CN100553038C - 在基片表面上构建牢固的机械结构的方法 - Google Patents
在基片表面上构建牢固的机械结构的方法 Download PDFInfo
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- CN100553038C CN100553038C CNB2005800127181A CN200580012718A CN100553038C CN 100553038 C CN100553038 C CN 100553038C CN B2005800127181 A CNB2005800127181 A CN B2005800127181A CN 200580012718 A CN200580012718 A CN 200580012718A CN 100553038 C CN100553038 C CN 100553038C
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Abstract
提供了一种牢固的机械结构,可防止基片上所形成的微小的基座结构从该基片表面上剥落。通过将基座金属层镀到晶粒层上,然后再将镀好的基座结构嵌入粘性聚合物材料(比如环氧树脂)中,便形成了一种加固结构。然后,在这种镀好的基座上,可以构建诸如弹簧探针这样的元件。通过抵消施加到某一元件(比如,附着于镀好的基座上的弹簧探针)上的力,粘性聚合物材料可以更好地确保金属基座结构与基片表面的粘合状况。
Description
技术领域
本发明一般而言涉及在基片表面上构建机械结构以便牢固地安装微机电系统(MEMS)的制造过程。更具体地讲,本发明涉及一种被设置在基片表面上用于牢固地安装弹簧探针的结构,这种弹簧探针用在对晶片上的集成电路进行测试的探针卡上。
背景技术
在基片表面上制造机械结构可以有多种应用。这些基片表面包括聚合物、金属、陶瓷、半导体等。通常为了进行电接触,在基片表面上会沉积金属晶粒层,以便形成用于安装机械结构的接合焊片。随着接合焊片的尺寸不断缩小以便容纳像MEMS这种微小结构或容纳阵列中微小结构之间的有限间隔,金属晶粒层便很容易从基片上剥落或断裂,尤其是对接合焊片上形成的机械结构施加显著的力时。因此,变得期望提出一种牢固的支撑结构以防止金属晶粒层从基片上剥离。
如图1所示,安装在基片表面上的MEMS结构的一个示例包括弹簧探针,这种弹簧探针用于形成探针卡以便对晶片上的各元件进行测试。图1示出了典型的弹簧探针2,它附着于基片8的层6的顶端所设置的金属晶粒层4上。层6是可选的,因为金属晶粒层4可以直接连接到基片8上。层6通常是绝缘体但也可能导电,而晶粒层4则是金属,这样便在基片8上产生了金属-电介质层。构成晶粒层4的金属可以包括铜、金、银、钯、钨、钛、铝、镍、或用于促进弹簧探针2的接合或促进电镀以形成弹簧探针2的材料。或者,双层、多层或这些材料中的两种或多种的合金(比如钛-钨、铜-镍-金等)都可以提供晶粒层4。构成层6的绝缘体可以包括聚酰亚胺(PI)、苯并环丁烯(BCB)、FR4、陶瓷、填充聚合物或其它材料。基片8通常是多层陶瓷材料,但是也可以是多层有机金属基质、金属、半导体、或其它。弹簧探针2通常由弹性材料12(比如镍钴)所包住的细金导线10构成,为使导电性最大还对弹性材料12镀了一层薄薄的金14。在层6上构造弹簧探针2的过程包括:在层6上施加金属晶粒层4;然后,接合导线10并制作布线图案;然后,对导线10进行喷镀以便形成层12和14。完整的探针2大约是人的头发的直径那么大。