NL194218B - Werkwijze voor het produceren van een vaste-stof beeldopnemer. - Google Patents

Werkwijze voor het produceren van een vaste-stof beeldopnemer.

Info

Publication number
NL194218B
NL194218B NL8602873A NL8602873A NL194218B NL 194218 B NL194218 B NL 194218B NL 8602873 A NL8602873 A NL 8602873A NL 8602873 A NL8602873 A NL 8602873A NL 194218 B NL194218 B NL 194218B
Authority
NL
Netherlands
Prior art keywords
producing
solid
image sensor
state image
state
Prior art date
Application number
NL8602873A
Other languages
English (en)
Other versions
NL194218C (nl
NL8602873A (nl
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60253271A external-priority patent/JP2604715B2/ja
Priority claimed from JP60253270A external-priority patent/JP2653780B2/ja
Priority claimed from JP60253269A external-priority patent/JP2656918B2/ja
Application filed by Sony Corp filed Critical Sony Corp
Publication of NL8602873A publication Critical patent/NL8602873A/nl
Publication of NL194218B publication Critical patent/NL194218B/nl
Application granted granted Critical
Publication of NL194218C publication Critical patent/NL194218C/nl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/261Bombardment with radiation to produce a nuclear reaction transmuting chemical elements
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/30Mechanisms for rotating or moving either the melt or the crystal
    • C30B15/305Stirring of the melt
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/20Doping by irradiation with electromagnetic waves or by particle radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14831Area CCD imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14887Blooming suppression
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
NL8602873A 1985-11-12 1986-11-12 Werkwijze voor het produceren van een vaste-stof beeldopnemer. NL194218C (nl)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP25326985 1985-11-12
JP25327185 1985-11-12
JP60253271A JP2604715B2 (ja) 1985-11-12 1985-11-12 固体撮像装置の製造方法
JP60253270A JP2653780B2 (ja) 1985-11-12 1985-11-12 固体撮像装置の製造方法
JP25327085 1985-11-12
JP60253269A JP2656918B2 (ja) 1985-11-12 1985-11-12 固体撮像装置の製造方法

Publications (3)

Publication Number Publication Date
NL8602873A NL8602873A (nl) 1987-06-01
NL194218B true NL194218B (nl) 2001-05-01
NL194218C NL194218C (nl) 2001-09-04

Family

ID=27334206

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8602873A NL194218C (nl) 1985-11-12 1986-11-12 Werkwijze voor het produceren van een vaste-stof beeldopnemer.

Country Status (10)

