TWI487447B - An auto-shielding lid mounting machine system and auto-shielding lid mounting method - Google Patents

Description

Automatic capping machine system and automatic capping method

The invention relates to an automatic capping machine system and an automatic capping method, in particular to an automatic capping machine system and an automatic capping method for placing a plurality of metal caps on a circuit motherboard.

A typical circuit mother board has several circuit daughter boards. The package components on each circuit board require an underfill, and the underfill has a curing temperature of 165 degrees, which takes more than 105 minutes to complete. Cured. However, the reflow temperature of the surface mount technology (SMT) process is about 250 degrees, and the reflow time is 5 minutes. Therefore, it is impossible to directly add the cover to the first reflow of the SMT process, and it is necessary to wait for the underfill to be baked. After curing, a cover body is additionally added to each circuit board for at least a second reflow.

The conventional upper cover method is to manually cover the upper cover. As shown in FIG. 1, a loading platform 10" is first provided, and a circuit mother board 20" is placed on the carrying platform 10". As shown in FIG. The mask 30" is on the circuit mother board 10", and the two masks 101" are used to fasten the mask 30". As shown in FIG. 3, a vacuum pen 40" is manually held to adsorb a metal cover 50 at a time. "Go to the flux 60". As shown in FIG. 4, a metal sub-board 200" is placed on the circuit board 20". The steps of FIG. 3 to FIG. 4 are repeated twenty-four times to place each metal cover. 50" is on each circuit board 201". As shown in FIG. 5 and FIG. 6, a presser 70" is placed on the metal covers 50" and fastened by four second clips 102". For the second reflow.

However, the conventional method of capping has many of the following drawbacks:

(1) The metal cover is manually adsorbed to adhere the flux, and the flux adhered to the bottom of the metal cover is often inconsistent. Excessive adhesion of the flux may cause the board to be contaminated and affect its electrical characteristics, and the adhesion is too small. Flux can cause the metal cover to float and create an empty weld.

(2) Manually placing the metal cover on the circuit board often causes the metal cover to be placed offset, and it takes a lot of man-hours to reduce production efficiency and quality.

(3) After repeated reflow, because the under pressure of the mask and the presser is inconsistent, it is easy to cause a large amount of solder paste to adhere to the side of the metal cover, and the placement pressure is too large, so that a part of the solder paste is easily squeezed. Form a tin bead.

The reason is that the present inventors have felt that the above-mentioned defects can be improved, and the present invention has been put forward with great interest and research, and finally proposes a present invention which is reasonable in design and effective in improving the above-mentioned defects.

It is an object of the present invention to provide an automatic capping machine system and an automatic capping method, which avoids the problem of uneven flux and misalignment of the flux when the cap is manually applied, and can improve production efficiency and yield.

In order to achieve the above, the present invention provides an automatic capping machine system for placing at least a second metal back cover on a circuit mother board having a plurality of circuit boards for at least a second reflow. The machine system includes a work station; a positioning seat is disposed on one side of the work table for placing the metal cover body and covering one of the metal cover bodies; a carrier is disposed on the The other side of the workbench for the placement of the circuit motherboard; a soldering tray disposed on the workbench for assistance a absorbing unit comprising: a fixing base disposed on the working table, a moving component movably disposed on the fixing base, and a plurality of absorbing members disposed on the moving component, the moving component reciprocating Between the positioning seat, the fluxing tray, and the carrier, when the moving component is moved from the positioning seat to the welding tray, the adsorption members will cover the metal cover on the positioning seat and cover the metal cover The cover of the metal cover is adsorbed to the soldering tray for the bottom of the metal cover to adhere to the flux, and when the moving component is moved from the soldering tray to the carrier, the adsorbing members Laying the metal cover body and the circuit mother board covering the metal cover body to cover the metal base body, so that the circuit boards of the circuit mother board are respectively provided with the metal cover bodies .

