesive tape.

Preferably, the high-temperature adhesive tape is a PET high-temperature adhesive tape which has certain viscosity and certain hardness, so that the high-temperature adhesive tape is convenient to lay and level, and after being bonded with the front surface of the circuit piece, the surface of the circuit piece is level and smooth, and the situations such as cavities can not occur.

On the basis, the paper is provided with a plurality of holes, so that the epoxy resin can be absorbed more fully.

The beneficial effects of the utility model include:

1. the front surface of the heated circuit piece is free from paper scraps and epoxy resin pollution, manual cleaning is not needed, finished products are directly formed, and the production efficiency is greatly improved.

2. The PET high-temperature adhesive tape is convenient to lay flat when being used with a house, and after being bonded with the front surface of a circuit chip, the surface of the circuit chip is flat, and the situations of cavities and the like can be avoided.

3. Through being equipped with a plurality of holes on the paper, can effectively increase paper and adsorb epoxy's area, more abundant absorb epoxy.

Drawings

Fig. 1 is a schematic structural diagram of the composite structure when the bonded circuit board of the present invention is heated.

Fig. 2 is a schematic structural diagram of the intermediate member in fig. 1 (which is a schematic structural diagram of the high-temperature adhesive tape of the present invention).

FIG. 3 is a pictorial representation of an adhesive substrate.

Fig. 4 is a circuit diagram of a circuit wafer.

Fig. 5 is a real image of the cut paper.

FIG. 6 is a block diagram.

Fig. 7 is a view showing a rear surface of the circuit chip bonded to the bonding base.

FIG. 8 is a diagram of a cut paper with holes.

Description of reference numerals:

1-bonding a substrate; 2-a circuit chip; 3-middleware; 31-an adsorption layer; 32-a barrier layer; and 4-briquetting.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. The described embodiments are only some embodiments of the present application and not all embodiments. The components of embodiments of the present application, generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.

Example 1:

as shown in fig. 1 and 2, the utility model discloses composite construction when heating bonding formula circuit piece, including bonding subbase 1 and circuit piece 2, the back of circuit piece 2 pass through conductive silver glue with bonding subbase 1 bonds, still is equipped with middleware 3, middleware 3 includes in close contact with's barrier layer 32 and adsorbed layer 31, barrier layer 32 is polytetrafluoroethylene or high temperature sticky tape, adsorbed layer 31 is the paper, and barrier layer 32 closely laminates with circuit piece 2's front, and the barrier layer 32 of adsorbed layer 31 is equipped with in close contact with's briquetting 4 back of the body.

In this embodiment, the bonding base 1 is an object diagram as shown in fig. 3, and is a cavity structure, the circuit chip 2 is shown in fig. 4, the paper is ordinary A4 paper, the A4 paper and polytetrafluoroethylene (or high temperature adhesive tape) are cut and formed by using a laser cutting technology, and the cut and formed paper is an object diagram as shown in fig. 5. After the back surface of the circuit chip 2 shown in fig. 6 (the front surface of the circuit chip 2 shown in fig. 6) is coated with the conductive silver paste, the conductive silver paste is placed in the bonding base 1 of the cavity structure shown in fig. 3 and bonded, and the bonded structure is shown in fig. 7. Then, polytetrafluoroethylene (or high temperature tape), A4 paper shown in fig. 5, and a press block shown in fig. 6 were sequentially placed on the front surface of the circuit chip 2 bonded to the bonding base 1. The pressing block 4 can be pressed by a clamp or a C-shaped clamp and the like outside the pressing block 4 and the bonding substrate 1, so that the bonding stability of the circuit chip 2 is further ensured. And finally, putting the whole composite structure into an oven for heating.

The barrier layer 32 of polytetrafluoroethylene or high temperature sticky tape is arranged in separating electrically conductive silver glue and spills over to the circuit on the circuit is adhered to in 2 fronts of circuit board in middleware 3, adsorbs the epoxy who volatilizees from polytetrafluoroethylene or high temperature sticky tape through the paper of adsorbed layer 31 simultaneously, guarantees the positive clean of circuit board 2. And after the pressing block 4 and the intermediate piece 3 are removed finally, the front surface of the circuit piece 2 is free of paper scraps and pollution of epoxy resin, manual cleaning is not needed, finished products are directly formed, and the production efficiency is greatly improved.

