CN102413673A - Method And System Of Managing Electronic Components Mounting Line - Google Patents
Method And System Of Managing Electronic Components Mounting Line Download PDFInfo
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- CN102413673A CN102413673A CN2011102094940A CN201110209494A CN102413673A CN 102413673 A CN102413673 A CN 102413673A CN 2011102094940 A CN2011102094940 A CN 2011102094940A CN 201110209494 A CN201110209494 A CN 201110209494A CN 102413673 A CN102413673 A CN 102413673A
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- substrate
- piece substrate
- piece
- name
- electronic unit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/10—Program control for peripheral devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Abstract
The invention provides a method and a system of managing an electronic components mounting line. After determined testing operation of multi-piece substrate (6) is realized in a screen process press (1), a substrate name of the multi-piece substrate (6) and a document having the substrate name are generated. Result information of the testing operation is stored in the generated document. And the document is sent to a data server (7). After the screen processing of the multi-piece (6) is finished, the multi-piece substrate (6) is transported to an electric component mounting device (2) and the substrate name corresponding to the multi-piece substrate is sent. The electric component mounting device (2) taking the received substrate name as a clue and obtains the result information of the testing operation from the corresponding document of through the data server (7) multi-piece substrate (6). The mounting operation of the electric components are realized on the transported multi-piece substrate (6) according to the result information.
Description
Technical field
The present invention relates to have the management method and the management system of carrying out with the electronic unit assembly line of a plurality of apparatus for work that the operation that electronic unit is associated is installed on multi-piece substrate, this multi-piece substrate has and by disjunction the time, is used as independently a plurality of baseplate parts of cutting apart of processing substrate.
Background technology
The management system of this electronic unit assembly line for example is disclosed in patent documentation 1 grade.In general, will be for the detected various data of the substrate of in the upstream operations device, producing, substrate position identifying information etc. for example when passing on this substrate at every turn, passes on this and to be sent to the downstream operation device simultaneously.
The prior art document
Patent documentation
Patent documentation 1: japanese patent laid-open 11-347859 communique
Summary of the invention
The problem that invention will solve
But; Will be for the detected various data of the substrate of in the upstream operations device, producing, when passing on this substrate at every turn and this pass on and be sent to simultaneously under the situation of downstream operation device, the amount of various data is for a long time; Call duration time is also long, causes the problem of the production efficiency reduction of such substrate.Particularly, be under the situation of multi-piece substrate when substrate, aforementioned detected various data volumes are many especially, existing problems.
Therefore; The objective of the invention is; According in the upstream operations device for the detected various data of multi-piece substrate, in downstream unit, this aforesaid base plate of having accepted is effectively utilized these various data and carries out under the situation of operation, improve the substrate production running efficiency.
Be used to solve the means of problem
Therefore; The 1st the invention be a kind of management method of electronic unit assembly line; Said electronic unit assembly line has and carries out and a plurality of apparatus for work that the operation that electronic unit is associated is installed on multi-piece substrate; Said multi-piece substrate has and by disjunction the time, is used as independently a plurality of baseplate parts of cutting apart of processing substrate, it is characterized in that said management method may further comprise the steps:
After the detection operation of in the upstream operations device in said electronic unit assembly line said multi-piece substrate having been carried out stipulating, make the file of substrate name and this substrate name of this multi-piece substrate,
The object information of said detection operation is stored in this file that has made,
The said file of having stored this object information is sent to data server,
When in said upstream operations device, being through with operation relevant, said multi-piece substrate being transported to the downstream operation device, and sending the said substrate name corresponding with this multi-piece substrate with the installation of electronic unit to said multi-piece substrate,
Said downstream operation device is with the said substrate that receives clue by name; From the said file corresponding, obtain the object information of said detection operation by said data server, the said multi-piece substrate that passes on is carried out the operation relevant with the installation of electronic unit according to this object information with this multi-piece substrate.
The 2nd invention is in the 1st invention, when said downstream operation device is transported to each with said multi-piece substrate successively in this device, follows this to transport, and stores while move the said substrate name information corresponding with said multi-piece substrate.
