TW200627022A - Illumination assembly and method of making same - Google Patents
Illumination assembly and method of making sameInfo
- Publication number
- TW200627022A TW200627022A TW094143503A TW94143503A TW200627022A TW 200627022 A TW200627022 A TW 200627022A TW 094143503 A TW094143503 A TW 094143503A TW 94143503 A TW94143503 A TW 94143503A TW 200627022 A TW200627022 A TW 200627022A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive substrate
- thermally conductive
- illumination assembly
- making same
- thermally
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/018,961 US7296916B2 (en) | 2004-12-21 | 2004-12-21 | Illumination assembly and method of making same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200627022A true TW200627022A (en) | 2006-08-01 |
Family
ID=36594551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094143503A TW200627022A (en) | 2004-12-21 | 2005-12-09 | Illumination assembly and method of making same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7296916B2 (enExample) |
| EP (1) | EP1829125A2 (enExample) |
| JP (1) | JP4728346B2 (enExample) |
| KR (1) | KR20070089183A (enExample) |
| CN (1) | CN100530717C (enExample) |
| TW (1) | TW200627022A (enExample) |
| WO (1) | WO2006068762A2 (enExample) |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2862424B1 (fr) * | 2003-11-18 | 2006-10-20 | Valeo Electronique Sys Liaison | Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif |
| JP4176703B2 (ja) * | 2004-11-25 | 2008-11-05 | 松下電器産業株式会社 | 半導体発光装置、照明装置、携帯通信機器、カメラ、及び製造方法 |
| US7285802B2 (en) * | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
| US7633177B2 (en) * | 2005-04-14 | 2009-12-15 | Natural Forces, Llc | Reduced friction wind turbine apparatus and method |
| WO2007027521A1 (en) * | 2005-08-27 | 2007-03-08 | 3M Innovative Properties Company | Illumination assembly and system |
| US7537374B2 (en) * | 2005-08-27 | 2009-05-26 | 3M Innovative Properties Company | Edge-lit backlight having light recycling cavity with concave transflector |
| US20070047228A1 (en) * | 2005-08-27 | 2007-03-01 | 3M Innovative Properties Company | Methods of forming direct-lit backlights having light recycling cavity with concave transflector |
| US7815355B2 (en) * | 2005-08-27 | 2010-10-19 | 3M Innovative Properties Company | Direct-lit backlight having light recycling cavity with concave transflector |
| US7943946B2 (en) * | 2005-11-21 | 2011-05-17 | Sharp Kabushiki Kaisha | Light emitting device |
| JP4798432B2 (ja) * | 2005-11-21 | 2011-10-19 | ミネベア株式会社 | 面状照明装置 |
| US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
| US7488097B2 (en) * | 2006-02-21 | 2009-02-10 | Cml Innovative Technologies, Inc. | LED lamp module |
| JP2008034622A (ja) * | 2006-07-28 | 2008-02-14 | Sharp Corp | 半導体発光素子アセンブリ |
| WO2008144644A2 (en) | 2007-05-20 | 2008-11-27 | 3M Innovative Properties Company | Semi-specular components in hollow cavity light recycling backlights |
| WO2008144636A2 (en) | 2007-05-20 | 2008-11-27 | 3M Innovative Properties Company | Design parameters for thin hollow cavity backlights of the light-recycling type |
| EP2160645A2 (en) | 2007-05-20 | 2010-03-10 | 3M Innovative Properties Company | Light recycling hollow cavity type display backlight |
| TWI439641B (zh) | 2007-05-20 | 2014-06-01 | 3M Innovative Properties Co | 用於側面發光型背光之準直光注入器 |
| CN101378613B (zh) * | 2007-08-27 | 2012-07-04 | 佶益投资股份有限公司 | 发光二极管光源以及发光二极管灯体 |