在题为“Method ofManufacturing Electrical Contact Using A Sacrificial Member”的美国专利5,476,211以及题为“Fabricating Interconnects and Tips Using SacrificialSubstrates”的美国专利5,994,152中,进一步描述了用于晶片测试的弹簧探针的细节,这两个专利引用在此作为参考。与图2所示的弹簧探针相似的其它类型的弹簧探针(比如,题为“Lithographic Contact Elements”的美国专利6,255,126中所描述的那些弹簧探针,该专利引用在此作为参考)同样可以附着于基片表面上所设置的金属晶粒层。尽管所提到的是弹簧探针,但是其它机械结构也可以安装在基片上,并且可以从下文所描述的本发明特征中获益。
晶片上集成电路(IC)密度的增大要求用于测试IC的探针卡上所用阵列中的多个弹簧探针之间的间隔会相应地减小。阵列中多个弹簧探针之间的间隔的减小意味着金属晶粒层中所形成的接合焊片的尺寸要减小。随着接合焊片的缩小,晶粒层的绝对破裂或断裂强度对于其下面的基片材料而言变得极为关键。
图2示出了在测试晶片上的IC期间加在探针弹簧上的力F是如何使金属晶粒层焊片从聚酰亚胺表面上剥离的。如图所示,测试期间加在弹簧探针2上的力F可以使金属晶粒层焊片4在区域16处剥离基片6。
晶粒层上所形成的结构(比如弹簧探针)的机械牢固度取决于:(1)晶粒层和基片表面之间的接触面积的大小;(2)基片的表面制备情况;以及(3)晶粒层及其形成所附着的基片表面之间的粘合度。加工处理条件(比如水合/脱水条件)的微小变化可能导致晶粒层和基片之间的粘合强度变差,从而导致晶粒层与基片表面的连接出现大问题。在某些情况下,确实无法构造牢固的部件,因为这种牢固的结构所需的剥离强度超过了晶粒层及其形成所附着的基片之间的粘合强度。
令人期望的是能够提供一种牢固的机械结构,当有力施加到该基片上的这些结构时,可以防止基片表面上所形成的小接合焊片或机械结构剥离该基片表面。
发明内容
根据本发明,提供了一种牢固的机械结构,可以防止基片上所形成的机械结构剥离该基片表面。
这种强化的结构是这样形成的:在金属晶粒层上镀一层附加的金属层,从而形成了一个基座;然后,将镀好的基座结构嵌入像环氧树脂或填充环氧树脂这样的粘合剂材料中。然后,像探针弹簧这样的元件可以构造在所沉积的基座上,或者通过焊接或块结合而转移到该基座上。该粘合材料形成了一种可提高机械牢固度的结构,该结构通过抵消基座上所形成的或附着于基座上的那些元件所受的力,来防止基座从其形成所附着于的基片上剥离。
在一个实施例中,该基座是通过下面的步骤形成的:
(a)在金属晶粒层焊片和基片表面上加掩模材料,并且在金属晶粒层的那些部分上形成图形化的、用于第二金属镀层的小孔;
(b)将第二金属镀层加到这些小孔中,并且除去掩模材料;
(c)在基片表面、金属晶粒层焊片和第二金属镀层上提供一层粘合材料;
(d)使该粘合层平整化,以便露出第二金属镀层;以及
(e)(可选地)用第三金属层来镀第二金属层。
然后,弹簧探针或其它微小结构可以形成于或连接到该基座或第三金属层。在可选的实施例中,没有使用第三金属层。在另一个可选的实施例中,该基座直接形成于基片上而没有用金属晶粒层。在另一个实施例中,该基座包括一个用于插入弹簧探针或其它机械结构的井,这些机械结构可能是通过焊接或铜焊或使用粘合剂而被固定到该井中的。这种基座通过与第一实施例的步骤(a)-(e)相似的步骤形成于基片上,但在基座材料中形成有附加的牺牲金属井材料,这样该牺牲金属井材料可以随后被蚀刻掉或溶解掉,从而留下这种带有一个井的基座。
在另一个实施例中,所描述的一个或多个实施例中的基座柱与基片分开形成,然后通过焊接、铜焊等步骤或通过使用粘合剂再转移并附着于基片上。然后,在基座柱周围涂上加固材料,并且上加固材料和基座柱平整化。在另一个实施例中,基片被蚀刻掉,从而留下了已嵌入加固材料中的基座柱。
附图说明