The 3rd invention is a kind of management system of electronic unit assembly line; Said electronic unit assembly line has and carries out and a plurality of apparatus for work that the operation that electronic unit is associated is installed on multi-piece substrate; Said multi-piece substrate has and by disjunction the time, is used as independently a plurality of baseplate parts of cutting apart of processing substrate; It is characterized in that
Upstream operations device in the said electronic unit assembly line comprises:
Make the unit, after the detection operation of said multi-piece substrate having been carried out regulation, make the file of substrate name and this substrate name of this multi-piece substrate;
Control unit is controlled, so that being stored in by said, the object information of said detection operation makes in the file that the unit makes,
Transmitting element sends to data server with the said file of having stored this object information; And
The unit of delivering letters is being through with the operation relevant with the installation of electronic unit and when said multi-piece substrate is transported to the downstream operation device, send the said substrate name corresponding with this multi-piece substrate to said multi-piece substrate,
Said downstream operation device comprises:
Acquiring unit with the said substrate that receives clue by name, is obtained the object information of said detection operation from the said file corresponding with this multi-piece substrate by said data server; And
Control unit is controlled, so that the object information that obtains according to this acquiring unit carries out the operation relevant with the installation of electronic unit to the said multi-piece substrate that passes on.
The invention effect
The present invention according in the upstream operations device to the detected various data of multi-piece substrate, in downstream unit, this aforesaid base plate of having accepted made full use of these various data and when carrying out operation, can improve the substrate production running efficiency.
Description of drawings
Fig. 1 is the skeleton diagram of the management system of expression electronic unit assembly line.
Fig. 2 is the plane graph of multi-piece substrate.
Fig. 3 is the figure that moves that is used to explain the substrate name.
Fig. 4 is the figure of expression flow process.
Fig. 5 is the figure of the expression substrate name information corresponding with each.
Fig. 6 is the figure that is used to explain other example that moves of substrate name.
Label declaration
1 screen process press
2,3,4 electronic component mounting apparatus
5 communication lines
6 multi-piece substrates
7 data servers
Embodiment
Below, according to description of drawings execution mode of the present invention.Fig. 1 is the skeleton diagram of management system that the electronic unit assembly line of electronic unit is installed on as the printed base plate of substrate; This electronic unit assembly line has the electronic component mounting apparatus 2,3,4 that applies the screen process press 1 of soldering paste on as the printed base plate of substrate, electronic unit is installed on printed base plate; But be not limited to these devices, also can comprise and other relevant device of installation electronic unit on the electronic unit assembly line.
As shown in Figure 3, aforementioned screen process press 1 has: from the upstream side apparatus for work accept printed base plate supply platform 1A, carry out the operation post 1B of silk screen printing and see platform 1C off at this printed base plate what the downstream apparatus for work passed on printed base plate.And electronic component mounting apparatus 2,3,4 has respectively: accept the supply platform 2A, 3A (omitting electronic component mounting apparatus 4) of printed base plate, the 1st and the 2nd operation post 2B that electronic unit is installed, 2C, 3B, 3C and see platform 2D, 3D (omitting electronic component mounting apparatus 4) off to what the downstream apparatus for work was delivered printed base plate on this printed base plate.
And placement substrate detecting sensor 8 on each platform, its structure are that if this each substrate detecting sensor 8 detects the arrival of printed base plate, the driving of transporting motor of transporting conveyer belt that then drives in each stops.
And printed base plate is a multi-piece substrate (branch cutting board) 6, as among Fig. 2 with dotted line separately the expression, cut apart baseplate part 6A by six of disjunction respectively and constitute, by disjunction the time, this is cut apart baseplate part 6A and handles as substrate independently.As a rule, same electronic unit is installed in same position, and the situation that same Installation Modes (pattern) is repeated to dispose is more.
On this multi-piece substrate 6; With the substrate identification mark M1 that is used to carry out the whole location recognition of substrate; Cut apart on the baseplate part 6A also with the substrate identification component M2 that is used for each minute cutting board 6A is carried out location recognition at each, and under as the situation of bad minute cutting board 6A with the bad mark M3 that is used to represent this implication.
And screen process press 1, electronic component mounting apparatus 2,3,4 can send reception via communication line 5 each other, and are connected with data server 7 via aforementioned communication circuit 5 respectively.
And; In screen process press 1, have the aforesaid base plate identification mark M1 had on the multi-piece substrate 6, substrate identification camera that M2 makes a video recording and silk screen identification camera that the silk screen identification mark of having on to silk screen is made a video recording; According to each photographed images having been carried out discerning the identification result after handling by recognition process unit; After multi-piece substrate 6 and silk screen position are overlapped, can roll through rubber the soldering paste as coating agent is coated on the multi-piece substrate 6.Therefore, in the storage device of screen process press 1, store positional information, each positional information of cutting apart baseplate part 6A and silk screen positional information of multi-piece substrate 6.
