CN106739404A - A kind of applying method of solid-state glued membrane - Google Patents
A kind of applying method of solid-state glued membrane Download PDFInfo
- Publication number
- CN106739404A CN106739404A CN201611105657.XA CN201611105657A CN106739404A CN 106739404 A CN106739404 A CN 106739404A CN 201611105657 A CN201611105657 A CN 201611105657A CN 106739404 A CN106739404 A CN 106739404A
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- glued membrane
- high temperature
- solid
- flexure strip
- state glued
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of applying method of solid-state glued membrane, it is comprised the following steps：One press equipment is provided, high temperature resistant flexure strip is provided with its pressing platform；Thing to be fit is placed on the high temperature resistant flexure strip；The glue-line side of solid-state glued membrane is fitted towards the thing to be fit, and is carried out hot pressing, completed laminating.A kind of applying method of solid-state glued membrane, it sets a high temperature resistant flexure strip on pressing platform or sets high temperature resistant flexure strip in thing bottom to be fit, then solid-state glued membrane is in pressing, because flexure strip has certain regulatory function, in unbalance stress, flexure strip keeps the uniform force of pressure head and thing to be fit by elastic deformation amount so that solid-state glued membrane can uniformly be covered in thing surface to be fit, be conducive to the production of next process.
Description
Technical field
The present invention relates to solid-state glue laminating technology field, a kind of more particularly to laminating side of solid-state glued membrane
Method.
Background technology
Fingerprint identification technology is now into a development golden period, wherein being occupied an leading position with glue laminating cover plate.But
There are problems that excessive glue, starved and glue using glue laminating fingerprint recognition module.With the development of social science and technology, people
Performance to fingerprint module and attractive in appearance propose requirement higher.Therefore, the solid-state glued membrane laminating in fingerprint recognition is applied to answer
Transport and give birth to, but inclined because abutted equipment, laminating platform inclination and fingerprint module exist in itself so that solid-state glued membrane is in laminating
During unbalance stress, cause when mould release membrance is torn easy degumming and produce a large amount of bubbles.This not only reduces production efficiency, also influences
Electrical measurement yield.The presence of these problems is all unfavorable for the popularization and application of solid-state glued membrane coating technique.
The content of the invention
The technical problems to be solved by the invention there is provided a kind of applying method of solid-state glued membrane, be set on pressing platform
Put a high temperature resistant flexure strip or thing bottom to be fit set high temperature resistant flexure strip, then solid-state glued membrane pressing when, because of flexure strip
With certain regulatory function, in unbalance stress, flexure strip keeps receiving for pressure head and thing to be fit by elastic deformation amount
Power uniformity so that solid-state glued membrane can uniformly be covered in thing surface to be fit, be conducive to the production of next process.
The technical problems to be solved by the invention are achieved by the following technical programs：
The invention provides a kind of applying method of solid-state glued membrane, it is comprised the following steps：
One press equipment is provided, high temperature resistant flexure strip is provided with its pressing platform；
Thing to be fit is placed on the high temperature resistant flexure strip；
The glue-line side of solid-state glued membrane is fitted towards the thing to be fit, and is carried out hot pressing, completed laminating.
The a kind of of the applying method of the solid-state glued membrane provided as the present invention is improved, and resistance to height is set on the pressing platform
Warm flexure strip is specially：Clean the pressing platform surface；The pasted with high temperature-resistant flexure strip on the pressing platform.
The a kind of of the applying method of the solid-state glued membrane provided as the present invention improves, and pastes resistance on the high temperature resistant flexure strip
High temperature gummed tape；Wherein, the High temperature-resistanadhesive adhesive tape is smooth inviscid face away from the side of the high temperature resistant flexure strip.
Present invention also offers a kind of applying method of solid-state glued membrane, it is comprised the following steps：
One press equipment is provided；
Thing to be fit is placed on the pressing platform of the press equipment, the thing to be fit presses the one of platform towards described
Side is provided with high temperature resistant flexure strip；
The glue-line side of solid-state glued membrane is fitted towards the thing to be fit, and is carried out hot pressing, completed laminating.
