CN100584151C - Manufacturing installation of substrate for element mounting - Google Patents
Manufacturing installation of substrate for element mounting Download PDFInfo
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- CN100584151C CN100584151C CN200610071699A CN200610071699A CN100584151C CN 100584151 C CN100584151 C CN 100584151C CN 200610071699 A CN200610071699 A CN 200610071699A CN 200610071699 A CN200610071699 A CN 200610071699A CN 100584151 C CN100584151 C CN 100584151C
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Abstract
The present invention provides a mounting substrate manufacturing apparatus having a short processing time which can mount or inspect an electronic component on a proper position of a substrate without imaging a large number of solder positions.A printer has a mask opening position recognizing means for imaging the opening position of a mask for solder printing to acquire image data thereof, a data processing means (main operating section 91) for obtaining data for position correction in accordance with the mask opening position with respect to the position of a substrate (W) on the basis of the image data of this recognizing means (11), and a transmitting means (control device (70) for transmitting the position correction data to a mounting apparatus(30). The mounting apparatus(30) corrects the position of mounting an electronic component on the basis of the position correcting data, and mounts the electronic component on the corrected component mounting position.
Description
Technical field
The present invention relates to a kind of electronic component mounting substrate manufacturing installation that to implement the printing equipment of solder printing to substrate that has.
Background technology
Usually, for having the electronic component mounting substrate manufacturing installation that can implement the printing equipment of solder printing to substrate, the scolder position that requires the substrate-side behind the solder printing must be correct consistent with the inspection position of the installation site of erecting device side or testing fixture side.
For example, in patent documentation 1 (Japan Patent open communique spy open 2002-134899 number), disclose a kind of position of components data that obtained according to scolder position data that printing inspection apparatus obtained and stowage survey device and controlled printing equipment and electronic component loading attachment, thus electronic component mounting system and electronic component mounting method more accurate and that in installation process, carry out quality management effectively.
Yet, above-mentioned electronic component mounting system and installation method, owing to be to obtain view data by the scolder position that printing inspection apparatus is taken substrate, though can in installation process, accurately carry out quality management, but to take a plurality of scolder position datas of substrate one by one, to obtain view data, therefore when measuring the scolder position, need the time inevitably, thereby have limitation aspect the installation production and processing time at the whole substructure for electrical device of shortening.
Summary of the invention
The present invention does in view of the above problems, its purpose is to provide a kind of manufacturing installation of substrate for element mounting of element mounting substrate being implemented the printing equipment of solder printing that has, need not to take one by one a plurality of scolders position of substrate by printing inspection apparatus, both can avoid the increase of production and processing time, and can carry out the installation or the inspection of electronic component in the appropriate position of substrate.
Manufacturing installation of substrate for element mounting of the present invention for addressing the above problem comprises printing equipment, and element mounting substrate is carried out solder printing; At least one erecting device is positioned at the element mounting substrate through give conveyance after this printing equipment printing by base board delivery device under the state of installation exercise position of regulation of this erecting device, and electronic component is installed on this substrate; Above-mentioned printing equipment, have and take the solder printing matte aperture position recognition unit of matte aperture position with the acquisition view data, calculate data processing unit according to the view data of this matte aperture position recognition unit corresponding to the position correction data of the deviation of the position of substrate and matte aperture position, above-mentioned position correction data are sent to the transmitting element of erecting device, above-mentioned erecting device, according to the installation site of above-mentioned position correction data correction electronic component, and electronic component is installed on the revised component installation location.
Adopt the present invention, data processing unit is according to the view data of matte aperture position recognition unit, calculate position correction data, simultaneously these position correction data are sent to erecting device by transmitting element corresponding to the deviation of the position of substrate and matte aperture position.And, because erecting device can be according to being sent out next position correction data, revise the installation site of electronic component, electronic component is installed on the revised component installation location then, therefore printing equipment only otherwise change matte also can be installed electronic component at the appropriate component installation location corresponding to the scolder position even do not measure the scolder position.
In addition, comparatively it is desirable to, said elements mounting substrate manufacturing installation, the testing fixture that also can comprise the element installment state of checking aforesaid substrate, this testing fixture is after receiving the position correction data that above-mentioned transmitting element sent, according to the inspection position of the electronic component on this position correction data correction substrate.
Like this, because testing fixture can be according to the position correction data of sending, revise the inspection position of the electronic component on the substrate, so printing equipment only otherwise change matte, also can check electronic component at the appropriate component installation location corresponding to the scolder position even do not measure the scolder position.
In addition, comparatively it is desirable to, said elements mounting substrate manufacturing installation, also can comprise landmarks identification unit, when substrate is positioned at the assigned position of above-mentioned printing equipment, the location recognition sign that at least one side gave of taking substrate and matte is to obtain view data, above-mentioned data processing unit, the matte aperture position data of calculating according to the view data of matte aperture position recognition unit, calculate revisal amount data according to the view data of above-mentioned landmarks identification unit, with as the position correction data corresponding to the deviation of mark position.
