CN1006508B - 掺杂剂均匀分布的固体摄像器及其制造方法 - Google Patents

掺杂剂均匀分布的固体摄像器及其制造方法

Info

Publication number
CN1006508B
CN1006508B CN86107824A CN86107824A CN1006508B CN 1006508 B CN1006508 B CN 1006508B CN 86107824 A CN86107824 A CN 86107824A CN 86107824 A CN86107824 A CN 86107824A CN 1006508 B CN1006508 B CN 1006508B
Authority
CN
China
Prior art keywords
silicon
type
substrate
solid
single crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CN86107824A
Other languages
English (en)
Chinese (zh)
Other versions
CN86107824A (zh
Inventor
加藤弥三郎
铃木利彦
伊沢伸幸
神户秀夫
浜崎正治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60253271A external-priority patent/JP2604715B2/ja
Priority claimed from JP60253269A external-priority patent/JP2656918B2/ja
Priority claimed from JP60253270A external-priority patent/JP2653780B2/ja
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN86107824A publication Critical patent/CN86107824A/zh
Publication of CN1006508B publication Critical patent/CN1006508B/zh
Expired legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/20—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices for inducing a nuclear reaction transmuting chemical elements
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/30—Mechanisms for rotating or moving either the melt or the crystal
    • C30B15/305—Stirring of the melt
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/20—Doping by irradiation with electromagnetic waves or by particle radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/153—Two-dimensional or three-dimensional array CCD image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/158—Charge-coupled device [CCD] image sensors having arrangements for blooming suppression
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/121—The active layers comprising only Group IV materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN86107824A 1985-11-12 1986-11-12 掺杂剂均匀分布的固体摄像器及其制造方法 Expired CN1006508B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JPP253271/85 1985-11-12
JP60253271A JP2604715B2 (ja) 1985-11-12 1985-11-12 固体撮像装置の製造方法
JPP253269/85 1985-11-12
JP60253269A JP2656918B2 (ja) 1985-11-12 1985-11-12 固体撮像装置の製造方法
JPP253270/85 1985-11-12
JP60253270A JP2653780B2 (ja) 1985-11-12 1985-11-12 固体撮像装置の製造方法

Publications (2)

Publication Number Publication Date
CN86107824A CN86107824A (zh) 1987-06-03
CN1006508B true CN1006508B (zh) 1990-01-17

Family

ID=27334206

Family Applications (1)

Application Number Title Priority Date Filing Date
CN86107824A Expired CN1006508B (zh) 1985-11-12 1986-11-12 掺杂剂均匀分布的固体摄像器及其制造方法

Country Status (10)