The a kind of of the applying method of the solid-state glued membrane provided as the present invention improves, and in the high temperature resistant flexure strip and waits to paste
High temperature-resistanadhesive adhesive tape is posted between compound；Wherein, the High temperature-resistanadhesive adhesive tape is smooth nothing away from the side of the high temperature resistant flexure strip
Adhesive faces.
The a kind of of the applying method of the solid-state glued membrane provided as the present invention improves, and the thickness of the high temperature resistant flexure strip is
0.03~2mm。
The a kind of of the applying method of the solid-state glued membrane provided as the present invention improves, and also includes tearing described solid automatically after hot pressing
The step of heavy film on state glued membrane.
The a kind of of the applying method of the solid-state glued membrane provided as the present invention improves, and the thing to be fit is fingerprint module,
The laminating corresponding with the glue-line of the solid-state glued membrane upward of its induction chip.
The present invention has the advantages that：
The applying method of solid-state glued membrane, a high temperature resistant flexure strip is set on pressing platform or resistance to height is set in thing bottom to be fit
Warm flexure strip, then in pressing, because flexure strip has certain regulatory function, in unbalance stress, flexure strip leads to solid-state glued membrane
Cross elastic deformation amount to keep the uniform force of pressure head and thing to be fit so that solid-state glued membrane can uniformly be covered in thing to be fit
Surface, face is smooth when being conducive to the production of next process to tear heavy film automatically, will not produce degumming and a large amount of bubbles, enters
One step improves laminating effect.
All kinds of high temperature resistants and to have a resilient material more, i.e., possess fast restoration capabilities after stress is heated on the market,
Ensure that the performance of material is constant simultaneously, and the heeling error of regulation is needed during laminating at 0 ~ 40 μm, therefore high temperature resistant is elastic
Piece alternative is more；It is preferred that elastomeric material is also equipped with good toughness and certain hardness.
By adding flexure strip, production efficiency is not interfered with, and production yield can also be improved, save production cost.
The fingerprint module produced using the method, greatly improves the production efficiency of producing line, while carry reducing glue
Influence of the film to product electrical measurement yield, the method is simple and easy to apply, is conducive to being widely popularized.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of the applying method of solid-state glued membrane of the present invention；
Fig. 2 is another schematic flow sheet of the applying method of solid-state glued membrane of the present invention；
Fig. 3 be solid-state glued membrane of the present invention applying method in press front and rear principle schematic.
Specific embodiment
Solid-state glued membrane applies the existing applying method in fingerprint recognition module, due to abutted equipment, pressing platform inclination with
And thing to be fit has inclination in itself so that glued membrane unbalance stress during laminating, cause the face when heavy film is torn uneven
Whole easy degumming and a large amount of bubbles of generation, this not only reduces production efficiency, also influences the yield of thing to be fit, the presence of these problems
All it is unfavorable for the popularization and application of solid-state glued membrane coating technique.
In order to solve the defect of above-mentioned existing applying method, the invention provides a kind of applying method of solid-state glued membrane, its
Increase by one layer of high temperature resistant flexure strip 2 between thing to be fit 3 and pressing platform 1, as shown in figure 3, when solid-state glued membrane 4 is pressed,
The position flexure strip of first stress is first deformed upon, and fills non-part of the force, is so adjusted by the deformation quantity of flexure strip 2 flat
The tilt tolerance that platform 1 and thing to be fit 3 itself are present, makes the uniform force of glued membrane 4 on the surface of thing to be fit 3, so not only effective
The bonding strength of glued membrane 4 is solved, while solving the problems, such as that the coating surface of glued membrane 4 remains a large amount of bubbles；Be conducive to lower one work
The production of sequence is that face is smooth when tearing heavy film automatically, will not produce degumming and a large amount of bubbles, further improves laminating effect.It is logical
Increase flexure strip is crossed, production efficiency is not interfered with not only, the Anawgy accuracy of thing to be fit can also be improved, increase product is attractive in appearance,
Advantage plus its low cost is more beneficial for promoting.
