CN100539038C - 苯并环丁烯层的形成方法 - Google Patents
苯并环丁烯层的形成方法 Download PDFInfo
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- CN100539038C CN100539038C CNB2006101193613A CN200610119361A CN100539038C CN 100539038 C CN100539038 C CN 100539038C CN B2006101193613 A CNB2006101193613 A CN B2006101193613A CN 200610119361 A CN200610119361 A CN 200610119361A CN 100539038 C CN100539038 C CN 100539038C
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Application Number | Priority Date | Filing Date | Title |
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CNB2006101193613A CN100539038C (zh) | 2006-12-08 | 2006-12-08 | 苯并环丁烯层的形成方法 |
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CNB2006101193613A CN100539038C (zh) | 2006-12-08 | 2006-12-08 | 苯并环丁烯层的形成方法 |
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CN101197273A CN101197273A (zh) | 2008-06-11 |
CN100539038C true CN100539038C (zh) | 2009-09-09 |
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CNB2006101193613A Expired - Fee Related CN100539038C (zh) | 2006-12-08 | 2006-12-08 | 苯并环丁烯层的形成方法 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103203925B (zh) * | 2012-01-17 | 2015-03-11 | 中国科学院上海微系统与信息技术研究所 | 一种提升光敏bcb薄膜可靠性的方法 |
CN107501459A (zh) * | 2017-08-25 | 2017-12-22 | 江苏明魁高分子材料技术有限公司 | 具有高碳含量和可控光学指数的可交联聚合物及其合成方法和应用 |
CN111668115A (zh) * | 2019-03-08 | 2020-09-15 | 矽磐微电子(重庆)有限公司 | 半导体封装方法及半导体封装结构 |
CN113072037B (zh) * | 2021-03-26 | 2023-10-31 | 电子科技大学 | 一种表面等离子体活化改善玻璃基板bcb键合的方法 |
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C14 | Grant of patent or utility model | ||
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING |
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Effective date of registration: 20111117 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090909 Termination date: 20181208 |
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CF01 | Termination of patent right due to non-payment of annual fee |