Country Link
US (2) US4836788A (enExample)
CN (1) CN1006508B (enExample)
AT (1) AT399420B (enExample)
AU (1) AU597915B2 (enExample)
CA (1) CA1293315C (enExample)
DE (1) DE3638287A1 (enExample)
FR (1) FR2590076A1 (enExample)
GB (2) GB2183092B (enExample)
IT (1) IT1197967B (enExample)
NL (1) NL194218C (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930008527B1 (ko) * 1990-10-13 1993-09-09 금성일렉트론 주식회사 Npn형 vccd 구조의 고체촬상 소자
KR930005746B1 (ko) * 1990-10-13 1993-06-24 금성일렉트론 주식회사 지그재그 인터라인 고체 촬상소자
JP2635450B2 (ja) 1991-03-26 1997-07-30 信越半導体株式会社 中性子照射用原料ｃｚシリコン単結晶
US5923071A (en) * 1992-06-12 1999-07-13 Seiko Instruments Inc. Semiconductor device having a semiconductor film of low oxygen concentration
KR970011376B1 (ko) * 1993-12-13 1997-07-10 금성일렉트론 주식회사 씨씨디(ccd)형 고체촬상소자
JP2828244B2 (ja) * 1995-09-26 1998-11-25 シャープ株式会社 受光素子
JPH09306904A (ja) * 1996-05-20 1997-11-28 Mitsubishi Electric Corp 半導体装置
US5907395A (en) * 1997-06-06 1999-05-25 Image Guided Technologies, Inc. Optical fiber probe for position measurement
JP4631717B2 (ja) * 2006-01-19 2011-02-16 株式会社Sumco Ｉｇｂｔ用シリコン単結晶ウェーハ及びｉｇｂｔ用シリコン単結晶ウェーハの製造方法
JP5194146B2 (ja) * 2010-12-28 2013-05-08 ジルトロニック アクチエンゲゼルシャフト シリコン単結晶の製造方法、シリコン単結晶、およびウエハ
US8466000B2 (en) 2011-04-14 2013-06-18 United Microelectronics Corp. Backside-illuminated image sensor and fabricating method thereof
US20130010165A1 (en) 2011-07-05 2013-01-10 United Microelectronics Corp. Optical micro structure, method for fabricating the same and applications thereof
US9312292B2 (en) 2011-10-26 2016-04-12 United Microelectronics Corp. Back side illumination image sensor and manufacturing method thereof
US8318579B1 (en) 2011-12-01 2012-11-27 United Microelectronics Corp. Method for fabricating semiconductor device
US8815102B2 (en) 2012-03-23 2014-08-26 United Microelectronics Corporation Method for fabricating patterned dichroic film
US9401441B2 (en) 2012-06-14 2016-07-26 United Microelectronics Corporation Back-illuminated image sensor with dishing depression surface
US8779344B2 (en) 2012-07-11 2014-07-15 United Microelectronics Corp. Image sensor including a deep trench isolation (DTI)that does not contact a connecting element physically
US8828779B2 (en) 2012-11-01 2014-09-09 United Microelectronics Corp. Backside illumination (BSI) CMOS image sensor process
US8779484B2 (en) 2012-11-29 2014-07-15 United Microelectronics Corp. Image sensor and process thereof
US9279923B2 (en) 2013-03-26 2016-03-08 United Microelectronics Corporation Color filter layer and method of fabricating the same
US9537040B2 (en) 2013-05-09 2017-01-03 United Microelectronics Corp. Complementary metal-oxide-semiconductor image sensor and manufacturing method thereof
US9129876B2 (en) 2013-05-28 2015-09-08 United Microelectronics Corp. Image sensor and process thereof
US9054106B2 (en) 2013-11-13 2015-06-09 United Microelectronics Corp. Semiconductor structure and method for manufacturing the same
US9841319B2 (en) 2013-11-19 2017-12-12 United Microelectronics Corp. Light detecting device
CN106591948B (zh) * 2017-01-21 2019-10-25 台州市一能科技有限公司 一种太阳能电池用n型多晶硅及其生产方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL258192A (enExample) * 1959-12-15
BE625248A (enExample) * 1961-11-24
US3627500A (en) * 1969-04-03 1971-12-14 Dow Corning Method of growing semiconductor rods from a pedestal
DE2362264B2 (de) * 1973-12-14 1977-11-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von homogen n-dotierten siliciumeinkristallen durch bestrahlung mit thermischen neutronen
DE2364015C3 (de) * 1973-12-21 1982-04-08 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen von n-dotierten Siliciumeinkristallen mit einem einstellbaren Dotierungsprofil
GB1530948A (en) * 1975-11-24 1978-11-01 Siemens Ag N-doped silicon crystals
US4129463A (en) * 1977-06-29 1978-12-12 The United States Of America As Represented By The United States Department Of Energy Polycrystalline silicon semiconducting material by nuclear transmutation doping
DE2753488C2 (de) * 1977-12-01 1986-06-19 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zur Herstellung von n-dotiertem Silicium durch Neutronenbestrahlung
JPS5917581B2 (ja) * 1978-01-13 1984-04-21 株式会社東芝 固体撮像装置
GB2059932B (en) * 1979-09-20 1983-10-12 Sony Corp Solidification processes
JPS5850951B2 (ja) * 1979-09-20 1983-11-14 ソニー株式会社 結晶の成長方法とこれに用いる結晶成長装置
US4527182A (en) * 1980-09-19 1985-07-02 Nippon Electric Co., Ltd. Semiconductor photoelectric converter making excessive charges flow vertically
JPS5850951A (ja) * 1981-09-22 1983-03-25 セイコーエプソン株式会社 歯列矯正用ブラケツト
JPH0244799B2 (ja) * 1981-10-26 1990-10-05 Sony Corp Ketsushoseichohoho
US4547957A (en) * 1982-06-11 1985-10-22 Rca Corporation Imaging device having improved high temperature performance
JPS5958866A (ja) * 1982-09-28 1984-04-04 Mitsubishi Electric Corp サイリスタ
JPS6157181A (ja) * 1984-08-28 1986-03-24 Sharp Corp 固体撮像装置
US4659423A (en) * 1986-04-28 1987-04-21 International Business Machines Corporation Semiconductor crystal growth via variable melt rotation

