CN100533800C - 具有压电块的微机电装置的制作方法 - Google Patents

具有压电块的微机电装置的制作方法 Download PDF

Info

Publication number
CN100533800C
CN100533800C CNB2005800404822A CN200580040482A CN100533800C CN 100533800 C CN100533800 C CN 100533800C CN B2005800404822 A CNB2005800404822 A CN B2005800404822A CN 200580040482 A CN200580040482 A CN 200580040482A CN 100533800 C CN100533800 C CN 100533800C
Authority
CN
China
Prior art keywords
piezoelectric
layer
piezoelectric material
spill
electric conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2005800404822A
Other languages
English (en)
Chinese (zh)
Other versions
CN101065855A (zh
Inventor
安德列亚斯·拜布尔
约翰·A·希金森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Dimatix Inc
Original Assignee
Fujifilm Dimatix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Dimatix Inc filed Critical Fujifilm Dimatix Inc
Publication of CN101065855A publication Critical patent/CN101065855A/zh
Application granted granted Critical
Publication of CN100533800C publication Critical patent/CN100533800C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Micromachines (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
CNB2005800404822A 2004-10-15 2005-10-12 具有压电块的微机电装置的制作方法 Expired - Lifetime CN100533800C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/967,073 2004-10-15
US10/967,073 US7420317B2 (en) 2004-10-15 2004-10-15 Forming piezoelectric actuators

Publications (2)

Publication Number Publication Date
CN101065855A CN101065855A (zh) 2007-10-31
CN100533800C true CN100533800C (zh) 2009-08-26

Family

ID=35632644

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800404822A Expired - Lifetime CN100533800C (zh) 2004-10-15 2005-10-12 具有压电块的微机电装置的制作方法

Country Status (9)