The invention also provides a method for automatically capping, comprising the steps of: providing a workbench, and providing a soldering tray on the workbench, positioning a positioning seat and a carrier on both sides of the soldering tray, and placing one a circuit board of the circuit board is disposed on the carrier; a plurality of metal covers are disposed on the positioning seat; a cover is disposed on the metal covers that are positioned on the positioning seat; and an adsorption unit is utilized The metal cover on the positioning base and the cover covering the metal cover are respectively adsorbed and moved into the soldering tray, and the bottom of the metal cover is adhered to the soldering a flux in the tray; the metal cover and the cover covering the metal cover are respectively adsorbed and moved by the adsorption unit to the circuit mother board placed on the carrier, so that the circuit mother The circuit boards of the board are respectively provided with the metal covers; and the circuit boards on the carrier, the metal covers placed on the circuit board, and the metal covers The cover on the cover is doubled together Reflow.

According to the above, the automatic capping machine system and the automatic capping method of the invention can save a lot of man-hours, greatly improve the production efficiency and the production yield, and avoid the situation that the quality is unstable due to the manual cover.

In order to further understand the technology, method and effect of the present invention in order to achieve the intended purpose, reference should be made to the detailed description and drawings of the present invention. It is understood that the drawings are only for the purpose of illustration and description and are not intended to limit the invention.

Referring to FIG. 7 to FIG. 10, the present invention provides an automatic capping machine system, which is suitable for a circuit board having a plurality of circuit sub-boards, after a first reflow, placing a metal cover body thereon Each circuit daughter board is subjected to at least a second reflow process. The automatic capping machine system includes a work table 10, a positioning base 20, a carrier 30, a fluxing tray 40, and an adsorption unit 50.

The positioning seat 20 is disposed on one side of the table 10. In detail, the positioning base 20 has twenty-four positioning recesses 201 and four positioning legs 202, and twenty-four metal cover bodies 60 are respectively placed on the positioning recesses 201, so that the metal cover bodies 60 are provided. The position of the metal cover 60 is covered by a cover 70 (FIG. 9). The cover 70 has four positioning holes 701, and the positioning holes 701 respectively correspond to the four positioning pins 202. And the positioning pins 202 are disposed on the positioning holes 701 to position the mask 70. The metal cover 60 and the mask 70 are not misaligned or caused by the positioning grooves 201 and the positioning pins 202. The case of offset. It should be noted that the number of the positioning recess 210 and the metal cover 60 is not limited, and may be determined according to the design requirements of the circuit board. In this embodiment, the metal cover 60 and the positioning recess 210 are each twenty-four. One.

Moreover, the mask 70 has a plurality of openings 702 corresponding to the metal covers 60, and the openings 702 are not larger than the surface area above the metal covers 60.

The carrier 30 is disposed on the other side of the table 10 for placing a circuit mother board 80. In detail, the circuit mother board 80 of the embodiment has twenty-four circuit sub-boards 801, and the circuit sub-boards 801 are arranged in six rows by four columns. The positioning recesses 201 are also arranged in the same manner to Corresponding to each circuit daughter board 801.

The soldering tray 40 is disposed on the table 10 and located between the positioning seat 20 and the carrier 30, and the soldering tray 40 is configured to receive the flux 401. In more detail, the soldering tray 40 includes a wiper disc 45 that is horizontally movably disposed on the soldering tray 40, and the wiper disc 45 has a receiving groove 451 that accommodates the flux 401. In addition, the wiper 45 can be further provided with a doctor blade 452 (Fig. 10) for better smoothing of the flux 401.

The adsorption unit 50 includes a fixing base 501 disposed on the table 10, a moving assembly 502 movably disposed on the fixing base 501, and a plurality of adsorption members 5023 disposed on the moving assembly 502 (FIG. 9A). The moving assembly 502 reciprocates between the positioning seat 20, the fluxing tray 40, and the carrier 30. In detail, the moving component 502 has a first moving member 5021 that moves in the X-axis direction and a direction along the Y-axis. The second moving member 5022 is moved, and the moving member 502 is driven by a servo motor (not shown), but is not limited. The absorbing member 5023 is disposed at the bottom of the second moving member 5022 of the moving component 502 and corresponds to the metal cover 60 (FIG. 10A). In this embodiment, the absorbing member 5023 is a plurality of vacuum nozzles, but To be limited to this, it is only necessary to have the same function, such as a suction cup or a magnetic element. Moreover, in the embodiment, the number of the vacuum nozzles corresponds to the number of the metal cover bodies 60. By providing twenty-four vacuum nozzles, the twenty-four metal cover bodies 60 can be simultaneously adsorbed, thereby eliminating the manual. Only one metal cover 60 can be attracted at a time, which can save a lot of man-hours.