Country Link
US (2) US4836788A (nl)
CN (1) CN1006508B (nl)
AT (1) AT399420B (nl)
AU (1) AU597915B2 (nl)
CA (1) CA1293315C (nl)
DE (1) DE3638287A1 (nl)
FR (1) FR2590076A1 (nl)
GB (2) GB2183092B (nl)
IT (1) IT1197967B (nl)
NL (1) NL194218C (nl)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930008527B1 (ko) * 1990-10-13 1993-09-09 금성일렉트론 주식회사 Npn형 vccd 구조의 고체촬상 소자
KR930005746B1 (ko) * 1990-10-13 1993-06-24 금성일렉트론 주식회사 지그재그 인터라인 고체 촬상소자
JP2635450B2 (ja) 1991-03-26 1997-07-30 信越半導体株式会社 中性子照射用原料czシリコン単結晶
US5923071A (en) * 1992-06-12 1999-07-13 Seiko Instruments Inc. Semiconductor device having a semiconductor film of low oxygen concentration
KR970011376B1 (ko) * 1993-12-13 1997-07-10 금성일렉트론 주식회사 씨씨디(ccd)형 고체촬상소자
JP2828244B2 (ja) * 1995-09-26 1998-11-25 シャープ株式会社 受光素子
JPH09306904A (ja) * 1996-05-20 1997-11-28 Mitsubishi Electric Corp 半導体装置
US5907395A (en) * 1997-06-06 1999-05-25 Image Guided Technologies, Inc. Optical fiber probe for position measurement
JP4631717B2 (ja) * 2006-01-19 2011-02-16 株式会社Sumco Igbt用シリコン単結晶ウェーハ及びigbt用シリコン単結晶ウェーハの製造方法
JP5194146B2 (ja) * 2010-12-28 2013-05-08 ジルトロニック アクチエンゲゼルシャフト シリコン単結晶の製造方法、シリコン単結晶、およびウエハ
US8466000B2 (en) 2011-04-14 2013-06-18 United Microelectronics Corp. Backside-illuminated image sensor and fabricating method thereof
US20130010165A1 (en) 2011-07-05 2013-01-10 United Microelectronics Corp. Optical micro structure, method for fabricating the same and applications thereof
US9312292B2 (en) 2011-10-26 2016-04-12 United Microelectronics Corp. Back side illumination image sensor and manufacturing method thereof
US8318579B1 (en) 2011-12-01 2012-11-27 United Microelectronics Corp. Method for fabricating semiconductor device
US8815102B2 (en) 2012-03-23 2014-08-26 United Microelectronics Corporation Method for fabricating patterned dichroic film
US9401441B2 (en) 2012-06-14 2016-07-26 United Microelectronics Corporation Back-illuminated image sensor with dishing depression surface
US8779344B2 (en) 2012-07-11 2014-07-15 United Microelectronics Corp. Image sensor including a deep trench isolation (DTI)that does not contact a connecting element physically
US8828779B2 (en) 2012-11-01 2014-09-09 United Microelectronics Corp. Backside illumination (BSI) CMOS image sensor process
US8779484B2 (en) 2012-11-29 2014-07-15 United Microelectronics Corp. Image sensor and process thereof
US9279923B2 (en) 2013-03-26 2016-03-08 United Microelectronics Corporation Color filter layer and method of fabricating the same
US9537040B2 (en) 2013-05-09 2017-01-03 United Microelectronics Corp. Complementary metal-oxide-semiconductor image sensor and manufacturing method thereof
US9129876B2 (en) 2013-05-28 2015-09-08 United Microelectronics Corp. Image sensor and process thereof
US9054106B2 (en) 2013-11-13 2015-06-09 United Microelectronics Corp. Semiconductor structure and method for manufacturing the same
US9841319B2 (en) 2013-11-19 2017-12-12 United Microelectronics Corp. Light detecting device
CN106591948B (zh) * 2017-01-21 2019-10-25 台州市一能科技有限公司 一种太阳能电池用n型多晶硅及其生产方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL258192A (nl) * 1959-12-15
BE625248A (nl) * 1961-11-24
US3627500A (en) * 1969-04-03 1971-12-14 Dow Corning Method of growing semiconductor rods from a pedestal
DE2362264B2 (de) * 1973-12-14 1977-11-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von homogen n-dotierten siliciumeinkristallen durch bestrahlung mit thermischen neutronen
DE2364015C3 (de) * 1973-12-21 1982-04-08 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen von n-dotierten Siliciumeinkristallen mit einem einstellbaren Dotierungsprofil
GB1530948A (en) * 1975-11-24 1978-11-01 Siemens Ag N-doped silicon crystals
US4129463A (en) * 1977-06-29 1978-12-12 The United States Of America As Represented By The United States Department Of Energy Polycrystalline silicon semiconducting material by nuclear transmutation doping
DE2753488C2 (de) * 1977-12-01 1986-06-19 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zur Herstellung von n-dotiertem Silicium durch Neutronenbestrahlung
JPS5917581B2 (ja) * 1978-01-13 1984-04-21 株式会社東芝 固体撮像装置
JPS5850951B2 (ja) * 1979-09-20 1983-11-14 ソニー株式会社 結晶の成長方法とこれに用いる結晶成長装置
GB2059932B (en) * 1979-09-20 1983-10-12 Sony Corp Solidification processes
DE3168333D1 (en) * 1980-09-19 1985-02-28 Nec Corp Semiconductor photoelectric converter
JPS5850951A (ja) * 1981-09-22 1983-03-25 セイコーエプソン株式会社 歯列矯正用ブラケツト
JPH0244799B2 (ja) * 1981-10-26 1990-10-05 Sony Corp Ketsushoseichohoho
US4547957A (en) * 1982-06-11 1985-10-22 Rca Corporation Imaging device having improved high temperature performance
JPS5958866A (ja) * 1982-09-28 1984-04-04 Mitsubishi Electric Corp サイリスタ
JPS6157181A (ja) * 1984-08-28 1986-03-24 Sharp Corp 固体撮像装置
US4659423A (en) * 1986-04-28 1987-04-21 International Business Machines Corporation Semiconductor crystal growth via variable melt rotation