| JP2009088373A (ja) * | 2007-10-02 | 2009-04-23 | Toyoda Gosei Co Ltd | Ledランプモジュール |
| JP2011519148A (ja) * | 2007-12-13 | 2011-06-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ヒートシンクに取り付ける発光ダイオード |
| EP2255231A1 (en) | 2008-02-07 | 2010-12-01 | 3M Innovative Properties Company | Hollow backlight with structured films |
| JP5104385B2 (ja) * | 2008-02-20 | 2012-12-19 | 豊田合成株式会社 | Ledランプモジュール |
| JP5792464B2 (ja) | 2008-02-22 | 2015-10-14 | スリーエム イノベイティブ プロパティズ カンパニー | 選択的出力光束分布を有するバックライト及びそれを使用した表示システム並びにバックライトの形成方法 |
| JP5185683B2 (ja) * | 2008-04-24 | 2013-04-17 | パナソニック株式会社 | Ledモジュールの製造方法および照明器具の製造方法 |
| EP2297607B1 (en) | 2008-06-04 | 2014-04-23 | 3M Innovative Properties Company | Hollow backlight with tilted light source |
| US8220980B2 (en) * | 2008-09-23 | 2012-07-17 | Tyco Electronics Corporation | Socket assembly for light-emitting devices |
| US7952114B2 (en) | 2008-09-23 | 2011-05-31 | Tyco Electronics Corporation | LED interconnect assembly |
| JP5245980B2 (ja) * | 2008-09-30 | 2013-07-24 | 豊田合成株式会社 | 発光装置及びその製造方法 |
| JP5440064B2 (ja) | 2008-10-21 | 2014-03-12 | 東芝ライテック株式会社 | 照明装置 |
| US8591052B2 (en) * | 2008-10-27 | 2013-11-26 | 3M Innovative Properties Company | Semispecular hollow backlight with gradient extraction |
| JP5327601B2 (ja) | 2008-12-12 | 2013-10-30 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
| US8408724B2 (en) | 2008-12-26 | 2013-04-02 | Toshiba Lighting & Technology Corporation | Light source module and lighting apparatus |
| BRPI1007105A2 (pt) * | 2009-03-31 | 2019-07-16 | Koninl Philips Electronics Nv | módulo ótico de colimação de diodo emissor de luz e luminária |
| US8192048B2 (en) * | 2009-04-22 | 2012-06-05 | 3M Innovative Properties Company | Lighting assemblies and systems |
| US20100302789A1 (en) * | 2009-05-28 | 2010-12-02 | Qing Li | LED Light Source Module and Method for Producing the Same |
| CA2726179C (en) | 2009-12-22 | 2019-02-19 | Virginia Optoelectronics, Inc. | Light emitting diode light source modules |
| IT1397380B1 (it) | 2010-01-08 | 2013-01-10 | Khatod Optoelectronic Srl | Sistema di illuminazione e metodo di montaggio dello stesso. |
| WO2011082497A1 (en) * | 2010-01-11 | 2011-07-14 | Cooledge Lighting Inc. | Package for light emitting and receiving devices |
| US8820950B2 (en) | 2010-03-12 | 2014-09-02 | Toshiba Lighting & Technology Corporation | Light emitting device and illumination apparatus |
| JP2011238367A (ja) * | 2010-05-06 | 2011-11-24 | Funai Electric Co Ltd | 面発光装置の光源取付構造 |
| WO2011142145A1 (ja) * | 2010-05-10 | 2011-11-17 | シャープ株式会社 | 光源および光源装置ならびに表示装置 |
| CN102893076B (zh) * | 2010-06-02 | 2014-11-19 | 夏普株式会社 | 照明装置、显示装置以及电视接收装置 |
| JP5456077B2 (ja) * | 2011-03-11 | 2014-03-26 | ソウル セミコンダクター カンパニー リミテッド | Ledモジュール及びその製造方法と、ledモジュールを含むledチャンネルレター |
| US10074779B2 (en) | 2011-03-11 | 2018-09-11 | Seoul Semiconductor Co., Ltd. | LED module, method for manufacturing the same, and LED channel letter including the same |
| TW201250159A (en) * | 2011-06-01 | 2012-12-16 | gui-fang Chen | Light-emitting diode module |
| WO2013025402A2 (en) | 2011-08-17 | 2013-02-21 | 3M Innovative Properties Company | Two part flexible light emitting semiconductor device |
| US20120175667A1 (en) | 2011-10-03 | 2012-07-12 | Golle Aaron J | Led light disposed on a flexible substrate and connected with a printed 3d conductor |