In addition, the worktable 10 is further provided with two start buttons 90, and the two start buttons 90 need to be pressed at the same time, so that the adsorption unit 50 can be activated, and the foolproof effect can be surely achieved.

The operation mode and principle of the present invention are as follows: Referring to FIG. 10 to FIG. 13, when the moving component 502 of the automatic capping machine system of the present invention is moved from above the positioning seat 20 to the fluxing tray 40, the adsorption members 5023 will be positioned. The metal cover 60 on the seat 20 and the cover 70 covering the metal cover 60 are adsorbed to the soldering tray 40 for adhering the flux 401. In more detail, the openings 720 are not larger than the surface area of the metal cover 60, and the adsorption members 5023 can absorb the metal covers 60 through the openings 720, and then cover the metal cover 60. The mask 70 of the metal cover 60, and while the adsorption member 5023 is adsorbed, the blade 452 on the wiper 45 can evenly smooth the flux 401 extruded from the accommodating groove 451 into the soldering tray 40. The bottom of the metal cover 60 can uniformly adhere the flux 401, whereby the metal cover 60 is not adhered to the excess flux 401, the circuit mother board 80 is contaminated to affect its electrical characteristics, and the metal cover 60 is not adhered to the flux 401. The case of empty welding after the second reflow.

When the moving component 502 is moved from the soldering tray 40 to the carrier 30, the adsorbing members 5023 place the metal cover 60 and the circuit cover covering the mask 70 of the metal cover 60 on the carrier 30. The board 80 is disposed such that each of the circuit boards 801 of the circuit board 80 is placed on the metal cover 60 and covered by the mask 70 on the metal cover 60, which can be used in the reflow process. The metal cover 60 is pressed to prevent the metal cover 60 from being suspended and the air welding is caused. The moving assembly 502 is reset to the initial position after the placement is completed.

Referring to FIG. 14, the present invention further provides an automatic capping method, comprising the following steps:

S101: As shown in FIG. 7, a workbench 10 is provided, a soldering tray 40 is disposed on the workbench 10, and a positioning seat 20 and a carrier 30 are disposed on both sides of the soldering tray 40, and a number is placed The circuit mother board 80 of the circuit daughter board 801 is on the carrier 30.

S103: As shown in FIGS. 7 and 8, a plurality of metal covers 60 are placed on the positioning base 20. In more detail, before the plurality of metal covers 60 are placed, a plurality of positioning recesses 201 and a plurality of positioning legs 202 are formed on the positioning base 20, and the metal cover bodies 60 are placed and positioned in the positioning recesses. Slot 201.

S105: As shown in FIG. 8 and FIG. 9, a mask 70 is disposed on the metal cover 60 that has been positioned on the positioning base 20. In more detail, several are formed The openings 702 are corresponding to the masks 70. The openings 702 respectively correspond to the metal cover bodies 60, and the openings 702 are not larger than the surface area of the metal cover bodies 60, and the plurality of positioning holes 701 of the mask 70 are respectively corresponding to the openings 702. The positioning legs 202 are located.

S107: As shown in FIG. 9 to FIG. 11, the metal cover 60 on the positioning base 20 and the cover 70 covering the metal cover 60 are adsorbed and moved to the welding by an adsorption unit 50. The inside of the tray 40 and the bottom of the metal covers 60 are adhered to the flux 401 located in the soldering tray 40. In detail, the adsorption unit 50 includes a plurality of adsorption members 5023 (as shown in FIG. 10A ), and the adsorption members 5023 can be a plurality of vacuum nozzles. The vacuum nozzles are used to vacuum-adsorb the metal covers through the openings 702. 60, and then the cover 70 covering the metal cover 60 is further provided. Further, a wiper 45 is further disposed on the soldering tray 40, and is evenly smeared from a receiving groove 451 by the scraper 452 on the wiper 45. The flux 401 is extruded into the soldering tray 40.