Like this, because the matte aperture position data that data processing unit can be calculated according to the view data of matte aperture position recognition unit, calculate revisal amount data according to the view data of landmarks identification unit corresponding to the mark position, be used as the position correction data, even therefore depart from the position of substrate or matte, also this can be departed to revise and come.
In addition, comparatively it is desirable to, said elements mounting substrate manufacturing installation, also can comprise by take by above-mentioned printing equipment be printed on scolder on the substrate more at least with the scolder location identification unit of acquisition view data, above-mentioned data processing unit, can calculate the scolder position according to the view data of above-mentioned scolder location identification unit, and according to the above-mentioned matte aperture position of this scolder position correction data.
Like this, because data processing unit can be revised matte aperture position data according to the scolder position, therefore can install or check electronic component more accurately.
In addition, comparatively it is desirable to, when matte aperture position that draws according to matte aperture position data and the deviation overshoot amount between the scolder position, the scolder position data that can use the location drawing according to each scolder on the captured substrate to look like to calculate replaces matte aperture position data.
Like this, when matte aperture position data with respect to the deviation of scolder position when ormal weight is following, by a scolder position, just can unify to revise to matte aperture position data.And, when matte aperture position data increase with respect to the deviation of scolder position, the scolder position data that can look like to calculate by the location drawing according to each scolder on the captured substrate substitutes above-mentioned matte aperture position data, set positions with each actual print scolder is a benchmark thus, thereby component installation location and checking elements position can not produce bigger departing from.
As mentioned above, the manufacturing installation of substrate for element mounting that has the printing equipment of substrate enforcement solder printing of the present invention, its erecting device and testing fixture need not to measure one by one a plurality of scolders position of substrate, can install or check electronic component in appropriate position, thereby realize the short production and processing time.
Description of drawings
Fig. 1 is the block diagram of the structure of the related manufacturing installation of substrate for element mounting of expression embodiments of the present invention.
Fig. 2 is the cutaway view of the general configuration of expression printing equipment.
Fig. 3 is the vertical view of the general configuration of expression erecting device.
Fig. 4 is the block diagram of the structure of expression control device.
Fig. 5 is the flow chart of control main points of the control device of expression manufacturing installation of substrate for element mounting.
Fig. 6 is the flow chart of control main points of the 1st variation of expression embodiments of the present invention.
Fig. 7 is the flow chart of control main points of the 2nd variation of expression embodiments of the present invention.
Embodiment
Below, with reference to accompanying drawing the preferred embodiments of the present invention are elaborated.Fig. 1 is the block diagram of the structure of the related manufacturing installation of substrate for element mounting of embodiments of the invention.
As shown in Figure 1, the manufacturing installation of substrate for element mounting that embodiments of the present invention are related, has the printing equipment 10 that can carry out solder printing to substrate W, this printing equipment 10 has takes the aperture position of solder printing with matte, with matte aperture position recognition unit 11 that obtains view data and the controller 90 of controlling printing equipment 10.
In addition, said elements mounting substrate manufacturing installation, having can be to the erecting device 30 of substrate W installation electronic component and the curing system 50 that scolder is hardened.And, said elements mounting substrate manufacturing installation, as its testing fixture, the printing inspection apparatus 20 that comprises the solder printing of checking that printing equipment 10 is implemented, testing fixture 40 after the installation of the element installment state of the substrate W of inspection after element is installed, testing fixture 60 after the sclerosis of the substrate W after the inspection sclerosis.
Said elements mounting substrate manufacturing installation also has above-mentioned each of Lump management and installs 10～60 control device 70.
Above-mentioned printing device 10 carries out solder printing to element mounting substrate W, both so-called screen printer.
Fig. 2 is the cutaway view of the general configuration of expression printing equipment 10.As shown in Figure 2, printing equipment 10 comprises the printing equipment main body 2 with base 1, and the substrate supporting unit 3 that supports with the state of chucking substrate W is to the not shown conveyance band of this substrate supporting unit 3 conveyance substrate W.
Aforesaid substrate bracing or strutting arrangement 3, by making substrate W lifting (moving) may and rotate the R-Z platform 3A that (rotating around the Z axle) supported possibly and making this R-Z platform 3A can be to the conveyance direction (X-direction of substrate W along Z-direction, in Fig. 2 be vertical with paper and from the place ahead towards the direction at rear) and with it the mobile X-Y platform 3B of the direction of quadrature (Y direction) constitute, the mutual motion by above-mentioned platform 3A, 3B can make substrate W move.