And then; Cut apart the central portion of baseplate part 6A through each of aforesaid base plate identification camera multi-piece substrate 6; This image pickup result is handled in recognition process unit identification; Thereby learning to cut apart at which is attached with bad mark M3 on the baseplate part 6A, with this expression which to cut apart baseplate part 6A be that bad bad label information is stored in the aforementioned storage device.
And; Before being transported to the downstream device after this silk screen printing; Each soldering paste that aforesaid base plate identification camera has applied on multi-piece substrate 6, each soldering paste is handled in recognition process unit identification, thereby the positional information of the soldering paste that applies is stored in the aforementioned storage device.
And electronic component mounting apparatus 2 has: be used to grasp the substrate identification camera of the integral position of multi-piece substrate 6, the substrate height measuring transducer etc. that is used to grasp the mark identification camera and the recognition process unit of the electronic unit position that keeps as absorption on the suction nozzle of the maintenance utensil of electronic unit and is used for detecting in the measuring position of needs the height level (level) of multi-piece substrate 6.
Through above structure, according to the motion flow explanation action of the multi-piece substrate 6 of the electronic unit assembly line of Fig. 4.Below, for the apparatus for work as the beginning of the management system of electronic unit assembly line of the present invention, i.e. the for example action of screen process press 1 is to describing from step S1 to step S7.
At first, screen process press 1 is swum apparatus for work (not shown) from it and is passed on and be taken into multi-piece substrate 6 (step S1).Then; In this screen process press 1; Substrate identification camera is made a video recording with the substrate identification component M2 that is used to carry out each location recognition of cutting apart baseplate part 6A to being attached to substrate identification mark M1 that being used on the multi-piece substrate 6 carry out the whole location recognition of multi-piece substrate 6; Recognition process unit is carried out identification and is handled (step S2), and these positional informations are stored in the storage device.
And; Owing to have bad mark M3 at the bad baseplate part of cutting apart; So aforesaid base plate identification camera is made a video recording to each central portion of cutting apart baseplate part 6A of multi-piece substrate 6; This image pickup result is handled in recognition process unit identification, and will to cut apart baseplate part 6A as this be that bad bad label information is stored in the aforementioned storage device.
And then silk screen identification camera is made a video recording to the silk screen identification mark that is attached on the silk screen, and recognition process unit is carried out identification and handled this photographed images, the positional information of storage silk screen in aforementioned storage device.
Then; When carrying out this substrate recognizing processing; The control device of screen process press 1 makes the information that is used to discern substrate to each this multi-piece substrate; Be substrate ID name, and make the file (step S3) of this substrate ID name, record (storage) substrate recognizing processing result (step S4) in the file of each filename in being stored in the aforementioned storage device of self.
Then, screen process press 1 sends and stores this log file (step S5) via 5 pairs of data servers of aforementioned communication circuit 7.Therefore; In the file of each substrate ID name, store substrate recognizing processing result, i.e. the identification result of the identification result of the identification result of substrate identification mark M1, each substrate identification component M2, bad label information, silk screen identification mark as the information of each substrate ID name.
Then; Screen process press 1 is according to the identification result of recognition process unit; Promptly according to the identification result of the silk screen identification mark of the identification result of the substrate identification mark M1 of multi-piece substrate 6 and silk screen; After multi-piece substrate 6 and silk screen position are overlapped, roll the soldering paste (step S6) that on multi-piece substrate 6, applies as coating agent through rubber.
And; After this silk screen printing; Multi-piece substrate 6 is transported to before the device of downstream; The aforesaid base plate camera is made a video recording to the soldering paste that has applied on the multi-piece substrate 6, and recognition process unit identification handles the photographed images of soldering paste, and the positional information of the soldering paste that applies is stored in the aforementioned document of aforementioned storage device.
Then, it is electronic component mounting apparatus 2 that the multi-piece substrate 6 of the silk screen printing that is through with is transported to the downstream device, sends aforesaid base plate ID name (step S7) simultaneously.
Then, the multi-piece substrate 6 that the next electronic component mounting apparatus 2 of screen process press 1 has carried out silk screen printing from this screen process press 1 acceptance receives substrate ID name (step S8) simultaneously.In this electronic component mounting apparatus that receives 2; In this device, aforementioned multi-piece substrate 6 is transported to each successively through transporting conveyer belt; But follow this to transport, while aforesaid base plate ID name also moves and stores (step S9) in aforementioned storage device.
