JP4490773B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention clamps and fixes an electronic component mounting apparatus, in particular, a wiring board for mounting on a mounting portion, and appropriately sets the installation positions of support pins for supporting the substrate from the back side with support pins for each type of substrate. The present invention relates to an electronic component mounting apparatus that can be designated at an arbitrary position.

  Generally, when mounting (mounting) an electronic component on a wiring board, an electronic component mounting apparatus is used. In this apparatus, after the substrate sent by the transfer device is clamped and fixed by a clamp mechanism installed at a predetermined position of the mounting portion, electronic components are mounted on the substrate.

  At that time, when the wiring board is a film having low rigidity or the like, the back surface side is supported by a support pin installed at a predetermined position to stabilize the board in the vertical direction.

  In such an electronic component mounting apparatus that mounts a component on the substrate after supporting the substrate with the support pins, if the substrate is changed because the type of product to be produced changes, an appropriate support is provided for each substrate. Since the positions are different, a setup operation for changing the installation position of the support pin each time is performed before starting production.

  For example, a device disclosed in Patent Document 1 is known as a mounting apparatus that efficiently performs the setup operation. This device is installed by inserting support pins into holes arranged in a matrix at a constant pitch. Based on position data stored in advance, light is emitted from the bottom of the hole, and then inserted. The position of the support pin is notified to the operator.

JP-A-7-106800

  However, depending on the mounting device disclosed in Patent Document 1, since the support pins can only be installed in a matrix shape determined at a constant pitch, the substrate itself becomes smaller as recently, and also on the back side to be supported. When the place to support is limited like a product on which a component is mounted, there is a problem that it is not possible to cope with it because it is necessary to install the support pin at an arbitrary position finely adjusted.

  The present invention has been made to solve the above-mentioned conventional problems, and an electronic component capable of accurately and easily changing a support pin position in a mounting portion in accordance with a substrate change to an arbitrary position. It is an object to provide a mounting device.

In the electronic component mounting apparatus for mounting an electronic component on the surface of the substrate, the substrate is positioned on the mounting portion and the back surface thereof is supported by a support pin that can be installed at an arbitrary position in the XY direction. Detection means that can move in the X and Y directions for detecting the support pins that are installed, and support pins that are installed in advance at appropriate arbitrary positions for each different type of substrate are detected and acquired by the detection means. Storage means for storing coordinate data of the installation positions of the respective support pins, and instructions for automatically instructing the installation positions of the respective support pins of the corresponding board by moving in the XY directions based on the stored coordinate data together and means, by the coordinate data of the installation position of each support pin and so stored as setup data to the appropriate type of substrate for the production program, before Problems are those that were resolved.

The present invention also each support pin installed at an arbitrary position for a given substrate, when detected by said detecting means, moving the detecting means in the XY direction based on the coordinate data relating to the appropriate substrate, the detected by said detection means is positioned at positions corresponding to each of the support pins may be provided with a judging means for judging correctness of installation position of the corresponding support pin from the detection results.

  In the present invention, each of the detection unit and the instruction unit may be a substrate recognition camera attached to a suction head for sucking and mounting an electronic component.

  In the present invention, a monitor that displays an image captured by the substrate recognition camera may be installed.

  According to the present invention, it is possible to detect the actual position of a support pin installed at an arbitrary position optimal for support on various substrates, store it as coordinate data, and indicate the installation position of each support pin based on the data. Since it did in this way, when a board | substrate change arises, the installation position of the support pin accompanying it can be changed correctly and easily with respect to arbitrary positions.

  Therefore, it is possible to release the operator from the conventional setup work, which has been a heavy load because it requires fine adjustment of the installation position.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows an outline of an electronic component mounting apparatus according to an embodiment of the present invention.

  In the mounting apparatus of this embodiment, a mounting part 12 is provided at a substantially central part on the base 10, and the substrate S sent by the transport device is clamped to the mounting part 12 by a clamp mechanism (not explicitly shown). In addition to being fixed, the back surface is supported by a plurality of support pins 16 installed on the support table 14.

  In addition, an electronic component supplied from a component supply unit (not shown) is adsorbed above the substrate S supported by the support pins 16 in this manner, and positioned and mounted at a mounting position on the substrate S. A suction head 18 is provided.