R-Z platform 3A is mounted with and is used for taking from the below metal matte 7 described later to obtain the matte aperture position recognition unit 11 of view data.Above-mentioned matte aperture position recognition unit 11 has imaging apparatuss such as CCD area sensor, can take formed matte opening on the metal matte 7.In addition, above-mentioned matte aperture position recognition unit 11 also is used to take and discern the sign of matte one side described later.
Printing equipment main body 2 is provided with on overlooking direction the framework 2b that is " コ " shape and front side (being the left side among Fig. 2) opening, and this framework 2b is supported by the pillar 2a that setting is arranged on four bights of base 1.Said frame 2b is fixed with the metal matte 7 (the matte film is hereinafter to be referred as matte 7) that forms the matte opening, and is provided with squeegee unit 5 above this matte 7.In addition, matte 7, its full week is kept by framing component 8, and is fixed on framework 2b by this framing component 8.
Squeegee unit 5 has the pair of guide rails member 5a that the framework 2b upper edge Y direction that is separately fixed at the left and right sides (being the both sides with the paper orthogonal direction among Fig. 2) is extended; Installed with the state of leading member 5a across above-mentioned rail, and the beam member 5b that moves along above-mentioned guide rail component 5a by the driving of not shown drive unit; Supply with the scolder feedway (diagram slightly) of paste scolder to above-mentioned matte 7; The a pair of scraper plate 13,13 that is used for expansion pasty state scolder on matte 7; Lifting drives the lifting unit 14 of above-mentioned scraper plate 13,13 respectively.As described later, above-mentioned squeegee unit in when printing, makes scraper plate 13,13 move back and forth along Y direction on one side, makes this scraper plate 13,13 mutual alternately along the surface slip of matte 7 on one side, with this scolder is expanded on matte 7.
In addition, printing equipment main body 2 is provided with landmarks identification unit, when substrate W is positioned at the assigned position of printing equipment 10, takes the location recognition sign that at least one side gave in substrate W and the matte 7, to obtain view data.In the present embodiment,, be provided with and take the substrate sign of being given on the substrate W (reference mark) that is used for substrate identification, obtain the printing equipment substrate landmarks identification unit 15 of view data as above-mentioned landmarks identification unit.In addition, also be provided with the printing equipment substrate sign lighting device 99b (Fig. 4) that throws light on.Above-mentioned printing equipment landmarks identification unit 15 has imaging apparatuss such as CCD area sensor, can take the substrate sign that is used for substrate identification of the upper surface that is imprinted on substrate W and be formed on circuit pattern on this substrate.
In addition, the R-Z platform 3A of aforesaid substrate support unit 3, running by X-Y platform 3B, can be at the position (solid line position of Fig. 2 corresponding to screeding device 5, be called job position), with (the chain-dotted line position of Fig. 2, the position of keeping out of the way from this job position along Y direction, be called the camera site) between move, above-mentioned printing equipment substrate landmarks identification unit 15, be arranged on the side of squeegee unit 5, when R-Z platform 3A is positioned at above-mentioned camera site, can discern the substrate W that is supported on this platform 3A.
Below, describe erecting device 30 in detail with reference to Fig. 3.Fig. 3 is the cutaway view of the general configuration of expression erecting device 30.
Above-mentioned erecting device 30 when being positioned at the installation exercise position that erecting device 30 stipulates through printing equipment 10 printing back by the mounting substrate W of base board delivery device (diagram summary) conveyance, carries out the installation of electronic component to substrate W.As shown in Figure 3, erecting device 30 has erecting device main body 31 and is installed in the electronic component supply device 32 of this erecting device main body 31, and the not shown electronic component (diagram slightly) that feedway 32 is supplied with is installed on the substrate W.
Above-mentioned erecting device main body 31 has base 33, on this base 33, is provided with the conveyance band 34 that is used for conveyance substrate W, and substrate W gives conveyance by this conveyance band 34 and stops at the installation exercise position of illustrated regulation.
The both sides of above-mentioned conveyance band 34 are respectively arranged with feedway 32.Above-mentioned feedway 32 supply with to be installed to substrate W and to be used electronic component, can be made of tape feeder etc.
The top of base 33, be equipped with and be used for from the head unit 37 of feedway 32 to substrate W delivering electronic components, this head unit 37, by moving on X-direction (left and right directions among Fig. 1) and Y direction (above-below direction among Fig. 1), can be from feedway 32 to substrate W conveyance electronic component.
Particularly, the base 33 of erecting device main body 31 is provided with fixed guide 38, is provided with the supporting member 39 of the head unit 37 that can move on X-direction along this fixed guide 38.In addition, head unit 37 can move possibly to Y direction along above-mentioned supporting member 39 and support.At this moment, strutting piece 39 moving on X-direction is through ball screw 41, undertaken by the driving of X-axis servomotor 42, and strutting piece 39 moving on Y direction is through ball screw 41, undertaken by the driving of Y servomotor 44.