According to accompanying drawing 3 and accompanying drawing 5, this step S9 is described.At first; From the platform 1C that sees off of screen process press 1 the supply platform 2A of the electronic component mounting apparatus 2 in its positive downstream is passed on multi-piece substrate 6 (substrate ID name: when the substrate detecting sensor 8 that substrate Z1) is supplied to platform 2A detects; In the storage device in this electronic component mounting apparatus 2 with supply with the corresponding zone of platform 2A, carry out memory setting (memory setting) to representing information (below be called " substrate ID name information ") Z1 as the substrate ID name of the substrate Z1 of substrate 6.And; Equally; In multi-piece substrate 6 (substrate ID name: substrate Y1) be transported to the 1st operation post 2B and when being detected by the substrate detecting sensor 8 of the 1st operation post 2B from the supply platform 2A of electronic component mounting apparatus 2; In the zone corresponding in the storage device in this electronic component mounting apparatus 2, the substrate ID name information Y1 of substrate Y1 is carried out memory setting with the 1st operation post 2B.And; Equally; In multi-piece substrate 6 (substrate ID name: substrate X1) be transported to the substrate detecting sensor 8 of seeing platform 2D off and being seen off platform 2D when detecting from the supply platform 2C of electronic component mounting apparatus 2; In the zone corresponding in the storage device in this electronic component mounting apparatus 2, the substrate ID name information X1 of substrate X1 is carried out memory setting with seeing platform 2D off.
And; Owing in the 1st operation post 2B, do not had multi-piece substrate 6,, moved to through the substrate X1 in the 2nd operation post 2C and see platform 2D off so do not transfer to the 2nd operation post 2C; The substrate ID name information X1 of substrate X1 among the 2nd operation post 2C is eliminated, and becomes " nothing ".
Therefore, as stated, in electronic component mounting apparatus 2; Multi-piece substrate 6 is transported to each successively; And along with this transports, while the aforesaid base plate ID name corresponding with each also moves and be stored in the aforementioned storage device, at this moment the substrate ID name information of storage is as shown in Figure 5.
Then, in electronic component mounting apparatus 2, multi-piece substrate 6 is transported to each, also is transported to the 1st operation post 2B (step S10).So; Electronic component mounting apparatus 2 is with the substrate ID of the substrate Y of the 1st operation post 2B that is fed to screen process press 1 clue by name; Receive and obtain the substrate recognizing processing result who stores in the file of each substrate ID name of the substrate Y aforementioned screen process press 1, the i.e. recognition result of identification result, bad label information and the silk screen identification mark of each substrate identification mark M2 via communication line 5 from data server 7.
Then, the substrate Y that is transported to the 1st operation post 2B is carried out production operation, i.e. the installation action of electronic unit (step S12).At this moment; Before in this electronic component mounting apparatus 2, multi-piece substrate 6 being carried out the installation action of electronic unit; Substrate identification camera is made a video recording to the substrate identification mark M1 of multi-piece substrate 6, thereby recognition process unit is discerned processing, but bad mark M3 is not made a video recording and discern processing; And, do not carry out each shooting of cutting apart each substrate identification component M2 among the baseplate part 6A and identification processing yet.
And; This electronic component mounting apparatus 2 is before the installation action that carries out electronic unit; Through not shown substrate height measuring transducer; Detect the height level of multi-piece substrate 6 in the measuring position of needs, with the substrate height information stores in the file of the substrate ID of aforesaid data server 7 name.Thus, can be only in electronic component mounting apparatus 2, perhaps also in electronic component mounting apparatus 3,4, make full use of the substrate height information of storing in the file of substrate ID name of this data server 7.
Then, according to this substrate height information, when 2 pairs of multi-piece substrates of electronic component mounting apparatus 6 are installed electronic unit,, suitably install with substrate height level coupling through the decline limit of control as the suction nozzle of electronic unit holding member.And, according to the positional information of the identification result of each substrate identification component M2 that obtains from screen process press 1, bad label information, soldering paste, remove the bad baseplate part 6A of cutting apart, thereby carry out the installation (step S12) of electronic unit.
Promptly; To removed bad other the branch cutting board 6A of cutting apart behind the baseplate part 6A according to bad information substrate; Except considering the substrate identification mark M1 after the identification processing and the identification result of M2 and the identification result of in screen process press 1, discerning the substrate identification mark M1 after handling in this electronic component mounting apparatus 2; Also control and install, make the pin of electronic unit carry and place on the soldering paste according to the positional information of the soldering paste after identification is handled in screen process press 1.