S109: As shown in FIG. 12 to FIG. 13 , the metal cover 60 and the cover 70 covering the metal cover 60 are adsorbed and moved to the carrier 30 by the adsorption unit 50, and the metal is placed. The cover 60 and the cover 70 are on the circuit board 80 (see FIG. 12A) on the carrier 30 such that the plurality of circuit boards 801 of the circuit board 80 are placed with the metal covers 60.

S110: As shown in FIG. 12 to FIG. 13, the circuit mother board 80 on the carrier 30, the metal cover bodies 60 placed on the circuit mother board 80, and the metal cover bodies 60 are covered. The cover 70 is passed through a tin furnace for secondary reflow.

The moving component 502 is reset to the initial position after the above placement is completed.

In summary, the advantages of the present invention are at least that: by using the automatic capping machine system of the present invention, the metal cover bodies are placed on each circuit sub-board at the same time, which can save a lot of man-hours and greatly improve production efficiency. It can avoid situations in which the quality is unstable due to many problems caused by manual placement. Moreover, the automatic capping machine system of the present invention is easy to operate, and only needs to press two start buttons at the same time to complete the automatic capping.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent technical changes of the present invention and the contents of the drawings are included in the scope of the present invention. Combined with Chen Ming.

(previous technology)

10"‧‧‧ Carrying platform

20"‧‧‧ Circuit Motherboard

201”‧‧‧ Circuit Board

30"‧‧‧ mask

40"‧‧‧Vacuum pen

50"‧‧‧Metal cover

60"‧‧‧ Flux

70"‧‧‧Clamps

101”‧‧‧First buckle

102”‧‧‧Second buckle

(this invention)

10‧‧‧Workbench

20‧‧‧ Positioning Block

201‧‧‧ positioning groove

202‧‧‧ positioning feet

30‧‧‧Hosting

40‧‧‧welding tray

401‧‧‧ Flux

45‧‧‧ wipes

451‧‧‧ accommodating slots

452‧‧‧ scraper

50‧‧‧Adsorption unit

501‧‧‧ fixed seat

502‧‧‧Mobile components

5021‧‧‧First moving parts

5022‧‧‧Second moving parts

5023‧‧‧Adsorbed parts

60‧‧‧Metal cover

70‧‧‧ mask

701‧‧‧Positioning holes

702‧‧‧ openings

80‧‧‧circuit mother board

801‧‧‧ circuit board

90‧‧‧ start button

Figure 1 is a schematic illustration of a prior art carrier.

Figure 2 is a schematic illustration of a prior art mask.

Figure 3 is a schematic view of a prior art vacuum suction pen absorbing metal cover.

Figure 4 is a schematic illustration of the prior art metal cover placement.

Figure 5 is a schematic illustration of a prior art presser against a metal cover.

Figure 6 is a schematic cross-sectional view of the prior art.

Figure 7 is a perspective view of the automatic capping machine system of the present invention.

FIG. 8 is a perspective view showing the metal cover body of the positioning seat of the automatic capping machine system of the present invention.

Figure 9 is a perspective view showing the metal cover of the automatic capping machine system of the present invention covered with a mask.

FIG. 10 is a schematic view of the adsorption unit of the automatic capping machine system of the present invention actuated to the positioning seat.

FIG. 10A is a cross-sectional view showing the same when the adsorption unit of the automatic capping machine system of the present invention adsorbs the metal cover and the mask.

Figure 11 is a schematic view showing the operation of the adsorption unit of the automatic capping machine system of the present invention when the welding tray is actuated.

Figure 12 is a schematic view of the adsorption unit of the automatic capping machine system of the present invention actuated on the carrier.