In addition, said suction nozzle, dismounting is installed in adsorption head 45 possibly, and has prepared multiple suction nozzle in advance on the nozzle board, and the type of electronic components mounted is installed on the suction head 45 selectively as required.
In addition, on the base 33 of the moving range that is positioned at head unit 37, be provided with component recognition unit 46.This component recognition unit 46, have imaging apparatuss such as CCD area sensor, head unit 37 from feedway 32 to the process of substrate W conveyance electronic component, take the adsorbed electronic component of suction head 45, obtaining view data, but then according to the deviation of this view data measuring element absorption position etc.
In addition, head unit 37 is provided with substrate landmarks identification unit 47, this substrate landmarks identification unit 47, and shooting is positioned at the substrate sign (reference mark) of the substrate W of installation exercise position, to obtain view data.Aforesaid substrate distinguishing mark device 47, have imaging apparatuss such as CCD area sensor, to be positioned at the installation exercise position treat that substrate W carries out the installation of electronic component the time, take the substrate sign of this substrate W, to obtain view data, can discern substrate position according to this view data then.
In addition, erecting device 30, has controller (not shown), by this controller head unit 37 grades are controlled, after electronic component is adsorbed from feedway 32, can carry out deviation corresponding to the element absorption position, and the correction of substrate position, electronic component is installed on the component installation location of substrate W simultaneously.
The controller of above-mentioned erecting device 30, the installation data of the component installation location of this substrate of storage expression in advance corresponding to substrate, the component installation location of this substrate is corrected according to position correction data described later.
At this, other devices are illustrated referring again to Fig. 1.
Above-mentioned printing inspection apparatus 20, installation back testing fixture 40, sclerosis back testing fixture 60, respectively as testing fixture involved in the present invention, element installment state to substrate W is checked, these testing fixtures 20,40,60, identical with erecting device 30, have the substrate landmarks identification unit that the substrate sign that is positioned at the substrate W of job position by shooting obtains view data respectively.In addition, the graphics processing unit that controller comprised (not shown) of above-mentioned testing fixture 20,40,60, identical with erecting device 30, respectively the view data of the substrate landmarks identification unit of each testing fixture 20,40,60 is carried out data processing, calculate the position data of each substrate with this.And, the controller of testing fixture 20,40,60, store the data of inspection position of expression substrate, and the data of the inspection position of this substrate of position correction data correction that draws according to printing equipment 10, on through each checking elements position of revising, check electronic component afterwards.
Above-mentioned curing system 50 is heat-treated etc. and is made it sclerosis installing printing solder behind the electronic component, and by the processing of this curing system 50, electronic component can be securely fixed on the substrate W.Above-mentioned curing system 50 is different from other devices, need not substrate W is carried out the height fine positioning, so omit its detailed description at this.
In addition, control device 70 is made of the computer that comprises main operational part with the CPU that carries out logical operation, storage part, I/O (I/O) control part, communication control unit.Wherein, main operational part, the information that relates to according to the administrative institute of manufacturing installation of substrate for element mounting such as storage part institute program stored, by I/O control part and communication control unit, the printing equipment 10 of Comprehensive Control manufacturing installation of substrate for element mounting, printing inspection apparatus 20, erecting device 30, installation back testing fixture 40, curing system 50 and sclerosis back testing fixture 60.
Below, with reference to Fig. 4 the controller 90 of printing equipment 10 is illustrated.Fig. 4 is the block diagram of the structure of expression controller 90.
As shown in Figure 4, the controller 90 of printing equipment 10 is by comprising that main operational part 91, storage part 92, Electric Machine Control with the CPU that carries out logical operation constitute with the computer of axle control part 93, I/O control part 94, communication control unit 95, image processing part 96, display part 97 etc.Wherein, main operational part 91, the information that relates to the control of printing equipment 10 according to 92 program stored of storage part etc., by I/O control part 94 and communication control unit 95, and carry out the reception and the transmission of data between control part 70, printing inspection apparatus 20, erecting device 30, installation back testing fixture 40, curing system 50 and the sclerosis back testing fixture 60.
At this, above-mentioned axle control part 93, according to the instruction of main operational part 91, each servomotor 98 of control printing equipment 10.For example, in printing equipment 10, the conveyance band of conveyance substrate diagram is slightly), the servomotor 98 of the lowering or hoisting gear 14 of the beam member 5b of R-Z platform 3A, X-Y platform 3B, squeegee unit 5, scolder feedway (diagram slightly), scraper plate 13,13 etc. controlled by above-mentioned axle control part 93.
In addition, above-mentioned I/O controller 94 is in the information that relates to printing equipment 10, the circuit that the signal of 1 bit receives and sends, can judge having or not of machine etc., confirm to be arranged on the state of the machine on the printing equipment 10, and the open and close running of carrying out these machines.