参照附图进一步解释本发明的细节,其中:
图1示出了在基片上设置的金属晶粒层上所形成的典型的弹簧探针;
图2示出了加在图1所示的弹簧探针上的力使金属晶粒层焊片从基片上剥离的情况;
图3A-3B示出了一种根据本发明用于支撑弹簧探针的牢固的机械结构;
图4A-4F示出了在基片表面上制造牢固的机械结构的方法的一个实施例的步骤;
图5A-5C示出了在图4A-4F所示步骤构成的结构上再形成弹簧探针的步骤;
图5D到5D-1示出了用图5A-5C所示处理过程形成的弹簧探针的阵列;
图6A-6C示出了基座结构和互连轨道的不同形式;
图7A-7E示出了用于牢固的机械结构的可选配置;
图8A-8I示出了在基片表面上制造牢固的机械结构的方法的另一个实施例的步骤,该牢固的机械结构包括一个用于插入并附着机械结构的井;以及
图9A-9E示出了用于形成牢固的机械结构的可选方法,该方法首先形成与支撑基片分开的牢固的基座柱,然后再将这些柱转移到支撑基片上。
具体实施方式
图3A示出了一种根据本发明用于支撑弹簧探针的牢固的机械结构,其中包括了形成于接合焊片4上以便支撑弹簧探针2的基座、置于基座周围的加固绝缘层22以及加在基座上所形成的弹簧探针2上的力F。图3A包括带有绝缘涂覆层6的基片8以及形成于层6上的金属晶粒层接合焊片4,就像图1-2中所描述的那样。在图3A中,从图1和2中直接搬来的元件以相似的方式来标记,在接下来的图中也这样处理。
为了提供基座,图3A包括加在金属晶粒层4上的金属镀层20。图中所示的弹簧探针2构建在金属镀层20上。电介质材料22被置于露出的聚合物表面6上,围绕着金属晶粒层焊片4的边缘,围绕着金属镀层20的边缘,在金属焊片4的部分顶部之上,并且还围绕着弹簧探针结构2的一部分。电介质材料22的示例包括一种聚合物,比如环氧树脂、丙烯酸粘合剂、硅树脂或其它。电介质材料也可以是一种相似的用增强粉末填充的聚合物,该增强粉末可以是碳化硅、氧化硅、氮化硅、碳化钨、氧化铝、氮化铝、氧化钛、氮化钛、或其它合适的填充材料,其相对于聚合物的体积百分比为0-99%。30%到60%的体积百分比范围尤佳。较佳的体积分数将根据粒子的大小分布情况而变化。粒子大小应该选择成,使这些粒子将能填充相邻结构之间的空隙。在某些情况下,导电的金属或碳的粉末可能是令人期望的。通常,本领域所熟知的可用作聚合物增强剂的填充剂都可以作为备选材料。金属晶粒层4形成于通孔或导电线路23上,该导电线路23通过路由线路24与线路25互连,线路25从基片8的相反一侧延伸出去。因此,通过线路23-25并且通过金属晶粒层4和金属镀层20,提供了一条到达顶部所形成的结构2的电通路。基片8被解释成“空间转换器”,它可将基片8的第一表面上某一位置的焊片处的信号路由到相反的表面上不同位置处的一个接点。然而,也可以使用可选的基片排布,例如,线路23是一个通过基片8直接到达相反一侧的垂直通孔。
如图3A所示,在非粘性电介质材料22中的基座结构上,加在探针弹簧2或其它可附着的结构上的力F被转化为水平力Fh和垂直力Fv。相对于图1-2所示的结构而言,用图3A所示的结构可以加强金属焊片4到基片6的粘合。不过,垂直力Fv仍然有可能使基座结构沿电介质材料22的垂直壁滑动,从而使金属晶粒层焊片4从层6上剥离。
图3B示出了加固层22并不覆盖弹簧探针2的底部的可选实施例。与基座层20等高的加强层材料22可以使这些结构(比如弹簧探针2)的连接简化。相比之下,当加固层22像图3A那样形成一腔体时,可能使在基座20上构造一个结构得以简化。
为了进一步加强图3A-3B所示的结构,在本发明的一个可选实施例中,所用的加固层材料22是粘结材料,以取代非粘结材料。粘结材料的示例包括环氧树脂、填充过的环氧树脂、氰酸酯、BCB、或本领域公认的具有粘结特性的其它材料。对于使用像环氧树脂这样的粘结材料的情况,当如图3A所示施加力Fv时,粘结材料22的壁将粘结着以防止基座相对于粘结材料22垂直滑动并且防止金属焊片4剥离层6。