Also Published As

Publication number Publication date
DE3638287A1 (de) 1987-05-14
AU597915B2 (en) 1990-06-14
GB8627003D0 (en) 1986-12-10
IT1197967B (it) 1988-12-21
US4951104A (en) 1990-08-21
CN86107824A (zh) 1987-06-03
NL194218C (nl) 2001-09-04
GB2183092A (en) 1987-05-28
AU6492386A (en) 1987-05-14
NL8602873A (nl) 1987-06-01
FR2590076A1 (fr) 1987-05-15
GB2220300A (en) 1990-01-04
IT8622292A0 (it) 1986-11-11
FR2590076B1 (nl) 1995-04-28
US4836788A (en) 1989-06-06
AT399420B (de) 1995-05-26
CA1293315C (en) 1991-12-17
ATA299986A (de) 1994-09-15
GB8917103D0 (en) 1989-09-13
CN1006508B (zh) 1990-01-17
GB2220300B (en) 1990-04-18
GB2183092B (en) 1990-04-18

Similar Documents

Publication Publication Date Title
NL194218B (nl) Werkwijze voor het produceren van een vaste-stof beeldopnemer.
NL194114B (nl) Werkwijze voor het vervaardigen van een prothesedeel.
NL194832B (nl) Werkwijze voor het vormen van een dunne-halfgeleiderfilm.
DE68917242D1 (de) Festkörperbildsensor.
NL184909C (nl) Werkwijze voor het vervaardigen van een structuur die polypropeen bevat.
NL193225B (nl) Werkwijze voor het vervaardigen van een warmwateropslageenheid.
NL189516C (nl) Werkwijze voor het bereiden van roet.
NL192189B (nl) Stelsel voor het reprojekteren van beelden onder toepassing van omzettechnieken.
NL186817C (nl) Werkwijze voor het continu afvoeren van een suspensie.
DE3268589D1 (en) Method for driving solid-state image sensor
NL188432C (nl) Werkwijze voor het vervaardigen van een mosfet.
NL191376C (nl) Werkwijze voor het optimaliseren van de vermogensopname van een aantal parallel-geschakelde hysteresismotoren.
NL185820C (nl) Werkwijze voor het vervaardigen van een losmaakbare ritssluiting.
NL193542B (nl) Werkwijze voor het bereiden van een zout van de methylester van Ó-L-aspartyl-L-fenylalanine.
NL194600B (nl) Werkwijze voor het vervaardigen van een sigaret en een daarmee verkregen sigaret.
NL188097C (nl) Werkwijze voor het bereiden van een polyfenyleenether.
NL192232B (nl) Werkwijze voor het vervaardigen van een magnetoresistief element.
NL188953C (nl) Werkwijze voor het vervaardigen van een elektrode.
IT8785530A0 (it) Custodia per telecamere.
DE3789988D1 (de) Festkörpersbildsensor.
NL178749C (nl) Werkwijze voor het vervaardigen van een racket frame.
NL193474B (nl) Werkwijze voor het bedrijven van een microprocessor.
NL191713C (nl) Inrichting voor het bevestigen van een gevelelement.
NL180174B (nl) Werkwijze voor het vervaardigen van een racketraam.
NL193793B (nl) Werkwijze voor het vervaardigen van spaanplaten.

Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
V4 Discontinued because of reaching the maximum lifetime of a patent

Effective date: 20061112