Above-mentioned communication controler 95, be in the information that relates to printing equipment 10, comprise the circuit that receives and send than the data of multiple data quantity, for example comprise, from operating condition data with respect to the control device 70 of the various operating conditions of printing equipment 10 indication, and the data of the notice operating conditions that send to each device 20～70 from printing equipment 10 etc.
Above-mentioned image processor 96, image to the captured each several part of printing equipment 10 carries out image processing, to monitor the running of each several part, particularly, carry out image processing by matte aperture position recognition unit 11 and printing equipment substrate landmarks identification unit 15 captured images, monitor the running of each several part printing equipment 10.
Above-mentioned graphic process unit 96, with respect at the matte aperture position lighting device 99a of printing equipment 10 irradiation matte aperture positions with at the substrate sign lighting device 99b of the substrate sign of printing equipment 10 irradiated substrate W, difference guidance lighting condition, control each lighting device 99a, 99b with this, the image to the captured electronic component of the matte aperture position recognition unit 11 of printing equipment 10 and printing equipment substrate landmarks identification unit 15 carries out graphical analysis simultaneously.
Above-mentioned main operational part 91 (being equivalent to data processing unit), calculate matte aperture position data according to the view data of matte aperture position recognition unit 11, according to the view data of landmarks identification unit (printing equipment substrate landmarks identification unit 15) calculate corresponding to the mark position revisal amount data, with as corresponding to the position correction data of matte aperture position with respect to the position of substrate W.
Then, by control device 70 (being equivalent to transmitting element), above-mentioned position correction data and revisal amount data are sent to each device, thereby can carry out the installation of electronic component or the inspection of substrate in the component installation location or the checking elements position of each device.
In addition, main operational part 91 is also controlled the running of printing equipment 10 self.Promptly, utilize matte aperture position recognition unit 11, sign (reference mark of being given on the matte 7) to matte one side is taken and is discerned, by printing equipment substrate landmarks identification unit 15, the substrate sign is taken and discerned, then on this basis simultaneously, control basal plate support unit 3 is adjusted substrate position, make the position of above-mentioned two signs consistent, make substrate W be in the state of facing mutually simultaneously, carry out solder printing by control squeegee unit 5 grades with matte 7.
In addition, above-mentioned storage part 92, hard disk by computer constitutes, except that the program of storing driver master operational part 91, also can store the machine informations such as data of the control that relates to each servomotor, the classification of printed base plate W, the classification and the intrinsic number various information such as (identification signs) of printing inspection apparatus 20.
The function of data such as position data on printing equipment 10 of above-mentioned storage part 92, the position data, substrate W that also has a storage matte aperture position, position correction data.
Below, with reference to Fig. 5, the effect of the related manufacturing installation of substrate for element mounting of embodiments of the present invention is illustrated.Fig. 5 is the flow chart of the control main points of expression manufacturing installation of substrate for element mounting.
For the ease of understanding, in Fig. 5,, represent printing equipment 10, erecting device 30, the processing that each testing fixture carried out by serial flow process to the relevant definite control that relates to component installation location or checking elements position.In addition, testing fixture 20,40,60, though running separately is different opportunity, the control main points of determining that relate to the checking elements position are removed running opportunity all identical, answer for avoiding tired, are represented with same control flow in Fig. 5.
At first, the controlled step of printing equipment 10 is as follows.
At step S1, whether every substrate W ground is measured with regard to the matte aperture position of printing equipment 10, or whether matte changed and judge, if YES just enters step S2.If NO just enters step S4.
At step S2, matte aperture position recognition unit 11 by taking the aperture position of solder printing with matte, obtains view data.
At step S3, main operational part 91 (data processing unit) carries out data processing by the view data to the matte aperture position recognition unit 11 of printing equipment 10, calculates the position data of matte aperture position.
Then, at step S4, printing equipment substrate landmarks identification unit 15 is positioned at substrate under the state of assigned position of printing equipment 10, by taking the substrate identification substrate sign of being given on the substrate W, obtains view data.
In addition, at step S5, main operational part 91 carries out data processing by the view data to the printing equipment substrate landmarks identification unit 15 of printing equipment 10, calculates the mark position.
At step S6, main operational part 91, calculate matte aperture position data according to the view data of matte aperture position recognition unit 11, calculate revisal amount data according to the view data of printing equipment substrate landmarks identification unit 15 corresponding to the mark position, with as corresponding to the position correction data of matte aperture position, then these position correction data are sent to each device by transmitting element (controller 70) with respect to the position of substrate W.
Secondly, the controlled step of erecting device 30 is as follows.
At step S11, the controller of erecting device 30 is read the installation position data (determining the data of the component installation location on the substrate) of storage in advance.
At step S12, above-mentioned installation position data is revised according to the position correction data that step S6 obtained at printing equipment 10.
At step S13, by the controller of erecting device 30 erecting device 30 is controlled, according to above-mentioned revised installation position data, electronic component is installed to component installation location on the substrate.