图4A-4F示出了根据本发明在基片表面上制造牢固的机械结构的方法的一个实施例的步骤。首先,如图4A所示,在金属晶粒层4和表面6上涂掩模材料层30,比如光刻胶。金属晶粒层4和表面6可以由上文所述的材料构成。通过使用光刻和蚀刻,使掩模层30图形化,从而在金属晶粒层4的那部分上面留下了一个小孔32。金属晶粒层焊片4的一部分仍然由掩模材料所覆盖。在图4B中,将第二金属层34沉积到掩模层30的小孔32中的金属晶粒层4上。用于沉积第二金属层34的方法包括电镀、无电敷镀、物理汽相沉积(PVD)、化学汽相沉积(CVD)、或本领域已知的其它处理过程。接下来,在图4C中,除去掩模材料30,从而在金属晶粒层4的那部分之上留下了第二金属层34。
在图4D中,在表面6、晶粒层4和第二金属层34上,涂粘结材料36,比如环氧树脂或填充过的环氧树脂或其它上文描述过的材料。在图4E中,通过精研、研磨、抛光、或化学机械抛光(CMP),使粘结材料层36平整化,从而露出第二金属层34。在图4F中,在第二金属层34上施加第三金属层38,从而提供了一个导电性能良好的接合表面。在一个实施例中,第二金属层34由下列构成:镍及其合金,金,银,镍-钴,镍-钯,镍-钨,钨,钯铂等。第三金属层38是适合于沉积或接合、或通过焊接或铜焊而连接的导电材料,该导电材料可以是金、铝、银、铜等。
图5A-5C示出了在图4A-4F的步骤所形成的结构上形成弹簧探针的步骤。在图5A中,弹簧探针的制造过程始于图形化(未示出)和将导线10接合到第三金属层38。图5B示出了接下来的一个可选步骤,其中在接合之前加涂光刻胶37,以便允许在导线10周围形成多个层。在图5C中,制造过程继续,用诸如镍钴等弹性材料12对导线10进行电镀,并且将导电层14(最好是金)涂在弹性层12上。上文提及的美国专利5,476,211和5,994,152中描述了用于形成弹簧探针的其它细节。其它弹簧探针结构(比如,上文所提到的美国专利6,255,126中所公布的结构)以及其它MEMS结构同样可以形成于或接合到图4F所示的结构上。从这种基座中获益从而使剥落的可能性大为减小的其它形式的探针或其它类型的机械结构都可以同样地形成于或连接到这种基座上,就像设计要求可能规定的那样。
图5D示出了粘结材料36中的一组牢固的机械结构,其中包括根据图4A-4F的过程而形成的敷镀的基座,弹簧探针像图5A-5C所示的那样形成于基座上。可以执行图4A-4F的步骤,使得该阵列的多个电镀基座形成在一起。图5D-1示出了图5D中以横截面示出的基座上所形成的弹簧探针的阵列的顶视图。如图5D-1所示,基座柱从上面看是矩形。
图6A示出了形状可选的基座,可替代图5D-1中所示矩形,这些基座可以用于导线接合或锚定元件。图5D-1的矩形40最初是为了图6A中作参考而示出的。作为第一个可选的形状,所示出的第一形状42包括矩形柱部分,它带有附加的锚。除了现在将基座包住的粘结材料36以外,锚部分43也用于防止基座42从其下面的基片上剥落。另一个可行的基座形状是圆形44。可以使用与圆形44相似的形状,它们具有齿或锚凸起,以便防止基座在其下面的基片上旋转。此类形状包括带有渐开线的十字形46和锯齿形48。根据要被安装在基座上的物体的形状以及有可能加在所安装的物体上的负荷的类型,可以使用其它形状的基座柱。
