CN100565819C - 用于从基片去除多余模制材料的等离子处理方法 - Google Patents

用于从基片去除多余模制材料的等离子处理方法 Download PDF

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Publication number
CN100565819C
CN100565819C CNB2005101362123A CN200510136212A CN100565819C CN 100565819 C CN100565819 C CN 100565819C CN B2005101362123 A CNB2005101362123 A CN B2005101362123A CN 200510136212 A CN200510136212 A CN 200510136212A CN 100565819 C CN100565819 C CN 100565819C
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CN
China
Prior art keywords
gas mixture
plasma
substrate
molding material
fluorine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2005101362123A
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English (en)
Chinese (zh)
Other versions
CN1825546A (zh
Inventor
詹姆斯·D·格蒂
赵建钢
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Nordson Corp
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Nordson Corp
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Publication date
Application filed by Nordson Corp filed Critical Nordson Corp
Publication of CN1825546A publication Critical patent/CN1825546A/zh
Application granted granted Critical
Publication of CN100565819C publication Critical patent/CN100565819C/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Treating Waste Gases (AREA)
CNB2005101362123A 2004-12-22 2005-12-22 用于从基片去除多余模制材料的等离子处理方法 Expired - Fee Related CN100565819C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/021,341 US7842223B2 (en) 2004-12-22 2004-12-22 Plasma process for removing excess molding material from a substrate
US11/021,341 2004-12-22

Publications (2)

Publication Number Publication Date
CN1825546A CN1825546A (zh) 2006-08-30
CN100565819C true CN100565819C (zh) 2009-12-02

Family

ID=36594674

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005101362123A Expired - Fee Related CN100565819C (zh) 2004-12-22 2005-12-22 用于从基片去除多余模制材料的等离子处理方法

Country Status (5)

Country Link
US (1) US7842223B2 (https=)
JP (1) JP4790407B2 (https=)
CN (1) CN100565819C (https=)
SG (1) SG123667A1 (https=)
TW (1) TWI362976B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7635418B2 (en) * 2004-12-03 2009-12-22 Nordson Corporation Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
WO2010008102A1 (en) * 2008-07-14 2010-01-21 Ips Ltd. Cleaning method of apparatus for depositing carbon containing film
US8236615B2 (en) 2009-11-25 2012-08-07 International Business Machines Corporation Passivation layer surface topography modifications for improved integrity in packaged assemblies
US10431470B2 (en) * 2017-02-23 2019-10-01 Tokyo Electron Limited Method of quasi-atomic layer etching of silicon nitride

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WO1991008095A2 (en) 1989-11-24 1991-06-13 Asm Fico Tooling B.V. Single-strip moulding apparatus
JPH06285868A (ja) 1993-03-30 1994-10-11 Bridgestone Corp 加硫金型の清浄方法
US5961860A (en) 1995-06-01 1999-10-05 National University Of Singapore Pulse laser induced removal of mold flash on integrated circuit packages
JP2836616B2 (ja) * 1997-03-05 1998-12-14 日本電気株式会社 導体配線パターンの形成方法
US6230719B1 (en) * 1998-02-27 2001-05-15 Micron Technology, Inc. Apparatus for removing contaminants on electronic devices
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US6489178B2 (en) 2000-01-26 2002-12-03 Texas Instruments Incorporated Method of fabricating a molded package for micromechanical devices
US6439869B1 (en) 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
US6629880B1 (en) 2000-12-14 2003-10-07 National Semiconductor Corporation Rotary mechanical buffing method for deflashing of molded integrated circuit packages
US6732913B2 (en) 2001-04-26 2004-05-11 Advanpack Solutions Pte Ltd. Method for forming a wafer level chip scale package, and package formed thereby
US6815362B1 (en) * 2001-05-04 2004-11-09 Lam Research Corporation End point determination of process residues in wafer-less auto clean process using optical emission spectroscopy
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JP2003273499A (ja) * 2002-03-12 2003-09-26 Nippon Spindle Mfg Co Ltd プリント配線基板のプラズマ洗浄方法
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JP4097069B2 (ja) * 2002-08-28 2008-06-04 Ｔｄｋ株式会社 プリント基板の製造方法
US6750082B2 (en) 2002-09-13 2004-06-15 Advanpack Solutions Pte. Ltd. Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip
KR20060115734A (ko) * 2003-10-28 2006-11-09 노드슨 코포레이션 플라즈마 프로세싱 시스템 및 플라즈마 처리 방법
US7959819B2 (en) * 2004-06-29 2011-06-14 Shouliang Lai Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes
US7635418B2 (en) * 2004-12-03 2009-12-22 Nordson Corporation Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
US20060201910A1 (en) 2004-12-22 2006-09-14 Nordson Corporation Methods for removing extraneous amounts of molding material from a substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SiO2平面光波导工艺中的反应离子刻蚀研究. 周立兵，罗风光等.真空科学与技术学报，第24卷第6期. 2004 *

Also Published As

Publication number Publication date
US7842223B2 (en) 2010-11-30
JP2006179914A (ja) 2006-07-06
TW200702094A (en) 2007-01-16
TWI362976B (en) 2012-05-01
JP4790407B2 (ja) 2011-10-12
US20060131790A1 (en) 2006-06-22
SG123667A1 (en) 2006-07-26
CN1825546A (zh) 2006-08-30

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Granted publication date: 20091202

Termination date: 20191222