In addition, the controlled step of testing fixture 20,40,60 is as follows.
At first, at step S21, the controller of testing fixture 20,40,60 is read the inspection position data (determining the data of the checking elements position on the substrate) of storage in advance.
Secondly, at step S22, above-mentioned inspection position data is revised according to the position correction data that the step S6 at printing equipment 10 obtains.
Then, at step S23, the controller of testing fixture 20,40,60 is controlled testing fixture 20,40,60 respectively, makes it according to above-mentioned revised installation position data, and the checking elements position on substrate is checked electronic component.(the control main points of determining of the checking elements position of relevant testing fixture 20,40,60, except that running opportunity, other are all identical).
As mentioned above, adopt the related manufacturing installation of substrate for element mounting of embodiments of the present invention, the data processing unit of controller 90 (main operational part 91), view data according to matte aperture position recognition unit 11, calculate corresponding to the position correction data of matte aperture position with respect to the position of substrate W, simultaneously, by transmitting element (control device 70) above-mentioned position correction data are sent to erecting device.In addition, because erecting device 30 is according to the installation site of the above-mentioned position correction data correction electronic component that is sent out, on this component installation location that is corrected, electronic component is installed then, therefore only otherwise change the matte 7 of printing equipment 10, need not to measure the scolder position and just can on appropriate component installation location, electronic component be installed corresponding to the scolder position.
In addition, adopt foregoing invention, because testing fixture 20,40,60 is according to the inspection position of the electronic component on the position correction data correction substrate that is sent out, therefore only otherwise change the matte of printing equipment 10, need not to measure the scolder position can be at the appropriate checking elements position detection electronic component corresponding to the scolder position.
Particularly, because data processing unit (main operational part 91), except that the matte aperture position data of calculating according to the view data of matte aperture position recognition unit 11, also will according to the view data of landmarks identification unit (printing equipment substrate landmarks identification unit 15) calculate corresponding to the revisal amount data of mark position as the position correction data, even therefore substrate or matte depart from respect to the position of printing equipment main body 2, this departs from also can give revisal.
Below, with reference to Fig. 2 and Fig. 6, the 1st variation of the manufacturing installation of substrate for element mounting that present embodiment is related is described.Fig. 6 is the flow chart of the control main points of expression the 1st variation.In addition, in the following description, pay identical symbol with step identical in the flow chart of Fig. 5, the part explanation of repetition is omitted.
In the 1st variation, the printing equipment substrate landmarks identification unit 15 (with reference to Fig. 2) of printing equipment 10, discern with the substrate sign to obtain view data by the substrate of taking substrate W, above-mentioned printing equipment substrate landmarks identification unit 15 of while, as the scolder location identification unit, shooting is printed on of scolder on the substrate W to a plurality of solder joints, to obtain view data.
In addition, in this 1st variation, the main operational part 91 (data processing unit) of the controller 90 of printing equipment 10, carry out data processing by view data to the printing equipment substrate landmarks identification unit 15 of printing equipment 10, calculate the position of substrate W, simultaneously the view data as the printing equipment substrate landmarks identification unit 15 of scolder location identification unit is carried out data processing, thereby calculate the position that is printed scolder.
Then, for the deviation between the position of eliminating matte aperture position data and actual printing solder, can proofread and correct the position correction data.
At this, the control main points that relate to the 1st variation are illustrated.
As shown in Figure 6, in the 1st variation, too printing equipment 10 and erecting device 30 and testing fixture 20,40,60 are controlled, but, injected as following step S5a, the processing of step S5b in controlled step to printing equipment 10.
Promptly, at first, at step S5a, the printing equipment substrate landmarks identification unit 15 of printing equipment 10 as the scolder location identification unit, is printed at least one point of the scolder of substrate W by shooting, to obtain view data, the main operational part 91 (data processing equipment) of controller 90 simultaneously carries out data processing to the view data as the printing equipment substrate landmarks identification unit 15 of scolder location identification unit, is printed the position of scolder with mensuration.
Then,, when occurring departing between matte aperture position and the printing solder position, depart from, matte aperture position data are proofreaied and correct by the scolder position for correcting this at step S5b.
At Fig. 6, except that above-mentioned step S5a, S5b, the control main points of other step are identical with Fig. 5.
Like this, adopt the 1st variation,, therefore can install or check electronic component more accurately because data processing unit (main operational part 91) can be proofreaied and correct matte aperture position data by the scolder position.And, the position finding of printing solder because structural reason, only need to the point of necessity or a few point measure just can, need not to measure the printing position of all scolders on the substrate, therefore can not increase the required time of mensuration.
Below, with reference to Fig. 7, the 2nd variation of the related manufacturing installation of substrate for element mounting of present embodiment is illustrated.Fig. 7 is the flow chart of the control main points of expression the 2nd variation.In addition, in the following description, the step identical with the flow chart of Fig. 6 paid identical symbol, the part explanation of repetition is omitted.