图6B是一张顶视图,示出了基片上的粘结材料36中所包住的两个矩形基座柱50和52,该图还示出了基座柱50和50与接合焊片潜在的互连情况。不过,图6B的配置只是许多可行的互连方案之一。图6B的互连由轨道56和57提供。轨道56连接基座柱50和52,而轨道57则将基座柱52连接到接合焊片54。在粘结材料36和柱50、52上镀一层金属,然后图形化并蚀刻掉该金属层,从而形成了轨道56和57以及接合焊片54。轨道56和57可以被制成受控的阻抗传输线路。轨道56和57也可以与基座同时构成,可以作为高度与基座部件相同的“厚”轨道。作为图4E之后一组步骤的一部分,也可以在粘结材料36的顶部形成电子轨道。这可以由下列顺序来实现:1.通过层36的表面的溅射或金属引晶,实现覆盖金属化;2.加光刻胶并图形化,以产生轨道;以及3.敷镀这些轨道部件,并且除去光刻胶并蚀刻该覆盖金属晶粒。
图6C示出了一张分解透视图,该图示出了基座34可以被设置在图形化的轨道上。轨道58形成于作为制造基座34的起始表面的基片8上。轨道58由导电材料构成,比如叠层的铜-镍-金、或其它可以形成于基片8上并且为形成基片34提供晶粒层的导电材料。基片8可以是多层陶瓷或多层有机材料,就像针对图1所描述的那样,并且还可以包括绝缘的顶层,比如图1中的层6。所示的轨道58使焊片55和59互连。焊片55通过一个通孔连接到基片8的相反一侧,以便连接到另一个轨道或其它未示出的结构。焊片59提供了用于形成基座34的晶粒层。基座被包在粘结材料36中,并且可以使像弹簧探针这样的结构附着于其表面上。
图7A-7E示出了在基片表面上用于支撑金属晶粒层上的元件的一种牢固的机械结构的可选配置。图7A示出了被置于金属晶粒层4上的金属镀层34可以与金属晶粒层4尺寸大致相同。提供如图4F所示的基座镀层34可使粘结材料36不仅涂在晶粒层4的顶部,还涂在其侧面,从而更好地防止晶粒层4从基片表面6上剥落,但是在使用图7A所示配置的情况下粘结材料36将仍然提供支撑。图7A-7E的全部示出了可以通过在下面的基片8中形成的线路23-25来提供路由。尽管像图1所示的在基片8上的层6并没有被示出,但是如上文所述可以将其包括进来。图7B示出了可以在不对金属晶粒层4进行附加的敷镀的情况下涂上粘结材料36从而在晶粒层4上形成基座。在不对金属晶粒层4进行敷镀的情况下,粘结材料36粘结并抵消金属晶粒层4上形成的结构所受的力时可以用的面积将变得更少了,但是通过图7B的结构中的粘结材料36,仍然有某些反作用力加在金属晶粒层4的侧面上,从而防止剥落。图7C示出了可以涂些粘结材料36以覆盖弹簧探针2或其它所连接的元件的一部分,同时也被涂在基座层上,这与图3A的配置相似。如图7C所示,将层36加到基座上可以帮助构建所连接的结构,比如弹簧探针2。图7D示出了在没有晶粒层4或层38的情况下也可以形成柱或基座39,从而说明了这些层都是可选的。图7D还示出了导线41或除弹簧探针以外的机械结构都可以附着于基座上。图7D还示出了通孔27可以在不经重新路由的情况下从基座39垂直地延伸到基片8的相反一侧。图7E示出了一个元件可以通过使用焊接接头33或通过铜焊形成的相似接头而附着于基座39上。
图8A-8I示出了根据本发明在基片表面上制造牢固的机械结构的方法的另一个实施例的步骤。按照图8A-8I的方法而形成的结构在晶粒层上形成了一个基座,该基座被包在粘结材料中,并且与图4A-4E的方法所构成的结构相似。根据图8A-8I所制成的结构是从图4A-4E中修改而来的,使得该基座形成一个用于附着机械结构(比如弹簧探针)的井。
该方法的步骤始于图8A,其中在金属晶粒层4和基片表面8上加一层掩模材料层30。尽管未示出,但是仍像上文所描述的那样可以选择性地将涂覆层6包括到基片8上。通过使用光刻和蚀刻,对掩模层30进行图形化,从而在金属晶粒层4的那部分上留出一个小孔32。金属晶粒层焊片4的一部分仍然由掩模材料30覆盖。在所示的所有情况和实施例中,掩模层30和金属晶粒层4之间的空间关系可以是这样的,掩模层30可以覆盖底部金属晶粒层4的全部或部分,或一点也不覆盖。如果部分图形化的晶粒层部件4被掩模层30覆盖,则部件4在其暴露处将被随后沉积的金属(比如上文所述的基座区域34)所涂覆。掩模材料30、金属晶粒层4和表面8所用的材料可以是参照图4A-4E所描述的材料中的任一种,或者可以是上文实施例所描述的任一种材料。