  Further, the suction head 18 can be moved to any plane position in the X direction and the Y direction by the X drive mechanism and the Y drive mechanism (not shown) controlled by the control box 20, and at the same time in the Z direction. It can move up and down.

  Further, the suction head 18 is provided with a substrate recognition camera 22 for recognizing the substrate S, and the XY coordinates on the mounting unit 12 are recognized from the reference position of the image captured by the camera 22, for example, the center position thereof. It is possible to do. Further, the image captured by the camera 22 can be displayed on the monitor 20A on the control box 20.

  As shown in FIG. 2, the control box 20 includes a CPU that executes control calculations, a ROM that stores various programs, and a temporary storage system, as shown in an outline of a control system provided in the mounting apparatus of the present embodiment. A RAM for storing data and an HDD for storing a large amount of data are included. The suction head 18 and the camera 22 are controlled by an XY unit (drive mechanism) controlled and driven from the control box 20 via an input / output interface. The drive table is controlled so that a support table (support table) 14 on which the support pins 16 are installed is driven up and down by a substrate clamp unit (clamp mechanism).

  In the mounting apparatus of the present embodiment, as shown in FIG. 3 with a part extracted and enlarged, the support pin 16 that supports the back surface of the substrate S is a support table made of a magnetic material by a magnet 16A at the lower end. 14 can be installed in any position, and the suction head 18 is moved in the X and Y directions, and the supporting pin 16 installed in the arbitrary position is detected by the attached camera 22 to thereby detect the XY coordinates. It is possible to get

  Further, in the HDD (storage means) of the control box 20, each support pin previously set at an appropriate position is detected (image recognition) by the camera 22 for each different type of substrate, and each support pin 16 is detected. XY coordinate data related to the installation position of is stored.

  In addition, based on the XY coordinate data stored for each type of substrate in this way, the suction head 18 is moved in the XY directions so that the installation positions of the corresponding support pins 16 are determined by the attached camera 22. It is possible to instruct. That is, the camera 22 functions as both a detection unit and an instruction unit, and a specific instruction is performed by displaying a corresponding position on the substrate S on the monitor 20A. Therefore, the operator can set the target position by installing the pin at the corresponding position while looking at the monitor 20A.

  Next, a preferred operation according to the present embodiment will be described with reference to the flowcharts of FIGS.

  FIG. 4 shows an outline of the procedure in the case of executing the setup (preparation work) for determining the position of the optimal support pin for supporting the board in order to start the production of mounting components on the new production board.

  First, the support pin position up to that time is changed by installing the support pin 16 at an arbitrary position on the support table 14 that is considered optimal for an operator to support a new substrate (steps 1 and 2). ). When the position is determined, the support table 14 is raised from the mounting position in order to align the tip of the support pin 16 with the focus position of the camera 22 (step 3).

  Thereafter, the operator moves the suction head 18 in the X and Y directions while looking at the monitor 20A, moves the XY axes (the center of the screen, the reference position) of the camera 22 to the support pin position (Step 4), the tip of the support pin 16 and the camera The support pin coordinates are recognized (detected) by the camera 22 (step 5).

  Steps 4 and 5 are performed on all the support pins 16 installed on the support table 14 to obtain support pins 1: (X1, Y1), support pins 2: (X2, Y2). Each supported pin coordinate is stored (saved) in the HDD as setup data in a part of the production (mounting) program of the new production board, and all the pin coordinates are displayed on the monitor 20A as necessary. (Step 6).

  The processes in steps 2 to 6 are executed every time a new type of new substrate is produced, and stored as support pin coordinate data for the substrate.

  FIG. 5 shows an outline of a setup procedure when an existing production substrate that has already been prepared and produced is reproduced.

  When the corresponding production program is read (step 11) and the support pin 16 is changed / adjusted (setup) (step 12), the installation position (coordinates) of the first support pin incorporated in the head position of the production program ) To move the center of the camera 22 to match (step 13).

  In this state, the support table 14 is raised (step 14), and the operator installs the support pin 16 on the support table 14 coinciding with the center position of the camera 22 (step 15), and then the camera 22 images the support pin. Then, the installation position (coordinates) is confirmed by displaying on the monitor 20A and recognizing it (step 16).

  Each process of the above steps 13-16 is performed about all the other support pins.

