CN100589683C - 软硬结合印制线路板的制作方法 - Google Patents
软硬结合印制线路板的制作方法 Download PDFInfo
- Publication number
- CN100589683C CN100589683C CN200610063403A CN200610063403A CN100589683C CN 100589683 C CN100589683 C CN 100589683C CN 200610063403 A CN200610063403 A CN 200610063403A CN 200610063403 A CN200610063403 A CN 200610063403A CN 100589683 C CN100589683 C CN 100589683C
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- Prior art keywords
- circuit board
- soft
- single face
- back side
- face soft
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200610063403A CN100589683C (zh) | 2006-10-31 | 2006-10-31 | 软硬结合印制线路板的制作方法 |
Applications Claiming Priority (1)
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CN200610063403A CN100589683C (zh) | 2006-10-31 | 2006-10-31 | 软硬结合印制线路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN101175379A CN101175379A (zh) | 2008-05-07 |
CN100589683C true CN100589683C (zh) | 2010-02-10 |
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Family Applications (1)
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CN200610063403A Expired - Fee Related CN100589683C (zh) | 2006-10-31 | 2006-10-31 | 软硬结合印制线路板的制作方法 |
Country Status (1)
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CN (1) | CN100589683C (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101848598B (zh) * | 2009-03-26 | 2012-01-04 | 纬创资通股份有限公司 | 软硬印刷电路板模块及其制造方法与加工方法 |
CN103369863B (zh) * | 2013-08-02 | 2016-04-27 | 高德(无锡)电子有限公司 | 一种软板在外层的软硬结合印刷线路板的生产工艺 |
CN103675584A (zh) * | 2013-09-10 | 2014-03-26 | 镇江华印电路板有限公司 | 电路板黑孔导通性测试方法 |
CN103731977B (zh) * | 2013-12-24 | 2016-08-24 | 广州兴森快捷电路科技有限公司 | 非对称式刚挠结合线路板及其制备方法 |
CN112165761B (zh) * | 2020-08-24 | 2022-02-08 | Oppo(重庆)智能科技有限公司 | 软硬结合板、电路板、电子设备及软硬结合板的制备方法 |
CN112873410A (zh) * | 2020-12-31 | 2021-06-01 | 深圳华麟电路技术有限公司 | 软硬结合板panel废料边的冲切模具与工艺及结构 |
CN113038690A (zh) * | 2021-01-28 | 2021-06-25 | 江苏运鸿辉电子科技有限公司 | 一种软硬复合电路板 |
CN113109698A (zh) * | 2021-04-13 | 2021-07-13 | 深圳市三维电路科技有限公司 | 一种多层软硬结合线路板的缺陷测试方法 |
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2006
- 2006-10-31 CN CN200610063403A patent/CN100589683C/zh not_active Expired - Fee Related
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Publication number | Publication date |
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CN101175379A (zh) | 2008-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Production method for soft and hard combined printing circuit board License type: Exclusive license Record date: 20080504 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
|
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201216 Address after: No.92, Central Road, Chengbei Industrial Park, Jingjiang Economic Development Zone, Taizhou City, Jiangsu Province, 214500 Patentee after: Jingjiang Weilian Auto Parts Manufacturing Co.,Ltd. Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100210 Termination date: 20201031 |
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CF01 | Termination of patent right due to non-payment of annual fee |