In order to reduce the pollution rate of thing to be fit, high-temperature plastic is posted between the high temperature resistant flexure strip and thing to be fit
Band；Wherein, the High temperature-resistanadhesive adhesive tape is smooth inviscid face away from the side of the high temperature resistant flexure strip, prevents high temperature resistant elasticity
Pollution when the issuable molecule of piece is fitted to thing to be fit.
The thing to be fit is thicker, and corresponding high temperature resistant flexure strip is thicker, the thickness of the present invention preferably high temperature resistant flexure strip
Selected between 0.03 to 2 mm.
With reference to embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention,
It is not limitation of the invention.
Embodiment 1
As shown in figure 1, a kind of applying method of solid-state glued membrane is present embodiments provided, and as a example by applying in fingerprint module, its bag
Include following steps：
Step 11, one press equipment of offer, high temperature resistant flexure strip is provided with its pressing platform.
When implementing, the press equipment is the existing equipment of pressing when solid-state glued membrane is fitted, and the present embodiment only exists
It presses and a high temperature resistant flexure strip is provided with platform, therefore the press equipment that will not be described in detail herein.
High temperature resistant flexure strip is set on the pressing platform to comprise the following steps that：First the laminating platform is used dustless
Cloth dips in alcohol washes；The pasted with high temperature-resistant flexure strip on the pressing platform；According to the thickness of different fingerprint modules, high temperature resistant bullet
The thickness of property piece can be selected between 0.03 to 2 mm.
Preferably, High temperature-resistanadhesive adhesive tape is also pasted on the high temperature resistant flexure strip；Wherein, the High temperature-resistanadhesive adhesive tape is away from described
The side of high temperature resistant flexure strip is smooth inviscid face, when preventing the issuable molecule of flexure strip from being fitted to fingerprint module
Pollution.
Preferably, the vacuum hole pair with the pressing platform is additionally included on the high temperature resistant flexure strip and high-temperature plastic band
The step of answering position to get through Kong Bingyong alcohol washes, the loading plate of fingerprint module is fixed with vacuum suction.Fitted in automation
Cheng Zhong, the loading plate is used to carry the fingerprint module, and drives the fingerprint module to be transmitted between each operation.
Step 12, fingerprint module is placed on the high temperature resistant flexure strip.
When implementing, the fingerprint module can be directly placed on the high temperature resistant flexure strip, it is also possible to by holding
Support plate is placed on the high temperature resistant flexure strip indirectly, in automated process, it is preferred to use loading plate is carried and transmits institute
Fingerprint module is stated, i.e., the loading plate that described abutted equipment can will carry the fingerprint module by fixed mechanism is fixed on described
On high temperature resistant flexure strip.The fixed mechanism is preferred but is not limited to vacuum suction.
Step 13, the glue-line side of solid-state glued membrane is fitted towards the fingerprint module, and carried out hot pressing, completed patch
Close.
Existing solid-state glued membrane is big volume solid-state glued membrane, light-duty diaphragm that it includes carrying, is attached to the light-duty protection
Several glue-lines on film and the heavy film on each glue-line；The shape size of the glue-line enters according to fingerprint module
Row selection, can be square（Such as 13.6*13.6mm, 11.6*11.6mm）Or racetrack（13.45*6.45mm）Etc..
When implementing, the step 13 is specifically included：
Step 131, the pressure head of the press equipment draw a heavy film, drive correspondence glue-line to be automatically separated with light-duty diaphragm.
Be fitted in glue-line correspondence on the fingerprint module and carry out precompressed by step 132, the pressure head；The temperature setting of pressure head
At 25 ~ 80 DEG C.