Then; With the same after the step S7; It is electronic component mounting apparatus 3 that the multi-piece substrate 6 of the installation action of the electronic unit that is through with is transported to the downstream device, sends aforesaid base plate ID name simultaneously, in electronic component mounting apparatus 3,4, also carries out same processing (step S13).At this moment, in electronic component mounting apparatus 3,4, make full use of the substrate height information by electronic component mounting apparatus 2 measurements of storage in data server 7.
And; As stated, along with transporting of multi-piece substrate 6, while substrate ID name is moved in the storage device that is stored in electronic component mounting apparatus 2; But about method in the storage shown in Fig. 3, also can be suitable equally in other electronic component mounting apparatus 3,4.
And; In electronic component mounting apparatus 2; In this device, aforementioned multi-piece substrate 6 is transported to each successively through transporting conveyer belt; But follow this to transport substrate ID name is stored in the storage device while moving, but according to Fig. 6 explanation other the execution mode about the method for this storage.This other execution mode is used for the long large substrates of length L of carriage direction, and the length L of carriage direction for example from surpassing below the 260mm to 610mm, below describes.
Substrate X2 is transported to the 2nd operation post 3C of electronic component mounting apparatus 3 from the 2nd operation post 2C of electronic component mounting apparatus 2; When the substrate detecting sensor 8 of the 2nd operation post 3C of electronic component mounting apparatus 3 detects substrate X2; In the zone corresponding with the 2nd operation post 3C in the storage device in this electronic component mounting apparatus 3, memory setting is as the substrate ID name information X2 of the substrate X2 of multi-piece substrate 6.At this moment; Multi-piece substrate 6 is supply platform 3A that sees platform 2D and electronic component mounting apparatus 3 off and the 1st operation post 3B through electronic component mounting apparatus 2 only; Be the 2nd operation post 3C of electronic component mounting apparatus 3 as the position that stops; When substrate detecting sensor 8 detected multi-piece substrate 6, as previously mentioned, the substrate ID name information X2 of substrate X2 was by memory setting.
Then, electronic component mounting apparatus 2 uses substrate ID name data query server 7, and according to this substrate ID name, information such as substrate recognizing processing result are sent to electronic component mounting apparatus 2 from data server 7.
Then, if substrate X2 does not then have substrate at electronic component mounting apparatus 2, and asks substrate to screen process press 1 from the 2nd operation post 3C that the 2nd operation post 2C of electronic component mounting apparatus 2 is transported to electronic component mounting apparatus 3.Therefore; Transport substrate Y2 from screen process press 1 to electronic component mounting apparatus 2; When being detected by the substrate detecting sensor 8 of the 2nd operation post 2C of electronic component mounting apparatus 2; In the storage device in this electronic component mounting apparatus 2 with the corresponding zone of the 2nd operation post 2C, carried out memory setting as the substrate ID name information Y2 of the substrate Y2 of multi-piece substrate 6.
When the operation post 1B of screen process press 1 is transported to the 2nd operation post 2C of electronic component mounting apparatus 2, in screen process press 1, there is not substrate, at substrate Y2 to the upstream side device requests substrate of screen process press 1.Therefore; Transport substrate Z2 from the upstream side device to screen process press 1; When the substrate detecting sensor 8 of the operation post 1B that is screen printed machine 1 detects; In the zone corresponding in the storage device in this screen process press 1, carried out memory setting as the substrate ID name information Z2 of the substrate Z2 of multi-piece substrate 6 with operation post 1B.
As stated,, and follow this to transport, be stored in the storage device while substrate ID name moved though between each apparatus for work, multi-piece substrate 6 is transported to the downstream device successively through transporting conveyer belt.
In the past; When passing on multi-piece substrate 6; Pass on the measurement of sending multi-piece substrate 6, detected various data with this; Call duration time is also elongated for a long time in the amount of various data, therefore causes the problem that the production efficiency of this minute substrate reduces, but the present invention since in the upstream side apparatus for work with the measurement of multi-piece substrate 6, detected various storage in data server 7; And in the device of downstream to the abundant utilization various data of reading from data server and carry out operation of the multi-piece substrate 6 accepted from the upstream side device, so can realize the raising of substrate output running efficiency.
Execution mode of the present invention has been described as stated; But according to above-mentioned explanation; Can carry out various alternative, revise or distortion as those skilled in the art, the present invention comprises aforesaid various alternative, revises or distortion in the scope that does not exceed its aim.