Country Link
US (3) US7420317B2 (enExample)
EP (1) EP1815538B1 (enExample)
JP (1) JP2008516787A (enExample)
KR (1) KR101184060B1 (enExample)
CN (1) CN100533800C (enExample)
AT (1) ATE506704T1 (enExample)
DE (1) DE602005027601D1 (enExample)
TW (1) TWI390779B (enExample)
WO (1) WO2006044592A1 (enExample)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
US7388319B2 (en) * 2004-10-15 2008-06-17 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
US20070257580A1 (en) * 2006-05-05 2007-11-08 Fujifilm Dimatix, Inc. Polishing Piezoelectric Material
US7779522B2 (en) * 2006-05-05 2010-08-24 Fujifilm Dimatix, Inc. Method for forming a MEMS
US7554666B2 (en) * 2006-05-25 2009-06-30 Ric Investments, Llc. Sensor with optical pressure transducer and method of manufacturing a sensor component
ATE517752T1 (de) * 2007-05-30 2011-08-15 Oce Tech Bv Piezoelektrischer aktuator und herstellungsverfahren dafür
EP1997638B1 (en) * 2007-05-30 2012-11-21 Océ-Technologies B.V. Method of forming an array of piezoelectric actuators on a membrane
US7586239B1 (en) * 2007-06-06 2009-09-08 Rf Micro Devices, Inc. MEMS vibrating structure using a single-crystal piezoelectric thin film layer
US9369105B1 (en) 2007-08-31 2016-06-14 Rf Micro Devices, Inc. Method for manufacturing a vibrating MEMS circuit
US9385685B2 (en) 2007-08-31 2016-07-05 Rf Micro Devices, Inc. MEMS vibrating structure using an orientation dependent single-crystal piezoelectric thin film layer
US9391588B2 (en) 2007-08-31 2016-07-12 Rf Micro Devices, Inc. MEMS vibrating structure using an orientation dependent single-crystal piezoelectric thin film layer
US20100187667A1 (en) 2009-01-28 2010-07-29 Fujifilm Dimatix, Inc. Bonded Microelectromechanical Assemblies
JP5241017B2 (ja) * 2009-02-10 2013-07-17 富士フイルム株式会社 液体吐出ヘッド及び液体吐出装置並びに画像形成装置
US8061820B2 (en) * 2009-02-19 2011-11-22 Fujifilm Corporation Ring electrode for fluid ejection
KR20110014037A (ko) * 2009-08-04 2011-02-10 삼성전자주식회사 잉크젯 헤드
US8264129B2 (en) * 2010-07-21 2012-09-11 General Electric Company Device and system for measuring material thickness
CN102398419B (zh) * 2010-09-08 2014-06-25 研能科技股份有限公司 喷墨头压电致动单元的切割方法
TWI477387B (zh) * 2010-12-15 2015-03-21 Univ Nat Cheng Kung Composite film
KR101725115B1 (ko) * 2010-12-16 2017-04-26 한국전자통신연구원 플렉시블 기판을 이용한 자급자족형 전원 공급 장치 및 센서 노드
CN102794989A (zh) * 2011-05-27 2012-11-28 研能科技股份有限公司 压电式喷墨头结构
US8348396B2 (en) 2011-06-09 2013-01-08 Hewlett-Packard Development Company, L.P. Fluid ejection device
US8939556B2 (en) * 2011-06-09 2015-01-27 Hewlett-Packard Development Company, L.P. Fluid ejection device
TWI574439B (zh) * 2011-12-30 2017-03-11 晶緻材料科技私人有限公司 多樁式致動器及其製造方法及使用該多樁式致動器的衍生設備、壓電式馬達、微型馬達
US9266326B2 (en) * 2012-07-25 2016-02-23 Hewlett-Packard Development Company, L.P. Piezoelectric actuator and method of making a piezoelectric actuator
US9406314B1 (en) 2012-10-04 2016-08-02 Magnecomp Corporation Assembly of DSA suspensions using microactuators with partially cured adhesive, and DSA suspensions having PZTs with wrap-around electrodes
US9466430B2 (en) 2012-11-02 2016-10-11 Qorvo Us, Inc. Variable capacitor and switch structures in single crystal piezoelectric MEMS devices using bimorphs
JP6133655B2 (ja) * 2013-03-29 2017-05-24 日本碍子株式会社 圧電／電歪素子とその製造方法
US9308728B2 (en) 2013-05-31 2016-04-12 Stmicroelectronics, Inc. Method of making inkjet print heads having inkjet chambers and orifices formed in a wafer and related devices
US9991872B2 (en) 2014-04-04 2018-06-05 Qorvo Us, Inc. MEMS resonator with functional layers
US9998088B2 (en) 2014-05-02 2018-06-12 Qorvo Us, Inc. Enhanced MEMS vibrating device
JP5817905B1 (ja) 2014-12-15 2015-11-18 富士ゼロックス株式会社 半導体片の製造方法
GB2552555B (en) * 2016-07-28 2019-11-20 Cirrus Logic Int Semiconductor Ltd MEMS device and process
JP2019089223A (ja) * 2017-11-13 2019-06-13 エスアイアイ・プリンテック株式会社 液体噴射ヘッドおよび液体噴射記録装置
US10626010B2 (en) * 2017-11-29 2020-04-21 Taiwan Semiconductor Manufacturing Co., Ltd. Bonding process for forming semiconductor device structure
DE102019101325A1 (de) * 2019-01-17 2020-07-23 USound GmbH Herstellungsverfahren für mehrere MEMS-Schallwandler
EP3962747B1 (en) 2019-04-29 2025-07-09 Hewlett-Packard Development Company, L.P. Fluid ejection device with break(s) in cover layer
CN111016432A (zh) * 2019-12-19 2020-04-17 西安增材制造国家研究院有限公司 一种压电式打印头及其制作方法
CN116326255A (zh) * 2020-09-16 2023-06-23 福珞尔系统公司 用于制造基于mems的冷却系统的方法和系统
JP2023020321A (ja) * 2021-07-30 2023-02-09 株式会社リコー 貼り合わせ基板、圧電アクチュエータ、液体吐出ヘッド、液体吐出ユニット及び液体を吐出する装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020030723A1 (en) * 1998-01-23 2002-03-14 Kouji Sumi Piezoelectric thin film component, inkjet type recording head and inkjet printer using this [piezoelectric thin film component], and method of manufacturing piezoelectric thin film component
WO2003049209A1 (en) * 2001-11-21 2003-06-12 Apogent Robotics Limited Actuator structure
CN1435320A (zh) * 2002-01-29 2003-08-13 精工爱普生株式会社 压电体元件、液体喷头以及压电体元件的制造方法
US6716363B1 (en) * 1999-04-20 2004-04-06 Seagate Technology Llc Electrode patterning for a differential PZT activator
US20040104977A1 (en) * 2001-05-28 2004-06-03 Fuji Xerox Co., Ltd. Inkjet recording head and method for manufacturing the same