Example 2:

in example 1, when the barrier layer 32 is made of ptfe or a common high temperature adhesive tape, since ptfe or the common high temperature adhesive tape is smooth and thin, there may be wrinkles in some portions during stacking on the front surface of the circuit sheet 2, which may cause voids, unevenness, and the like between the circuit sheet and the circuit sheet 2, and thus the barrier effect cannot be fully achieved, and the circuit performance index is ultimately affected. Therefore, the barrier layer 32 is provided as a PET high temperature tape on the basis of example 1. The PET high-temperature adhesive tape has certain viscosity and certain hardness, is convenient to lay and level, and after being bonded with the front surface of the circuit chip 2, the surface of the circuit chip 2 is level, and the situations such as cavities can not occur.

Example 3:

in addition to example 2, the PET high temperature tape of the barrier layer 32 and the paper of the absorbent layer 31 were integrally bonded to each other. Thus, the paper is more favorable for adsorbing the epoxy resin volatilized by the PET high-temperature adhesive tape, and the integrated structure is more convenient for operating the middleware 3.

Example 4:

in addition to the above embodiments, as shown in fig. 8, the paper of the absorption layer 31 is further provided with a plurality of holes. Therefore, the area of the paper for adsorbing the epoxy resin can be increased, and the epoxy resin can be absorbed more fully.

Example 5:

the utility model also provides a high temperature sticky tape paper for above-mentioned composite construction, as shown in FIG. 2, have and paste high temperature sticky tape and paper as an organic whole, the paper is ordinary A4 paper, adopts the laser cutting technique to cut A4 paper and high temperature sticky tape, and the appearance of cutting the back high temperature sticky tape and paper suits with the appearance of the circuit chip 2 that is shown in FIG. 4. The high-temperature adhesive tape and the paper which are stuck into a whole are more beneficial to the paper to adsorb the epoxy resin volatilized from the high-temperature adhesive tape.

Example 6:

on the basis of embodiment 5, the high-temperature adhesive tape is a PET high-temperature adhesive tape, which has certain viscosity and certain hardness, so that the PET high-temperature adhesive tape is easy to lay and level, and after being bonded with the front surface of the circuit piece 2, the surface of the circuit piece 2 is level and smooth, and the situations such as a cavity can not occur. The paper can be provided with a plurality of holes as shown in fig. 8, so that the epoxy resin can be absorbed more fully.

The above-mentioned embodiments only express the specific embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for those skilled in the art, it is possible to make various changes and modifications without departing from the technical idea of the present application, and these changes and modifications are all within the scope of the present application.

Claims (7)

1. Composite construction when heating bonding formula circuit chip, including bonding subbase (1) and circuit chip (2), the back of circuit chip (2) pass through the conductive silver glue with bonding subbase (1) bonds, characterized in that: still be equipped with middleware (3), middleware (3) are including close contact's barrier layer (32) and adsorbed layer (31), barrier layer (32) are polytetrafluoroethylene or high temperature sticky tape, adsorbed layer (31) are the paper, and barrier layer (32) closely laminate with the front of circuit piece (2), are equipped with close contact's briquetting (4) on the back of the body in barrier layer (32) of adsorbed layer (31).

2. A composite structure when heating bonded circuit pieces as claimed in claim 1, wherein: when the barrier layer (32) is a high-temperature adhesive tape, the high-temperature adhesive tape is a PET high-temperature adhesive tape.

3. A thermally bonded circuit chip composite structure as claimed in claim 2, wherein: the PET high-temperature adhesive tape of the barrier layer (32) and the paper of the adsorption layer (31) are bonded into a whole.

4. A composite structure in heating bonding of circuit chips as claimed in any one of claims 1 to 3, wherein: the paper of the adsorption layer (31) is provided with a plurality of holes.

5. High temperature adhesive tape for use in a composite structure according to any one of claims 1 to 4, characterized in that: the high-temperature adhesive tape and the paper are stuck together, and the shapes of the high-temperature adhesive tape and the paper are matched with the shape of the circuit chip (2).

6. A high temperature adhesive tape as claimed in claim 5, wherein: the high-temperature adhesive tape is a PET high-temperature adhesive tape.

7. A high temperature adhesive tape as defined in claim 5 or 6 wherein: the paper is provided with a plurality of holes.

Images