在图8B中,在掩模层30的小孔32中,将牺牲金属层62沉积到金属晶粒层4上。然后,可以选择性地执行平整化,以使牺牲金属层62的表面与掩模层30等高并且调节牺牲金属层62的高度。接下来,在图8C中,除去掩模材料30,从而在金属晶粒层4那部分上留下了牺牲金属层62。在图8D中,沉积掩模材料60的附加层,并且用光刻进行图形化,以便在牺牲金属层62周围和晶粒层4上面形成一个小孔,再在该小孔中沉积了第二金属层34。牺牲金属层62是可以蚀刻掉或另外除去的材料,同时可使金属镀层34完好无损。在一个实施例中,牺牲金属层62可以是铜材料,而材料镀层34则由镍、镍合金或其它相似的材料构成。在图8E中,掩模材料60被除去了。
在图8F中,在基片表面6上、金属镀层34所构成的基座周围以及晶粒层4周围,涂上了诸如环氧树脂或填充后的环氧树脂等粘结材料36。在图8G中,对粘结材料层36和基座进行平整化处理,以使第二金属层34露出来。在图8H中,将牺牲金属层62蚀刻掉,从而留下了一个形成于敷镀材料34中的井64。尽管未示出,但是可以对材料34进行进一步的敷镀以便促进随后的接合或焊接。尽管此处的讨论使用金属作为牺牲层部件62的材料,但是该牺牲部件也可以由有机材料构成,比如可进行图形化以产生这种结构的光刻胶或其它聚合物。然后,在图8H所示的步骤中,通过使用合适的溶剂,可以溶解该部件。
图8I示出了MEMS或其它结构66是如何被附着到井64中的。结构66可以是参照图5A-5C描述的弹簧探针,或适于放入井64中的其它结构。通过诸如铜焊或焊接68等方法,或通过使用导电粘合剂,便可以将结构66附着于井64中。
图9A-9E示出了形成牢固的机械结构的一种可选方法,该方法首先形成与支撑基片相分离的牢固的基座柱,然后将这些柱转移到支撑基片上。与图4A-4C的步骤相似,在图9A-9C中,通过沉积掩模材料30,用光刻对掩模材料进行图形化以形成小孔32,用材料填充该小孔32以形成基座柱34,然后除去掩模材料30,从而形成了基座柱。尽管图9A-9C所示的是实心的柱34,但是同样可以形成与图8A-8C所示相似的带有小孔的柱。与上文所述的步骤不同的是,图9A-9C所用的基片70是牺牲基片70,它可以通过溶解或蚀刻等去除牺牲基片70的步骤而与柱34分离,从而留下了基座柱34。牺牲基片70可以由诸如铝、铜、陶瓷、钛-钨等材料构成。
形成基座柱之后,在图9D中,通过诸如焊接、铜焊等步骤,或通过使用粘合剂,可以将基座柱34附着于支撑基片6上。尽管未示出,但是支撑基片可以包括与图4A-4F的焊片4相似的晶粒层焊片,以便促进基座柱34的附着。在基座柱34附着之后,在图9D中除去牺牲基片70,从而留下了附着在支撑基片6上的基座柱34,它与图4E的结构相似。然后,如图9E所示,将加固材料36涂在基座柱34周围,并且使加固材料36和基座柱34平整化。
尽管上文对本发明作了详细说明,但是这仅是要表明本领域的技术人员可如何实施和利用本发明。许多其它的修改将落在权利要求书所界定的本发明范围之中。
Claims (32)
1.一种用于加固金属基座在基片上的连接状况的方法,所述方法包括:
提供具有金属基座的基片,所述金属基座连接到基片的表面,该金属基座的侧面沿基片的表面延伸;
将粘结材料置于邻近所述金属基座的基片表面上,并接触所述金属基座的各侧面;
其中,所述金属基座并不覆盖粘结材料。
2.如权利要求1所述的方法,其特征在于,所述粘结材料并不置于金属基座和基片之间。
3.如权利要求1所述的方法,其特征在于,所述金属基座是通过下列步骤形成的:
使用光刻进行图形化处理,以便形成第一金属层焊片;以及
在所述焊片上提供第二金属层。