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2705392A (en) * 1952-06-11 1955-04-05 Selectronics Inc Method of manufacture of piezo electric crystals
JPS5569473A (en) * 1978-11-17 1980-05-26 Seiko Epson Corp Ink jet recording head
JPS56171A (en) * 1979-06-18 1981-01-06 Hitachi Ltd Ink droplet jetting device
JPS57167272A (en) 1981-04-08 1982-10-15 Hitachi Ltd Ink drop jetting device
US4730197A (en) * 1985-11-06 1988-03-08 Pitney Bowes Inc. Impulse ink jet system
US4680595A (en) * 1985-11-06 1987-07-14 Pitney Bowes Inc. Impulse ink jet print head and method of making same
EP0408306B1 (en) * 1989-07-11 1996-05-01 Ngk Insulators, Ltd. Piezoelectric/electrostrictive actuator having at least one piezoelectric/electrostrictive film
US5071792A (en) 1990-11-05 1991-12-10 Harris Corporation Process for forming extremely thin integrated circuit dice
JPH07108102B2 (ja) * 1990-05-01 1995-11-15 日本碍子株式会社 圧電／電歪膜型アクチュエータの製造方法
JP3151644B2 (ja) * 1993-03-08 2001-04-03 日本碍子株式会社 圧電／電歪膜型素子
US5736993A (en) * 1993-07-30 1998-04-07 Tektronix, Inc. Enhanced performance drop-on-demand ink jet head apparatus and method
US5710529A (en) 1993-10-15 1998-01-20 Ngk Insulators, Ltd. Surface acoustic wave filer device having a cascade filter structure and a piezoelectric substrate having mirror-polished surfaces
JP3235635B2 (ja) * 1993-11-29 2001-12-04 セイコーエプソン株式会社 インクジェット記録ヘッド
EP0695641B1 (de) * 1994-08-03 2001-04-04 Francotyp-Postalia Aktiengesellschaft & Co. Anordnung für plattenförmige Piezoaktoren und Verfahren zu deren Herstellung
US5790156A (en) * 1994-09-29 1998-08-04 Tektronix, Inc. Ferroelectric relaxor actuator for an ink-jet print head
DE69612333T2 (de) * 1995-07-26 2001-10-11 Sony Corp., Tokio/Tokyo Druckvorrichtung und Verfahren zu ihrer Herstellung
JP3209082B2 (ja) * 1996-03-06 2001-09-17 セイコーエプソン株式会社 圧電体薄膜素子及びその製造方法、並びにこれを用いたインクジェット式記録ヘッド
JP3267151B2 (ja) * 1996-04-12 2002-03-18 ミノルタ株式会社 圧電振動部材およびその製造方法
US5855049A (en) * 1996-10-28 1999-01-05 Microsound Systems, Inc. Method of producing an ultrasound transducer
JPH10202874A (ja) * 1997-01-24 1998-08-04 Seiko Epson Corp インクジェットプリンタヘッド及びその製造方法
JPH10217466A (ja) 1997-02-12 1998-08-18 Ricoh Co Ltd インクジェットヘッド
JPH10264338A (ja) 1997-03-24 1998-10-06 Fuji Seal Co Ltd 感熱接着性ラベル
JPH10264385A (ja) 1997-03-27 1998-10-06 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP3379479B2 (ja) * 1998-07-01 2003-02-24 セイコーエプソン株式会社 機能性薄膜、圧電体素子、インクジェット式記録ヘッド、プリンタ、圧電体素子の製造方法およびインクジェット式記録ヘッドの製造方法、
US6502928B1 (en) * 1998-07-29 2003-01-07 Seiko Epson Corporation Ink jet recording head and ink jet recording apparatus comprising the same
JP2000117989A (ja) * 1998-10-13 2000-04-25 Sony Corp プリントヘッドの製造方法
JP3517876B2 (ja) * 1998-10-14 2004-04-12 セイコーエプソン株式会社 強誘電体薄膜素子の製造方法、インクジェット式記録ヘッド及びインクジェットプリンタ
JP3241334B2 (ja) * 1998-11-16 2001-12-25 松下電器産業株式会社 インクジェットヘッド及びその製造方法
JP2000228547A (ja) * 1999-02-09 2000-08-15 Matsushita Electric Ind Co Ltd 圧電基板の製造方法
US6568797B2 (en) * 1999-02-17 2003-05-27 Konica Corporation Ink jet head
WO2001018857A1 (en) * 1999-09-03 2001-03-15 University Of Maryland, College Park Process for fabrication of 3-dimensional micromechanisms
EP1101615B1 (en) * 1999-11-15 2003-09-10 Seiko Epson Corporation Ink-jet recording head and ink-jet recording apparatus
JP2001171132A (ja) 1999-12-10 2001-06-26 Samsung Electro Mech Co Ltd インクジェットプリンタヘッド用アクチュエータの製造方法
US6464324B1 (en) * 2000-01-31 2002-10-15 Picojet, Inc. Microfluid device and ultrasonic bonding process
US6753638B2 (en) * 2000-02-03 2004-06-22 Calient Networks, Inc. Electrostatic actuator for micromechanical systems
GB2367532B (en) * 2000-07-27 2004-03-10 Kyocera Corp Layered unit provided with piezoelectric ceramics,method of producing the same and ink jet printing head employing the same
US6705708B2 (en) * 2001-02-09 2004-03-16 Seiko Espon Corporation Piezoelectric thin-film element, ink-jet head using the same, and method for manufacture thereof
GB2390480B (en) * 2002-02-19 2005-06-22 Maximilian Hans Hobelsberger Piezo actuator
JP2003266397A (ja) * 2002-03-08 2003-09-24 Tokyo Denki Univ 薄膜材料の精密切り出し加工方法
JP4305016B2 (ja) * 2002-03-18 2009-07-29 セイコーエプソン株式会社 圧電アクチュエータユニット、及び、それを用いた液体噴射ヘッド
US7052117B2 (en) * 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
US6886924B2 (en) * 2002-09-30 2005-05-03 Spectra, Inc. Droplet ejection device
CN100418769C (zh) * 2002-11-25 2008-09-17 京瓷株式会社 压电陶瓷、促动器及其制造方法、印刷头及喷墨打印机
US6878643B2 (en) * 2002-12-18 2005-04-12 The Regents Of The University Of California Electronic unit integrated into a flexible polymer body
JP4521751B2 (ja) * 2003-03-26 2010-08-11 国立大学法人東京工業大学 チタン酸ジルコニウム酸鉛系膜、誘電体素子、誘電体膜の製造方法
WO2005037558A2 (en) * 2003-10-10 2005-04-28 Dimatix, Inc. Print head with thin membrane
US20050118246A1 (en) * 2003-10-31 2005-06-02 Wong Patrick S. Dosage forms and layered deposition processes for fabricating dosage forms
US7230368B2 (en) * 2004-04-20 2007-06-12 Visualsonics Inc. Arrayed ultrasonic transducer
US7344228B2 (en) 2004-08-02 2008-03-18 Fujifilm Dimatix, Inc. Actuator with reduced drive capacitance
US7388319B2 (en) * 2004-10-15 2008-06-17 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020030723A1 (en) * 1998-01-23 2002-03-14 Kouji Sumi Piezoelectric thin film component, inkjet type recording head and inkjet printer using this [piezoelectric thin film component], and method of manufacturing piezoelectric thin film component
US6716363B1 (en) * 1999-04-20 2004-04-06 Seagate Technology Llc Electrode patterning for a differential PZT activator
US20040104977A1 (en) * 2001-05-28 2004-06-03 Fuji Xerox Co., Ltd. Inkjet recording head and method for manufacturing the same
WO2003049209A1 (en) * 2001-11-21 2003-06-12 Apogent Robotics Limited Actuator structure
CN1435320A (zh) * 2002-01-29 2003-08-13 精工爱普生株式会社 压电体元件、液体喷头以及压电体元件的制造方法