The 2nd variation, identical with the 1st variation, the printing equipment substrate landmarks identification unit 15 (with reference to Fig. 2) of printing equipment 10, discern with the substrate sign to obtain view data by the substrate of taking substrate W, above-mentioned printing equipment substrate landmarks identification unit 15 of while, as the scolder location identification unit, one that takes the scolder be printed on substrate to a plurality of solder joints, to obtain view data.
In addition, in the 2nd variation, particularly when the position of calculating according to matte aperture position data and the deviation between the scolder position surpassed ormal weight, the scolder position data that can look like to calculate by the location drawing according to each scolder on the captured substrate substituted above-mentioned matte aperture position data.
Below, the control main points of the 2nd variation are described.
As shown in Figure 7, the 2nd variation, identical with the 1st variation of Fig. 6, printing equipment 10 and erecting device 30 and testing fixture 20,40,60 are controlled, in controlled step to printing equipment 10, except that the processing of having injected step S5a, step S5b, also injected the processing of following step S5d～step S5f.
That is, carrying out a bit or a bit after (step S5a) mensuration of above scolder position,, whether the position of calculating according to matte aperture position data and the deviation between the scolder position are being surpassed ormal weight judged at step S5d.When being judged to be YES, enter step S5e, at the position that is printed on all scolders on the substrate, the portrait captured according to printing equipment substrate landmarks identification unit 15 carries out the mensuration of scolder position.Then, at step S5f, use the scolder position data of calculating according to the location drawing picture of each scolder on the captured substrate to replace matte aperture position data.
In addition, when the result of step S5d is NO, proofread and correct above-mentioned matte aperture position data according to the scolder position.
In Fig. 7, except that above step S5d, S5f, the processing of other steps is identical with Fig. 6.
Like this, adopt the 2nd variation, when matte aperture position data with respect to the deviation of scolder position when ormal weight is following, can unify to revise to matte aperture position data by a scolder position.In addition, when matte aperture position data increase to when to a certain degree above with respect to the deviation of scolder position, can substitute above-mentioned matte aperture position data by the scolder position data of calculating according to the location drawing picture of each scolder on the captured substrate, set positions with each actual print scolder is a benchmark thus, thereby component installation location or checking elements position can not produce bigger departing from.
In addition, because under normal conditions, the position of matte aperture position and actual print scolder is roughly consistent, so seldom carry out the processing of step S5e, S5f, therefore can significantly be increased the production and processing time as substrate is carried out the situation that solder printing all must be taken all scolder positions at every turn.
But, above-mentioned execution mode only shows concrete preferred embodiment of the present invention, but the present invention also not only is confined to this.
For example, in the present embodiment, main operational part 91 (being equivalent to data processing unit), calculate matte aperture position data according to the view data of matte aperture position recognition unit, calculate revisal amount data according to the view data of above-mentioned landmarks identification unit (printing equipment substrate landmarks identification unit 15) corresponding to the mark position, with as corresponding to the position correction data of matte aperture position with respect to the position of substrate W, sent then, but above-mentioned adjustment is done in the position of substrate, so that substrate W and matte 7 location recognition sign separately is when consistent, can replace taking the sign of substrate one side by the sign of taking matte one side, calculate the revisal amount data of the mark position of matte one side that obtains corresponding to view data then from the sign of above-mentioned matte one side.
Perhaps, in the time of can determining the position of substrate exactly at each device, can omit identification to the mark position, view data according to matte aperture position recognition unit, calculate corresponding to the position correction data of matte aperture position, send to erecting device by transmitting element then with respect to the position of substrate.
In addition, at above-mentioned execution mode, be provided with the location recognition sign at substrate W and matte 7 respectively, according to the identification of these signs is carried out the position adjustment to matte 7 with substrate W, but also can by take, the privileged site of analytic substrate, for example, the part of circuit pattern is discerned substrate position, with the location recognition sign of this alternative substrate one side, also can discern the matte position in addition, with the location recognition sign of this alternative matte one side by the privileged site of shooting, analysis edge portion framework etc.
In addition, in the 1st and the 2nd variation of present embodiment, printing equipment substrate landmarks identification unit 15 by printing equipment 10, as the scolder location identification unit, shooting is printed on the position of the scolder of substrate W, obtaining view data, but also can take and the unit of the position of identification printing solder, be independent of above-mentioned printing equipment substrate landmarks identification unit 15 and be arranged in addition on the printing equipment, perhaps also this element can be arranged on the outside of printing equipment.
In addition, in the present embodiment, step S1 at the flow chart of Fig. 5, whether the matte aperture position of judging printing equipment 10 is measured or whether matte is replaced, only when matte aperture position undetermined or matte are replaced, matte aperture position recognition unit 11 is just taken the aperture position of solder printing with matte, to obtain view data, but in addition, also can be after the substrate W of every production regulation number, perhaps behind reasonable time, take the aperture position of solder printing, to obtain view data with matte.