4.如权利要求3所述的方法,其特征在于,所述粘结材料还被设置成与所述第一金属层上未被所述第二金属层覆盖的一部分上表面相接触。
5.如权利要求3所述的方法,还包括:
提供所述粘结材料,用于覆盖所述第二金属层所有露出的表面;以及
对所述粘结材料进行平整化处理,以便露出所述第二金属层。
6.如权利要求5所述的方法,还包括:
用第三金属层对所述第二金属层实施电镀。
7.如权利要求1所述的方法,其特征在于,所述金属基座是通过如下步骤形成的:
在所述基片上加掩模材料;
通过使用光刻使所述掩模材料图形化,以便形成小孔;
在所述小孔中加金属,以便形成所述基座;以及
除去所述掩模材料。
8.如权利要求1所述的方法,其特征在于,所述金属基座是通过如下步骤形成的:
在所述基片上加掩模材料;
通过使用光刻使所述掩模材料图形化,以便形成小孔;
在所述小孔中加导电的第一金属,以便形成牺牲柱;
除去所述掩模材料;
加第二掩模材料;
通过使用光刻使所述第二掩模材料图形化,以便在所述牺牲柱周围形成第二小孔;
在所述第二小孔中加第二金属,以便形成所述基座;
对所述基座周围所加的粘结材料以及所述第一和第二金属进行平整化处理,以便露出所述第一金属;以及
除去所述第一金属,以便留下带有一个井的基座。
9.如权利要求1所述的方法,其特征在于,所述金属基座是与所述基片分开形成的,然后再附着于所述基片上。
10.如权利要求9所述的方法,其特征在于,所述金属基座是通过下列步骤形成并附着于所述基片上的:
提供牺牲基片;
通过使用光刻进行图形化处理,以便在所述牺牲基片上形成所述金属基座;
将所述金属基座附着于用来支撑所述金属基座的基片上;以及
除去所述牺牲基片。
11.如权利要求1所述的方法,其特征在于,所述基片包括带有聚酰亚胺叠加层的多层陶瓷。
12.如权利要求1所述的方法,其特征在于,所述基片包括:
底部材料,所述底部材料包括选自下列的材料:多层陶瓷、多层有机材料、金属基质、半导体和金属;以及
涂敷材料,所述涂敷材料形成于在其上形成所述基座的底部材料之上,所述涂敷材料包括选自下列的材料:BCB、陶瓷和聚合物。
13.如权利要求12所述的方法,其特征在于,所述涂敷材料包括聚酰亚胺和/或填充后的聚合物。
14.如权利要求12所述的方法,其特征在于,所述涂敷材料包括FR4。
15.如权利要求1所述的方法,其特征在于,所述粘结材料包括环氧树脂。
16.如权利要求1所述的方法,其特征在于,所述粘结材料包括用充当增强剂的粉末来填充的环氧树脂。
17.如权利要求16所述的方法,其特征在于,所述粉末包括下列中的至少一种:碳化硅、氧化硅、氮化硅、碳化钛、氮化钛、氧化钛、氧化铝和氮化铝。
18.如权利要求6所述的方法,还包括:
将导线接合到所述第三金属层;以及
用弹性材料来涂敷所述导线。
19.一种支撑结构,包括:
基片;
被置于所述基片表面之上的金属基座,该金属基座的侧面沿基片的表面延伸;以及
被置于邻近所述金属基座的基片表面之上并与所述金属基座的各侧面相接触的粘结材料;
其中,所述金属基座并不覆盖粘结材料。
20.如权利要求19所述的支撑结构,其特征在于,所述粘结材料并不置于金属基座和基片之间。
21.如权利要求19所述的支撑结构,其特征在于,所述金属基座包括:
被置于所述金属基座之内的井。
22.如权利要求19所述的支撑结构,其特征在于,所述金属基座包括:
叠加在所述基片上的第一金属晶粒层;以及
叠加在所述第一金属晶粒层上的第二金属层。
23.如权利要求22所述的结构,其特征在于,所述粘结材料还与所述第一金属晶粒层的一部分上表面相接触。
24.如权利要求19所述的支撑结构,其特征在于:
所述基片包括被置于陶瓷上的有机电介质;以及
所述粘结材料包括环氧树脂。
25.如权利要求19所述的支撑结构,其特征在于,