Also Published As

Publication number Publication date
DE602005027601D1 (de) 2011-06-01
KR20070085285A (ko) 2007-08-27
JP2008516787A (ja) 2008-05-22
EP1815538B1 (en) 2011-04-20
WO2006044592A1 (en) 2006-04-27
KR101184060B1 (ko) 2012-09-18
TW200620726A (en) 2006-06-16
CN101065855A (zh) 2007-10-31
US7420317B2 (en) 2008-09-02
HK1107872A1 (en) 2008-04-18
US20090322187A1 (en) 2009-12-31
ATE506704T1 (de) 2011-05-15
EP1815538A1 (en) 2007-08-08
TWI390779B (zh) 2013-03-21
US20060082256A1 (en) 2006-04-20
US8053956B2 (en) 2011-11-08
US20080000059A1 (en) 2008-01-03
US7526846B2 (en) 2009-05-05

Similar Documents

Publication Publication Date Title
CN100533800C (zh) 具有压电块的微机电装置的制作方法
JP5398805B2 (ja) 圧電ブロックを有するマイクロ電子機械デバイスおよびこれを作製する方法
KR101263276B1 (ko) 식각용 희생 기판
US20070257580A1 (en) Polishing Piezoelectric Material
CN101484399A (zh) 压电材料的抛光
HK1107872B (en) Method of fabricating a microelectromechanical device having piezoelectric blocks
HK1107873B (en) Method of forming a device with a piezoelectric transducer
HK1163345B (en) Method of forming a device with a piezoelectric transducer
HK1105943B (en) Method of etching using a sacrificial substrate

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20090826

CX01 Expiry of patent term