12A is a cross-sectional view showing the metal cover body and the mask when the adsorption unit of the automatic capping machine system of the present invention is placed.

Figure 13 is a schematic view showing the suction unit of the automatic capping machine system of the present invention being placed and reset to the initial position.

Figure 14 is a flow chart of the automatic capping method of the present invention.

10‧‧‧Workbench

20‧‧‧ Positioning Block

201‧‧‧ positioning groove

202‧‧‧ positioning feet

30‧‧‧Hosting

40‧‧‧welding tray

401‧‧‧ Flux

45‧‧‧ wipes

451‧‧‧ accommodating slots

50‧‧‧Adsorption unit

501‧‧‧ fixed seat

502‧‧‧Mobile components

5021‧‧‧First moving parts

5022‧‧‧Second moving parts

80‧‧‧circuit mother board

801‧‧‧ circuit board

90‧‧‧ start button

Claims (10)

An automatic capping machine system for performing at least a second reflow after placing a plurality of metal caps on a circuit motherboard having a plurality of circuit sub-boards, the auto capping machine system comprising: a workbench; a positioning seat is disposed on one side of the working table for placing the metal cover body and a cover covering the metal cover bodies; a carrier seat is disposed on the other side of the work table for Locating the circuit board; a soldering tray disposed on the table for accommodating the flux; and an adsorption unit including a fixing seat disposed on the table and a movably disposed on the fixing base Moving the component, and a plurality of adsorbing members disposed on the moving component, the moving component reciprocating between the positioning seat, the soldering tray, and the carrier. The automatic capping machine of claim 1, wherein the adsorbing members are a plurality of vacuum nozzles. The automatic capping machine of claim 1, wherein the positioning seat has a plurality of positioning grooves and a plurality of positioning legs, wherein the metal covers are respectively placed in the positioning grooves, and the mask There are a plurality of positioning holes for the positioning pins to be worn. The automatic capping machine of claim 1, wherein the fluxing tray further comprises a wiper disk, the wiper plate being horizontally movably disposed on the fluxing tray. The automatic capping machine of claim 1, wherein the cover has a plurality of openings corresponding to the metal covers, respectively. And the openings are not larger than the surface area above the metal covers. An automatic capping method includes the following steps: providing a workbench, and providing a soldering tray on the workbench, positioning a positioning seat and a carrier on both sides of the soldering tray, and placing a plurality of circuit boards a circuit board is disposed on the carrier; a plurality of metal covers are disposed on the positioning seat; a cover is disposed on the metal covers that are positioned on the positioning seat; and the positioning is performed by using an adsorption unit The metal cover on the seat and the cover covering the metal cover are respectively adsorbed and moved into the soldering tray, and the bottom of the metal cover is adhered to the help of the soldering tray. a soldering agent; the metal cover body and the cover covering the metal cover bodies are respectively adsorbed and moved by the circuit board disposed on the carrier to make the circuit mother board The circuit boards are respectively disposed with the metal cover bodies; and the circuit mother board on the carrier base, the metal cover bodies disposed on the circuit mother board, and the metal cover bodies covering the metal cover bodies The cover is also subjected to secondary reflow. The automatic capping method of claim 6, wherein the step further comprises: arranging a plurality of adsorbing members on the adsorbing unit, and adsorbing the metal caps by using the adsorbing members. The method of the automatic capping method of claim 6, wherein the step further comprises: forming a plurality of positioning grooves and a plurality of positioning legs on the positioning seat, and positioning and positioning the metal cover bodies on the positioning grooves, Covering the mask to the metal cover bodies, and the plurality of positioning holes of the mask respectively correspond to the plurality of positioning holes Position the foot. The automatic capping method of claim 6, wherein the step further comprises: disposing a wiper disc on the soldering tray, and uniformly smoothing the flux in the soldering tray by using a scraper on the wiper disc. The automatic capping method of claim 7, the method further comprising: forming a plurality of openings in the mask, the openings respectively corresponding to the metal covers, and the openings are not larger than the metal covers The upper surface area is used to adsorb the metal covers through the openings, thereby bringing up the mask covering the metal covers.