所述基片的第一层包括选自下列的材料:多层陶瓷、多层有机物、金属基质、半导体和金属;以及
第二层包括选自下列的材料:BCB、陶瓷和聚合物。
26.如权利要求25所述的支撑结构,其特征在于,第二层包括聚酰亚胺和/或填充后的聚合物。
27.如权利要求25所述的支撑结构,其特征在于,第二层包括FR4。
28.如权利要求19所述的支撑结构,其特征在于,所述基座具有一种中心多边形的形状,并带有从所述中心多边形延伸出来的锚。
29.如权利要求19所述的支撑结构,还包括:
附着于所述金属基座上的弹簧探针。
30.一种支撑结构,包括:
基片;
被置于所述基片表面之上的金属基座,该金属基座的侧面沿基片的表面延伸;以及
在邻近所述金属基座的基片之上且与所述金属基座的各侧面相接触的电介质材料;
其中,所述金属基座并不覆盖电介质材料。
31.如权利要求30所述的支撑结构,其特征在于,所述电介质材料并不置于金属基座和基片之间。
32.如权利要求30所述的支撑结构,其特征在于,所述电介质材料包括聚合物。
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- 2005-04-26 TW TW94113341A patent/TWI352660B/zh not_active IP Right Cessation
- 2005-04-26 EP EP20050739785 patent/EP1743399A2/en not_active Withdrawn
- 2005-04-26 KR KR1020067022836A patent/KR101188975B1/ko not_active IP Right Cessation
- 2005-04-26 JP JP2007509743A patent/JP2007534947A/ja active Pending
- 2005-04-26 WO PCT/US2005/014377 patent/WO2005104742A2/en active Application Filing
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2007
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Also Published As
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KR20070010042A (ko) | 2007-01-19 |
US7732713B2 (en) | 2010-06-08 |
US7251884B2 (en) | 2007-08-07 |
CN1947308A (zh) | 2007-04-11 |
TW200606013A (en) | 2006-02-16 |
US20100224303A1 (en) | 2010-09-09 |
EP1743399A2 (en) | 2007-01-17 |
WO2005104742A3 (en) | 2006-10-19 |
TWI352660B (en) | 2011-11-21 |
US20050255408A1 (en) | 2005-11-17 |
US8383958B2 (en) | 2013-02-26 |
KR101188975B1 (ko) | 2012-10-08 |
US20080020227A1 (en) | 2008-01-24 |
WO2005104742A2 (en) | 2005-11-10 |
JP2007534947A (ja) | 2007-11-29 |
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