CN100578830C - 发光元件安装用基板、发光元件模块 - Google Patents

发光元件安装用基板、发光元件模块 Download PDF

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Publication number
CN100578830C
CN100578830C CN200680019592.5A CN200680019592A CN100578830C CN 100578830 C CN100578830 C CN 100578830C CN 200680019592 A CN200680019592 A CN 200680019592A CN 100578830 C CN100578830 C CN 100578830C
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CN
China
Prior art keywords
light
emitting element
substrate
mounting
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200680019592.5A
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English (en)
Chinese (zh)
Other versions
CN101189738A (zh
Inventor
武本恭介
铃木龙次
大桥正和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
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Fujikura Ltd
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Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of CN101189738A publication Critical patent/CN101189738A/zh
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Publication of CN100578830C publication Critical patent/CN100578830C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
CN200680019592.5A 2005-06-07 2006-06-06 发光元件安装用基板、发光元件模块 Expired - Fee Related CN100578830C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP167494/2005 2005-06-07
JP2005167492A JP2006344690A (ja) 2005-06-07 2005-06-07 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機
JP167492/2005 2005-06-07

Publications (2)

Publication Number Publication Date
CN101189738A CN101189738A (zh) 2008-05-28
CN100578830C true CN100578830C (zh) 2010-01-06

Family

ID=37641447

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680019592.5A Expired - Fee Related CN100578830C (zh) 2005-06-07 2006-06-06 发光元件安装用基板、发光元件模块

Country Status (2)

Country Link
JP (1) JP2006344690A (enExample)
CN (1) CN100578830C (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US8067777B2 (en) 2008-05-12 2011-11-29 Occam Portfolio Llc Light emitting diode package assembly
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
JP4572994B2 (ja) 2008-10-28 2010-11-04 東芝ライテック株式会社 発光モジュールおよび照明装置
JP2010153803A (ja) 2008-11-28 2010-07-08 Toshiba Lighting & Technology Corp 電子部品実装モジュール及び電気機器
KR101883839B1 (ko) * 2010-12-07 2018-08-30 엘지이노텍 주식회사 발광소자 모듈 및 이를 포함하는 백라이트 유닛
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
CN103322429A (zh) * 2012-03-19 2013-09-25 台达电子工业股份有限公司 多方向性的灯泡型灯具
CN103929883B (zh) * 2013-01-15 2017-01-25 南京尚孚电子电路有限公司 一种单晶cob封装碗杯孔状铝基板的制作方法
CN104105348A (zh) * 2014-06-16 2014-10-15 张龙 一种铝基板加工工艺
DE102017129311A1 (de) * 2017-12-08 2019-06-13 HELLA GmbH & Co. KGaA Verfahren zur Herstellung eines Leiterplatten-Kühlkörper-Aufbaus und Aufbau aus Leiterplatte und Kühlkörper hierzu
CN113224219B (zh) * 2021-05-10 2021-11-16 珠海市宏科光电子有限公司 一种全彩调色cob光源及其制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208815A (ja) * 1996-07-29 2000-07-28 Nichia Chem Ind Ltd 発光ダイオ―ド
JP2002232009A (ja) * 2001-01-30 2002-08-16 Harison Toshiba Lighting Corp 発光ダイオードアレイ及び光源装置
CN1492520A (zh) * 2002-10-22 2004-04-28 洲磊科技股份有限公司 AlGaInP发光二极管组件
JP2004179048A (ja) * 2002-11-28 2004-06-24 Toshiba Lighting & Technology Corp Ｌｅｄ照明ユニット及びｌｅｄ照明器具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208815A (ja) * 1996-07-29 2000-07-28 Nichia Chem Ind Ltd 発光ダイオ―ド
JP2002232009A (ja) * 2001-01-30 2002-08-16 Harison Toshiba Lighting Corp 発光ダイオードアレイ及び光源装置
CN1492520A (zh) * 2002-10-22 2004-04-28 洲磊科技股份有限公司 AlGaInP发光二极管组件
JP2004179048A (ja) * 2002-11-28 2004-06-24 Toshiba Lighting & Technology Corp Ｌｅｄ照明ユニット及びｌｅｄ照明器具

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Publication number Publication date
JP2006344690A (ja) 2006-12-21
CN101189738A (zh) 2008-05-28

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