JP2006344690A - 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機 - Google Patents

発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機 Download PDF

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Publication number
JP2006344690A
JP2006344690A JP2005167492A JP2005167492A JP2006344690A JP 2006344690 A JP2006344690 A JP 2006344690A JP 2005167492 A JP2005167492 A JP 2005167492A JP 2005167492 A JP2005167492 A JP 2005167492A JP 2006344690 A JP2006344690 A JP 2006344690A
Authority
JP
Japan
Prior art keywords
emitting element
light emitting
light
substrate
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005167492A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006344690A5 (enExample
Inventor
Tatsuji Suzuki
龍次 鈴木
Kyosuke Takemoto
恭介 武本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2005167492A priority Critical patent/JP2006344690A/ja
Priority to PCT/JP2006/311289 priority patent/WO2006132222A1/ja
Priority to EP06757029.1A priority patent/EP1890343A4/en
Priority to CN200680019592.5A priority patent/CN100578830C/zh
Priority to KR20077028211A priority patent/KR101017917B1/ko
Priority to TW95119995A priority patent/TWI311820B/zh
Publication of JP2006344690A publication Critical patent/JP2006344690A/ja
Publication of JP2006344690A5 publication Critical patent/JP2006344690A5/ja
Priority to US11/950,884 priority patent/US7699500B2/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP2005167492A 2005-06-07 2005-06-07 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機 Pending JP2006344690A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2005167492A JP2006344690A (ja) 2005-06-07 2005-06-07 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機
PCT/JP2006/311289 WO2006132222A1 (ja) 2005-06-07 2006-06-06 発光素子実装用基板、発光素子モジュール、照明装置、表示装置及び交通信号機
EP06757029.1A EP1890343A4 (en) 2005-06-07 2006-06-06 SUBSTRATE ON ILLUMINATING ELEMENT INSTALLATION, ILLUMINATING ELEMENT MODULE, ILLUMINATION DEVICE, DISPLAY AND TRAFFIC SIGNALING DEVICE
CN200680019592.5A CN100578830C (zh) 2005-06-07 2006-06-06 发光元件安装用基板、发光元件模块
KR20077028211A KR101017917B1 (ko) 2005-06-07 2006-06-06 발광소자 실장용 기판, 발광소자 모듈, 조명장치, 표시장치및 교통 신호기
TW95119995A TWI311820B (en) 2005-06-07 2006-06-06 Substrate for mounting light-emitting element, light-emitting element module, iluumination apparatus, display apparatus, and traffic signal device
US11/950,884 US7699500B2 (en) 2005-06-07 2007-12-05 Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005167492A JP2006344690A (ja) 2005-06-07 2005-06-07 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機

Publications (2)

Publication Number Publication Date
JP2006344690A true JP2006344690A (ja) 2006-12-21
JP2006344690A5 JP2006344690A5 (enExample) 2007-07-12

Family

ID=37641447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005167492A Pending JP2006344690A (ja) 2005-06-07 2005-06-07 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機

Country Status (2)

Country Link
JP (1) JP2006344690A (enExample)
CN (1) CN100578830C (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009139787A1 (en) * 2008-05-12 2009-11-19 Occam Portfolio Llc Light-emitting diode package assembly
EP2182783A2 (en) 2008-10-28 2010-05-05 Toshiba Lighting & Technology Corporation Light-emitting module and illuminating apparatus
EP2192614A2 (en) 2008-11-28 2010-06-02 Toshiba Lighting & Technology Corporation Electronic component mounting module and electrical apparatus
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101883839B1 (ko) * 2010-12-07 2018-08-30 엘지이노텍 주식회사 발광소자 모듈 및 이를 포함하는 백라이트 유닛
CN103322429A (zh) * 2012-03-19 2013-09-25 台达电子工业股份有限公司 多方向性的灯泡型灯具
CN103929883B (zh) * 2013-01-15 2017-01-25 南京尚孚电子电路有限公司 一种单晶cob封装碗杯孔状铝基板的制作方法
CN104105348A (zh) * 2014-06-16 2014-10-15 张龙 一种铝基板加工工艺
DE102017129311A1 (de) * 2017-12-08 2019-06-13 HELLA GmbH & Co. KGaA Verfahren zur Herstellung eines Leiterplatten-Kühlkörper-Aufbaus und Aufbau aus Leiterplatte und Kühlkörper hierzu
CN113224219B (zh) * 2021-05-10 2021-11-16 珠海市宏科光电子有限公司 一种全彩调色cob光源及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JP4737575B2 (ja) * 2001-01-30 2011-08-03 ハリソン東芝ライティング株式会社 発光ダイオードアレイ及び光源装置
CN1256778C (zh) * 2002-10-22 2006-05-17 洲磊科技股份有限公司 AlGaInP发光二极管组件
JP4222011B2 (ja) * 2002-11-28 2009-02-12 東芝ライテック株式会社 Ｌｅｄ照明器具

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
US8067777B2 (en) 2008-05-12 2011-11-29 Occam Portfolio Llc Light emitting diode package assembly
WO2009139787A1 (en) * 2008-05-12 2009-11-19 Occam Portfolio Llc Light-emitting diode package assembly
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9484329B2 (en) 2008-10-24 2016-11-01 Cree, Inc. Light emitter array layout for color mixing
US8403536B2 (en) 2008-10-28 2013-03-26 Toshiba Lighting & Technology Corporation Light-emitting module and illuminating apparatus having an insulating base having a plurality of insulating layers
EP2182783A2 (en) 2008-10-28 2010-05-05 Toshiba Lighting & Technology Corporation Light-emitting module and illuminating apparatus
US8197099B2 (en) 2008-11-28 2012-06-12 Toshiba Lighting & Technology Corporation Electronic component mounting module and electrical apparatus
EP2192614A2 (en) 2008-11-28 2010-06-02 Toshiba Lighting & Technology Corporation Electronic component mounting module and electrical apparatus
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management

Also Published As

Publication number Publication date
CN101189738A (zh) 2008-05-28
CN100578830C (zh) 2010-01-06

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