CN100590817C - Pmos晶体管及其形成方法 - Google Patents
Pmos晶体管及其形成方法 Download PDFInfo
- Publication number
- CN100590817C CN100590817C CN200710094530A CN200710094530A CN100590817C CN 100590817 C CN100590817 C CN 100590817C CN 200710094530 A CN200710094530 A CN 200710094530A CN 200710094530 A CN200710094530 A CN 200710094530A CN 100590817 C CN100590817 C CN 100590817C
- Authority
- CN
- China
- Prior art keywords
- semiconductor substrate
- antimony
- injection
- source
- grid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710094530A CN100590817C (zh) | 2007-12-13 | 2007-12-13 | Pmos晶体管及其形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710094530A CN100590817C (zh) | 2007-12-13 | 2007-12-13 | Pmos晶体管及其形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101459083A CN101459083A (zh) | 2009-06-17 |
CN100590817C true CN100590817C (zh) | 2010-02-17 |
Family
ID=40769850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710094530A Expired - Fee Related CN100590817C (zh) | 2007-12-13 | 2007-12-13 | Pmos晶体管及其形成方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100590817C (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101814456B (zh) * | 2009-02-23 | 2013-04-24 | 台湾积体电路制造股份有限公司 | 集成电路装置及其形成方法 |
CN102487009B (zh) * | 2010-12-02 | 2014-06-04 | 中芯国际集成电路制造(上海)有限公司 | 一种nmos器件源极和漏极的制作方法 |
CN106910685A (zh) * | 2015-12-23 | 2017-06-30 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制备方法、电子装置 |
CN107039521A (zh) * | 2016-02-04 | 2017-08-11 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
CN109841507B (zh) * | 2017-11-24 | 2020-11-27 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其形成方法 |
-
2007
- 2007-12-13 CN CN200710094530A patent/CN100590817C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101459083A (zh) | 2009-06-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101752254B (zh) | 形成离子注入区的方法、mos晶体管及其制造方法 | |
CN102623341A (zh) | 一种mos晶体管的制造方法 | |
KR20160012459A (ko) | 반도체 소자 및 그 제조 방법 | |
US8669160B2 (en) | Method for manufacturing a semiconductor device | |
CN100590817C (zh) | Pmos晶体管及其形成方法 | |
CN102054695B (zh) | 提高半导体元器件的性能的方法 | |
JP2006060208A (ja) | 高性能なサブ0.1マイクロメートルトランジスタ用のソース/ドレイン構造 | |
CN103855096A (zh) | Cmos晶体管的形成方法 | |
US8728894B2 (en) | Method for fabricating an NMOS transistor | |
CN102468178A (zh) | 晶体管的制作方法 | |
CN101593772B (zh) | Mos晶体管及其形成方法 | |
EP3306671A1 (en) | Fin-fet devices and fabrication methods thereof | |
EP3267476A1 (en) | Semiconductor structure and fabrication method thereof | |
CN101740389A (zh) | Mos晶体管及其形成方法 | |
CN102044438A (zh) | Mos晶体管及其制造方法 | |
CN102054675B (zh) | 偏移侧墙及mos晶体管的形成方法 | |
CN102479709B (zh) | 晶体管及其制作方法 | |
CN102487007A (zh) | 半导体器件的形成方法 | |
CN102087981A (zh) | Mos晶体管的制作方法 | |
CN102709162B (zh) | 形成锗硅沟道以及pmos晶体管的方法 | |
CN101996885A (zh) | Mos晶体管及其制作方法 | |
CN101989550B (zh) | Nmos晶体管的制造方法 | |
CN101459081A (zh) | Mos晶体管的形成方法 | |
CN101989549B (zh) | Nmos晶体管的制造方法 | |
CN103377935B (zh) | Mos晶体管的制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111123 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111123 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100217 Termination date: 20181213 |