The pressure head temperature of this step is selected according to the bonding characteristic of the glue-line；If having viscosity under the glue-line normal temperature,
Then pressure head carries out precompressed in normal temperature state；If without viscosity under the glue-line normal temperature, pressure head enters under being in uniform temperature
Row precompressed.
Step 133, the pressure certain to pressure head applying, while putting forward high-head temperature, carry out this pressure, so that glued membrane is uniform
It is fitted on fingerprint module surface.
The ram pressures and temperature of this step are selected according to the bonding characteristic of the glue-line, generally, the pressure head
Pressure is 50 ~ 90N, and pressure head temperature is 100 ~ 130 DEG C, and pressing time is 5 ~ 10s, and the present embodiment uses 80N pressure, and 120 DEG C high
Temperature and pressure close 8s to realize effect of preferably fitting.
Step 14, the heavy film is torn automatically.
This step can stand alone as next process, be realized using another automatic film tearing equipment；Laminating can also be integrated in
Operation, will automatic film tearing mechanism be integrated on the abutted equipment to realize.This belongs to those skilled in the art
Known technology, will not be described in detail herein.
, there is fraction defective and is mainly the appearance when heavy film is torn automatically, such as in the attaching process of solid-state glued membrane in the prior art
Glued membrane pressing is bad, and glue-line can produce substantial amounts of bubble to have a strong impact on laminating effect when tearing heavy film, or even take away glue-line, not only
Reduce production efficiency and have a strong impact on production yield, cause scrap by the gross.
Also include the step of carrying out hot pressing after fit relative with etc. cover plate 15 when implementing, after step 14, obtain fingerprint
Module.Specially：The ink surface of cover plate is sticked to form fingerprint module with the fingerprint module for posting glue-line using pressure head hot pressing.For
Solidification effect is good, and solidification baking procedure is also included after the hot pressing, will fingerprint module be put into baking box, carry out solidification baking
Roasting, baking temperature is 60 ~ 180 DEG C, and baking time is 15 ~ 180min, it is preferred that carried out under certain air pressure environment, is such as pressed
Power scope is 0.2 ~ 0.7Mpa, it is possible to reduce bubble is produced during laminating.
By 20,000 performance tests of fingerprint module, the solid-state glued membrane of Henkel glued membrane, glued membrane laminate pressure 8KG, pressure are used
Area 1.3*1.3 cm2 are closed, film surface does not have an obvious bubble after 20,000 fingerprint modules pressings, and it is without exception to tear heavy film,
Adhesion strength is strong, good stability, and yields is close to 100%.
Embodiment 2
As shown in Fig. 2 a kind of applying method of solid-state glued membrane is present embodiments provided, and as a example by applying in fingerprint module, its bag
Include following steps：
Step 21, one press equipment of offer.
When implementing, the press equipment is the existing equipment of pressing when solid-state glued membrane is fitted, therefore no longer detailed herein
State.
Step 22, fingerprint module is placed on the pressing platform of the press equipment, the fingerprint module is towards described
The side for pressing platform is provided with high temperature resistant flexure strip.
In automated process, it is preferred to use loading plate is carried and transmits the fingerprint module, i.e., described abutted equipment
The loading plate that can will carry the fingerprint module by fixed mechanism is fixed on the high temperature resistant flexure strip.The fixed machine
Structure is preferred but is not limited to vacuum suction.
When implementing, the high temperature resistant flexure strip is arranged on the loading plate, i.e., positioned at the loading plate and fingerprint
Between module.According to the thickness of different fingerprint modules, the thickness of high temperature resistant flexure strip can be selected between 0.03 to 2 mm.
Preferably, fitted with the fingerprint module fixation through High temperature-resistanadhesive adhesive tape in the high temperature resistant flexure strip, prevent resistance to height
Pollution when the warm issuable molecule of flexure strip is fitted to fingerprint module.
