CN100530717C - 照明组件及其制造方法 - Google Patents

照明组件及其制造方法 Download PDF

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Publication number
CN100530717C
CN100530717C CNB200580044080XA CN200580044080A CN100530717C CN 100530717 C CN100530717 C CN 100530717C CN B200580044080X A CNB200580044080X A CN B200580044080XA CN 200580044080 A CN200580044080 A CN 200580044080A CN 100530717 C CN100530717 C CN 100530717C
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CN
China
Prior art keywords
led
type surface
conducting substrate
layer
post
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200580044080XA
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English (en)
Chinese (zh)
Other versions
CN101084585A (zh
Inventor
安德鲁·J·欧德科克
迈克尔·A·梅斯
洪·T·陈
约瑟夫·A·霍夫曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN101084585A publication Critical patent/CN101084585A/zh
Application granted granted Critical
Publication of CN100530717C publication Critical patent/CN100530717C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)
CNB200580044080XA 2004-12-21 2005-11-23 照明组件及其制造方法 Expired - Fee Related CN100530717C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/018,961 2004-12-21
US11/018,961 US7296916B2 (en) 2004-12-21 2004-12-21 Illumination assembly and method of making same

Publications (2)

Publication Number Publication Date
CN101084585A CN101084585A (zh) 2007-12-05
CN100530717C true CN100530717C (zh) 2009-08-19

Family

ID=36594551

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200580044080XA Expired - Fee Related CN100530717C (zh) 2004-12-21 2005-11-23 照明组件及其制造方法

Country Status (7)

Country Link
US (1) US7296916B2 (enExample)
EP (1) EP1829125A2 (enExample)
JP (1) JP4728346B2 (enExample)
KR (1) KR20070089183A (enExample)
CN (1) CN100530717C (enExample)
TW (1) TW200627022A (enExample)
WO (1) WO2006068762A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI418736B (enExample) * 2011-06-01 2013-12-11

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JP5104385B2 (ja) * 2008-02-20 2012-12-19 豊田合成株式会社 Ｌｅｄランプモジュール
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JP5185683B2 (ja) * 2008-04-24 2013-04-17 パナソニック株式会社 Ｌｅｄモジュールの製造方法および照明器具の製造方法
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CN103617969B (zh) * 2013-12-04 2016-06-29 广州先艺电子科技有限公司 一种焊接金锡合金薄膜的热沉及其制备方法
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Also Published As

Publication number Publication date
WO2006068762A2 (en) 2006-06-29
JP4728346B2 (ja) 2011-07-20
CN101084585A (zh) 2007-12-05
EP1829125A2 (en) 2007-09-05
KR20070089183A (ko) 2007-08-30
US7296916B2 (en) 2007-11-20
US20060131596A1 (en) 2006-06-22
TW200627022A (en) 2006-08-01
WO2006068762A3 (en) 2006-11-02
JP2008524826A (ja) 2008-07-10

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