Claims (3)
1. the management method of an electronic unit assembly line; Said electronic unit assembly line has and carries out and a plurality of apparatus for work that the operation that electronic unit is associated is installed on multi-piece substrate; Said multi-piece substrate has and by disjunction the time, is used as independently a plurality of baseplate parts of cutting apart of processing substrate; It is characterized in that said management method may further comprise the steps:
After the detection operation of in the upstream operations device in said electronic unit assembly line said multi-piece substrate having been carried out stipulating, make the file of substrate name and this substrate name of this multi-piece substrate,
The object information of said detection operation is stored in this file that has made,
The said file of having stored this object information is sent to data server,
When in said upstream operations device, being through with operation relevant, said multi-piece substrate being transported to the downstream operation device, and sending the said substrate name corresponding with this multi-piece substrate with the installation of electronic unit to said multi-piece substrate,
Said downstream operation device is with the said substrate that receives clue by name; From the said file corresponding, obtain the object information of said detection operation by said data server, the said multi-piece substrate that passes on is carried out the operation relevant with the installation of electronic unit according to this object information with this multi-piece substrate.
2. the management method of electronic unit assembly line as claimed in claim 1 is characterized in that,
When said downstream operation device is transported to each with said multi-piece substrate successively in this device, follow this to transport, store while move the said substrate name information corresponding with said multi-piece substrate.
3. the management system of an electronic unit assembly line; Said electronic unit assembly line has and carries out and a plurality of apparatus for work that the operation that electronic unit is associated is installed on multi-piece substrate; Said multi-piece substrate has and by disjunction the time, is used as independently a plurality of baseplate parts of cutting apart of processing substrate; It is characterized in that
Upstream operations device in the said electronic unit assembly line comprises:
Make the unit, after the detection operation of said multi-piece substrate having been carried out regulation, make the file of substrate name and this substrate name of this multi-piece substrate;
Control unit is controlled, so that being stored in by said, the object information of said detection operation makes in the file that the unit makes,
Transmitting element sends to data server with the said file of having stored this object information; And
The unit of delivering letters is being through with the operation relevant with the installation of electronic unit and when said multi-piece substrate is transported to the downstream operation device, send the said substrate name corresponding with this multi-piece substrate to said multi-piece substrate,
Said downstream operation device comprises:
Acquiring unit with the said substrate that receives clue by name, is obtained the object information of said detection operation from the said file corresponding with this multi-piece substrate by said data server; And
Control unit is controlled, so that the said object information that obtains according to this acquiring unit carries out the operation relevant with the installation of electronic unit to the said multi-piece substrate that passes on.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010167629A JP2012028655A (en) | 2010-07-26 | 2010-07-26 | Management method for electronic component mounting line and management system therefor |
| JP2010-167629 | 2010-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102413673A true CN102413673A (en) | 2012-04-11 |
| CN102413673B CN102413673B (en) | 2016-11-30 |
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| CN106817889A (en) * | 2015-11-27 | 2017-06-09 | 韩华泰科株式会社 | Part attaching method |
| CN110050238A (en) * | 2016-12-16 | 2019-07-23 | 株式会社富士 | Substrate production line and substrate production machine |
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| CN101001518A (en) * | 2006-01-10 | 2007-07-18 | 雅马哈发动机株式会社 | Installation system and installation method of electronic element |
| CN101356869A (en) * | 2006-01-11 | 2009-01-28 | 松下电器产业株式会社 | Electronic component mounting system and electronic component mounting method |
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| JP2003110297A (en) * | 2001-10-02 | 2003-04-11 | Juki Corp | Electronic component mounting system |
| JP2004095978A (en) * | 2002-09-03 | 2004-03-25 | Fuji Mach Mfg Co Ltd | Method and system for contra-substrate working |
| CN101001518A (en) * | 2006-01-10 | 2007-07-18 | 雅马哈发动机株式会社 | Installation system and installation method of electronic element |
| CN101356869A (en) * | 2006-01-11 | 2009-01-28 | 松下电器产业株式会社 | Electronic component mounting system and electronic component mounting method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106817889A (en) * | 2015-11-27 | 2017-06-09 | 韩华泰科株式会社 | Part attaching method |
| CN106817889B (en) * | 2015-11-27 | 2019-11-05 | 韩华精密机械株式会社 | Component attaching method |
| CN110050238A (en) * | 2016-12-16 | 2019-07-23 | 株式会社富士 | Substrate production line and substrate production machine |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120010966A (en) | 2012-02-06 |
| JP2012028655A (en) | 2012-02-09 |
| KR101812342B1 (en) | 2017-12-26 |
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