Step 23, the glue-line side of solid-state glued membrane is fitted towards the fingerprint module, and carried out hot pressing, completed patch
Close.
Existing solid-state glued membrane is big volume solid-state glued membrane, light-duty diaphragm that it includes carrying, is attached to the light-duty protection
Several glue-lines on film and the heavy film on each glue-line；The shape size of the glue-line enters according to fingerprint module
Row selection, can be square（Such as 13.6*13.6mm, 11.6*11.6mm）Or racetrack（13.45*6.45mm）Etc..
When implementing, the step 23 is specifically included：
Step 231, the pressure head of the press equipment draw a heavy film, drive correspondence glue-line to be automatically separated with light-duty diaphragm.
Be fitted in glue-line correspondence on the fingerprint module and carry out precompressed by step 232, the pressure head；The temperature setting of pressure head
At 25 ~ 80 DEG C.
The pressure head temperature of this step is selected according to the bonding characteristic of the glue-line；If having viscosity under the glue-line normal temperature,
Then pressure head carries out precompressed in normal temperature state；If without viscosity under the glue-line normal temperature, pressure head enters under being in uniform temperature
Row precompressed.
Step 233, the pressure certain to pressure head applying, while putting forward high-head temperature, carry out this pressure, so that glued membrane is uniform
It is fitted on fingerprint module surface.
The ram pressures and temperature of this step are selected according to the bonding characteristic of the glue-line, generally, the pressure head
Pressure is 50 ~ 90N, and pressure head temperature is 100 ~ 130 DEG C, and pressing time is 5 ~ 10s, and the present embodiment uses 80N pressure, and 120 DEG C high
Temperature and pressure close 8s to realize effect of preferably fitting.
Step 24, the heavy film is torn automatically.
This step can stand alone as next process, be realized using another automatic film tearing equipment；Laminating can also be integrated in
Operation, will automatic film tearing mechanism be integrated on the abutted equipment to realize.This belongs to those skilled in the art
Known technology, will not be described in detail herein.
, there is fraction defective and is mainly the appearance when heavy film is torn automatically, such as in the attaching process of solid-state glued membrane in the prior art
Glued membrane pressing is bad, and glue-line can produce substantial amounts of bubble to have a strong impact on laminating effect when tearing heavy film, or even take away glue-line, not only
Reduce production efficiency and have a strong impact on production yield, cause scrap by the gross.
Also include the step of carrying out hot pressing after fit relative with etc. cover plate 25 when implementing, after step 24, obtain fingerprint
Module.Specially：The ink surface of cover plate is sticked to form fingerprint module with the fingerprint module for posting glue-line using pressure head hot pressing.For
Solidification effect is good, and solidification baking procedure is also included after the hot pressing, will fingerprint module be put into baking box, carry out solidification baking
Roasting, baking temperature is 60 ~ 180 DEG C, and baking time is 15 ~ 180min, it is preferred that carried out under certain air pressure environment, is such as pressed
Power scope is 0.2 ~ 0.7Mpa, it is possible to reduce bubble is produced during laminating.
By 20,000 performance tests of fingerprint module, the solid-state glued membrane of Henkel glued membrane, glued membrane laminate pressure 8KG, pressure are used
Area 1.3*1.3 cm2 are closed, film surface does not have an obvious bubble after 20,000 fingerprint modules pressings, and it is without exception to tear heavy film,
Adhesion strength is strong, good stability；Because high temperature resistant flexure strip exists always in whole processing procedure, this is resistance to during being fitted with cover plate
High temperature elastomeric piece is served the same role and further improve laminating effect, and yields can reach 100%.But compared with Example 1,
Relative cost is higher.
Comparative example 1
The present embodiment is applying method of the existing solid-state glued membrane on fingerprint module, and specifically, the difference with embodiment 1 exists
In：Remove high temperature resistant flexure strip, i.e., high temperature resistant flexure strip is not set on the pressing platform.