  FIG. 6 shows an outline of the procedure of the support pin installation position determination process performed by the CPU (determination means) immediately after the setup is performed and immediately before the start of production.

  First, a production program related to the corresponding substrate is read (step 21), and when the support pin position is changed (change of setup) immediately before, the support table 14 is raised to a predetermined focus position (steps 22 and 23). ).

  Next, the center of the camera 22 is moved to the coordinates of the support pin registered in the read production program (step 24), and the position of the support pin is imaged and detected (recognized) by the camera 22 on the monitor 20A. The recognition result is compared to determine whether the position is correct (steps 25 and 26).

  The comparison of the recognition results is easy depending on whether the coordinate position of the white point imaged by the camera 22 is within the allowable range by making the tip of the support pin 16 white as shown in FIG. 7, for example. Can be done.

  As a result of the comparison of the recognition results on the monitor 20A (determination of position correctness) performed in the step 26, if it is determined that an error (NG), a warning is issued and the determination result is displayed on the monitor 20A. The support pins are reinstalled (steps 27 and 28). If all the support pins are OK, the support table 14 is lowered to the original position, and production (mounting of electronic parts) is started according to the production program (step 29, step 29). 30).

  According to the embodiment described above in detail, by storing the position data at the time of setup for adjusting the position of the support pin for a newly produced board, when the same kind of board is produced from the next time onward, it is easy and reliable at the time of the setup. Since it becomes possible to install the support pin position at a finely adjusted correct position, it is possible to greatly reduce the number of manual labors during the production of the substrate and to improve the productivity. At the same time, the operator's workload can be greatly reduced.

  Further, since the suction head 18 is moved in the X and Y directions based on the record data stored in advance and the installation position can be indicated by the attached camera 22, the accuracy of the reproducibility of the installation position of the support pin 16 is achieved. Thus, it is possible to reduce variations in mounting electronic components on the substrate S.

  In the above embodiment, the case where the position of the support pin is detected by the camera 22 attached to the suction head 18 and the installation position is indicated is described. However, the present invention is not limited to this, and the suction head is used instead of the camera 22. 18 may be a substrate mark detection sensor (not shown) such as a reflection type distance measuring sensor used for detecting a substrate mark, or one of them may be used as a camera. .

The front view which shows the outline | summary of the electronic component mounting apparatus of one Embodiment which concerns on this invention The block diagram which shows the outline | summary of the control system of the mounting apparatus of this embodiment Enlarged partial perspective view showing relationship between support table, support pin, substrate and camera Flow chart showing the procedure for setting up a new production board Flow chart showing the setup procedure for existing production boards Flow chart showing the procedure for determining the setup during production Schematic showing the characteristics of the support pins used

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Base 12 ... Mounting part 14 ... Support table 16 ... Support pin 16A ... Magnet 18 ... Adsorption head 20 ... Control box 22 ... Camera

Claims (4)

In the electronic component mounting apparatus for positioning the substrate on the mounting portion, supporting the back surface with a support pin that can be installed at an arbitrary position in the XY direction, and mounting the electronic component on the surface of the substrate,
Detection means capable of moving in the XY directions for detecting the support pins installed at arbitrary positions;
Storage means for detecting the support pins previously installed at appropriate arbitrary positions for each different type of substrate by the detection means, and storing the coordinate data of the installation positions of the respective support pins acquired,
An instruction means for automatically instructing the installation position of each support pin of the corresponding substrate by moving in the XY directions based on the stored coordinate data ;
An electronic component mounting apparatus, wherein the coordinate data of the installation positions of the support pins is stored as setup data in a production program for a corresponding type of board . When detecting each support pin installed at an arbitrary position with respect to a predetermined substrate by the detection unit, the detection unit is moved in the XY direction based on the coordinate data related to the corresponding substrate , and corresponds to each support pin . 2. The electronic component mounting apparatus according to claim 1, further comprising: a determination unit that detects the position of the corresponding support pin based on the detection result detected by the detection unit that is positioned at each position.   3. The electronic component mounting apparatus according to claim 1, wherein each of the detection unit and the instruction unit is a board recognition camera attached to a suction head for mounting the electronic component by suction.   The electronic component mounting apparatus according to claim 3, further comprising a monitor that displays an image captured by the board recognition camera.

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