Claims (5)
1. manufacturing installation of substrate for element mounting is characterized in that:
Comprise,
Printing equipment carries out solder printing to element mounting substrate;
At least one erecting device is positioned at the mounting substrate through give conveyance after the above-mentioned printing equipment printing by base board delivery device under the state of installation exercise position of regulation of this erecting device, and electronic component is installed on this substrate;
Above-mentioned printing equipment has,
Take the aperture position of solder printing, to obtain the matte aperture position recognition unit of view data with matte;
According to the view data of above-mentioned matte aperture position recognition unit, calculate data processing unit corresponding to the position correction data of the deviation of the position of substrate and matte aperture position;
Above-mentioned position correction data are sent to the transmitting element of erecting device;
Above-mentioned erecting device according to the installation site of above-mentioned position correction data correction electronic component, and is installed in electronic component on the revised component installation location.
2. manufacturing installation of substrate for element mounting according to claim 1 is characterized in that:
Also comprise, check the testing fixture of the element installment state of aforesaid substrate,
This testing fixture is after receiving the position correction data that above-mentioned transmitting element sent, according to the inspection position of the electronic component on this position correction data correction substrate.
3. according to claim 1 or 2 any described manufacturing installation of substrate for element mounting, it is characterized in that:
Also comprise, landmarks identification unit, when substrate was positioned at the assigned position of above-mentioned printing equipment, the location recognition sign that at least one side gave of taking substrate and matte to be obtaining view data,
Above-mentioned data processing unit is calculated matte aperture position data according to the view data of matte aperture position recognition unit, calculates revisal amount data corresponding to the deviation of mark position according to the view data of above-mentioned landmarks identification unit, with as the position correction data.
4. manufacturing installation of substrate for element mounting according to claim 3 is characterized in that:
Also comprise by take by above-mentioned printing equipment be printed on scolder on the substrate more at least, obtaining the scolder location identification unit of view data,
Above-mentioned data processing unit is calculated the scolder position according to the view data of above-mentioned scolder location identification unit, and according to the above-mentioned matte aperture position of this scolder position correction data.
5. manufacturing installation of substrate for element mounting according to claim 4 is characterized in that:
When the matte aperture position that draws according to matte aperture position data and the deviation between the scolder position surpassed ormal weight, the scolder position data of using the location drawing according to each scolder on the substrate to look like to calculate replaced matte aperture position data.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005106803A JP4237158B2 (en) | 2005-04-01 | 2005-04-01 | Mounting board manufacturing apparatus and manufacturing method |
| JP2005106803 | 2005-04-01 |
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| Publication Number | Publication Date |
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| CN1849038A CN1849038A (en) | 2006-10-18 |
| CN100584151C true CN100584151C (en) | 2010-01-20 |
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|---|---|---|---|---|
| JP5075747B2 (en) * | 2008-06-19 | 2012-11-21 | 富士機械製造株式会社 | Electronic circuit manufacturing method and electronic circuit manufacturing system |
| JP4898753B2 (en) * | 2008-08-26 | 2012-03-21 | ヤマハ発動機株式会社 | Component mounting system, component mounting method, substrate sticking state detection device, operation condition data creation device, substrate sticking device, component mounting device, and inspection device |
| JP5287158B2 (en) * | 2008-11-11 | 2013-09-11 | 株式会社大真空 | Manufacturing apparatus and manufacturing method of piezoelectric vibration device |
| JP5384085B2 (en) * | 2008-11-11 | 2014-01-08 | ヤマハ発動機株式会社 | Component mounting method and component mounting system |
| JP5258102B2 (en) * | 2009-03-11 | 2013-08-07 | 富士機械製造株式会社 | Tape feeder component supply tape mounting state confirmation device |
| JP6012150B2 (en) * | 2011-08-30 | 2016-10-25 | 富士機械製造株式会社 | Component mounting method and component mounting system |
| JP6018844B2 (en) * | 2012-08-30 | 2016-11-02 | ヤマハ発動機株式会社 | Component mounting method, component mounting apparatus, and program |
| WO2015145728A1 (en) * | 2014-03-28 | 2015-10-01 | 富士機械製造株式会社 | Method for mounting components on multi-layer wiring substrate having cavity |
| JP7291871B2 (en) * | 2019-03-28 | 2023-06-16 | パナソニックＩｐマネジメント株式会社 | MOUNTING BOARD MANUFACTURING SYSTEM AND MOUNTING BOARD MANUFACTURING METHOD |
| JP2020161749A (en) * | 2019-03-28 | 2020-10-01 | パナソニックＩｐマネジメント株式会社 | Information processor |
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| CN1849038A (en) | 2006-10-18 |
| JP2006287062A (en) | 2006-10-19 |
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