Tested, using the solid-state glued membrane of Henkel glued membrane, glued membrane laminate pressure 8KG presses area 1.3*1.3 cm2,
The obvious bubble of film surface appearance and the fraction defective for tearing heavy film appearance exception etc. are up to 50% after 20000 fingerprint module pressings.
It is worth noting that, the applying method of solid-state glued membrane of the present invention is not only to apply and fingerprint module and cover plate
Laminating, be also applied for the solid-state glued membrane laminating of other modules or object.
Embodiment described above only expresses embodiments of the present invention, and its description is more specific and detailed, but can not
Therefore the limitation to the scope of the claims of the present invention is interpreted as, as long as the skill obtained in the form of equivalent or equivalent transformation
Art scheme, all should fall within the scope and spirit of the invention.
Claims (8)
1. a kind of applying method of solid-state glued membrane, it is comprised the following steps：
One press equipment is provided, high temperature resistant flexure strip is provided with its pressing platform；
Thing to be fit is placed on the high temperature resistant flexure strip；
The glue-line side of solid-state glued membrane is fitted towards the thing to be fit, and is carried out hot pressing, completed laminating.
2. the applying method of solid-state glued membrane according to claim 1, it is characterised in that set resistance on the pressing platform
High temperature elastomeric piece is specially：Clean the pressing platform surface；The pasted with high temperature-resistant flexure strip on the pressing platform.
3. the applying method of solid-state glued membrane according to claim 2, it is characterised in that pasted on the high temperature resistant flexure strip
High temperature-resistanadhesive adhesive tape；Wherein, the High temperature-resistanadhesive adhesive tape is smooth inviscid face away from the side of the high temperature resistant flexure strip.
4. a kind of applying method of solid-state glued membrane, it is comprised the following steps：
One press equipment is provided；
Thing to be fit is placed on the pressing platform of the press equipment, the thing to be fit presses the one of platform towards described
Side is provided with high temperature resistant flexure strip；
The glue-line side of solid-state glued membrane is fitted towards the thing to be fit, and is carried out hot pressing, completed laminating.
5. the applying method of solid-state glued membrane according to claim 4, it is characterised in that in the high temperature resistant flexure strip and treat
High temperature-resistanadhesive adhesive tape is posted between laminating thing；Wherein, the High temperature-resistanadhesive adhesive tape is smooth away from the side of the high temperature resistant flexure strip
Inviscid face.
6. according to the applying method of any described solid-state glued membrane of claim 1 to 5, it is characterised in that the high temperature resistant elasticity
The thickness of piece is 0.03 ~ 2mm.
7. according to the applying method of any described solid-state glued membrane of claim 1 to 5, it is characterised in that also include certainly after hot pressing
Move the step of tearing the heavy film on the solid-state glued membrane.
8. according to the applying method of any described solid-state glued membrane of claim 1 to 5, it is characterised in that the thing to be fit is
Fingerprint module, the laminating corresponding with the glue-line of the solid-state glued membrane upward of its induction chip.
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| CN201611105657.XA CN106739404A (en) | 2016-12-05 | 2016-12-05 | A kind of applying method of solid-state glued membrane |
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| CN201611105657.XA CN106739404A (en) | 2016-12-05 | 2016-12-05 | A kind of applying method of solid-state glued membrane |
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| CN111605175A (en) * | 2020-04-20 | 2020-09-01 | 昆山易泰薄膜装饰有限公司 | Decoration process and decoration device for attaching decoration adhesive film |
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| CN107877876A (en) * | 2017-12-15 | 2018-04-06 | 昆山建皇光电科技有限公司 | LGA products automatic assembling and packaging technology |
| CN111605175A (en) * | 2020-04-20 | 2020-09-01 | 昆山易泰薄膜装饰有限公司 | Decoration process and decoration device for attaching decoration adhesive film |
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Application publication date: 20170531 |