Also Published As

Publication number Publication date
ATA299986A (de) 1994-09-15
IT8622292A0 (it) 1986-11-11
NL194218B (nl) 2001-05-01
US4836788A (en) 1989-06-06
GB2220300B (en) 1990-04-18
AU6492386A (en) 1987-05-14
US4951104A (en) 1990-08-21
CA1293315C (en) 1991-12-17
NL8602873A (nl) 1987-06-01
FR2590076B1 (enExample) 1995-04-28
CN86107824A (zh) 1987-06-03
GB2183092A (en) 1987-05-28
GB8627003D0 (en) 1986-12-10
NL194218C (nl) 2001-09-04
IT1197967B (it) 1988-12-21
GB8917103D0 (en) 1989-09-13
AT399420B (de) 1995-05-26
DE3638287A1 (de) 1987-05-14
AU597915B2 (en) 1990-06-14
GB2220300A (en) 1990-01-04
FR2590076A1 (fr) 1987-05-15
GB2183092B (en) 1990-04-18

Similar Documents

Publication Publication Date Title
US4951104A (en) Solid-state image pick-up device with uniform distribution of dopant therein and production method therefor
JP5484414B2 (ja) Ａｒ／ＮＨ３急速熱的アニーリング工程を含むシリコンウェーハの製造方法
CN1246506C (zh) 拉晶机和其所用的热屏蔽装置
US8357939B2 (en) Silicon wafer and production method therefor
CN86106346A (zh) 半导体器件的高氧含量硅单晶基片及其制法
KR20090095494A (ko) 실리콘 기판과 그 제조방법
US7524375B1 (en) Growth of uniform crystals
GB2109267A (en) Processes for solidifying liquid materials
KR20000006142A (ko) 질소도프된저결함실리콘단결정의제조방법
EP2112254A2 (en) Silicon substrate and manufacturing method thereof
WO2014155985A1 (ja) シリコン単結晶製造装置およびこれを用いたシリコン単結晶製造方法
EP0787838A1 (en) Method of manufacturing single crystal of silicon
JP2656918B2 (ja) 固体撮像装置の製造方法
US5938836A (en) Apparatus and method for manufacturing semiconductor single crystals
JPH0416589A (ja) 単結晶製造装置
JP2604715B2 (ja) 固体撮像装置の製造方法
JP2653780B2 (ja) 固体撮像装置の製造方法
CN112951932B (zh) 固体摄像组件用的硅单晶基板及硅磊晶晶圆、以及固体摄像组件
JP5401809B2 (ja) シリコン基板とその製造方法
KR100714215B1 (ko) 고품질 실리콘 단결정 잉곳 및 그로부터 제조된 고 품질 실리콘 웨이퍼
ITMI20011120A1 (it) Wafer di silicio aventi distribuzione controllata di difetti, metodi di preparazione degli stessi, ed estrattori czochralski per la fabbrica
JPH09115848A (ja) 半導体基板および半導体装置の各製造方法
JP6448789B2 (ja) ＣｄＴｅ系化合物単結晶及びその製造方法
KR100749938B1 (ko) 고품질 실리콘 단결정 잉곳 성장장치 및 성장방법
KR100793371B1 (ko) 실리콘 단결정 성장 방법 및 성장 장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C13 Decision
GR02 Examined patent application
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term