| US8632221B2 (en) * | 2011-11-01 | 2014-01-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | LED module and method of bonding thereof |
| TWI536617B (zh) * | 2012-02-17 | 2016-06-01 | 鴻海精密工業股份有限公司 | 發光二極體燈條及其製造方法 |
| EP2825865B1 (en) | 2012-03-09 | 2020-07-22 | Ubiquitome Limited | Portable device for detecting molecule(s) |
| WO2013175333A1 (en) * | 2012-05-23 | 2013-11-28 | Koninklijke Philips N.V. | Surface mountable semiconductor device |
| DE102012106982A1 (de) | 2012-07-31 | 2014-02-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Leuchtmittels |
| CN102833986B (zh) * | 2012-08-16 | 2014-12-31 | 苏州金科信汇光电科技有限公司 | 自粘软性导热基板 |
| US20160051982A1 (en) * | 2013-03-08 | 2016-02-25 | Otago Innovation Limited | Reaction vessel holder and molecule detection device |
| US20140264423A1 (en) * | 2013-03-15 | 2014-09-18 | Grote Industries, Llc | Flexible lighting device including a protective conformal coating |
| RU2015152027A (ru) * | 2013-05-07 | 2017-06-13 | Филипс Лайтинг Холдинг Б.В. | Оптическая система, обеспечивающая поляризованный свет |
| CN106195924B (zh) * | 2013-06-08 | 2019-05-03 | 深圳光峰科技股份有限公司 | 一种波长转换装置及其制作方法、相关发光装置 |
| CN103617969B (zh) * | 2013-12-04 | 2016-06-29 | 广州先艺电子科技有限公司 | 一种焊接金锡合金薄膜的热沉及其制备方法 |
| US10718474B1 (en) | 2014-11-20 | 2020-07-21 | The Light Source, Inc. | Lighting fixture with closely-packed LED components |
| CN104848067B (zh) * | 2015-05-28 | 2017-01-25 | 成都斯科泰科技有限公司 | 用于led光源的多芯阵列集成结构 |
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| CN108954039B (zh) * | 2017-05-19 | 2020-07-03 | 深圳光峰科技股份有限公司 | 波长转换装置及其制备方法 |
| KR20210108124A (ko) * | 2020-02-25 | 2021-09-02 | 삼성전자주식회사 | 디스플레이 장치 및 이에 구비되는 디스플레이 패널 |
| CN116146925A (zh) * | 2021-11-22 | 2023-05-23 | 东莞市景茂电子科技有限公司 | 一种led仿真火焰装置及led仿真蜡烛 |
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| FR2574616B1 (fr) * | 1984-12-07 | 1987-01-23 | Radiotechnique Compelec | Matrice d'element electro-luminescents et son procede de fabrication |
| US4774434A (en) | 1986-08-13 | 1988-09-27 | Innovative Products, Inc. | Lighted display including led's mounted on a flexible circuit board |
| DE3803951A1 (de) | 1988-02-10 | 1989-08-24 | Mentor Gmbh & Co | Reflektor-leuchte |
| US5727310A (en) | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
| US5882774A (en) | 1993-12-21 | 1999-03-16 | Minnesota Mining And Manufacturing Company | Optical film |
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| DE60222242T2 (de) | 2001-01-18 | 2008-08-07 | Meridian Automotive Systems, Inc., Dearborn | Vakuumabgelagerte schaltkreise auf einem thermoplastischen material und fahrzeuglampengehäuse damit |
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| US6936855B1 (en) * | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
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| TWI282022B (en) | 2003-03-31 | 2007-06-01 | Sharp Kk | Surface lighting device and liquid crystal display device using the same |
| TWI321248B (en) | 2003-05-12 | 2010-03-01 | Au Optronics Corp | Led backlight module |
| US6846089B2 (en) | 2003-05-16 | 2005-01-25 | 3M Innovative Properties Company | Method for stacking surface structured optical films |
| US6974229B2 (en) | 2003-05-21 | 2005-12-13 | Lumileds Lighting U.S., Llc | Devices for creating brightness profiles |
| US6969874B1 (en) * | 2003-06-12 | 2005-11-29 | Sandia Corporation | Flip-chip light emitting diode with resonant optical microcavity |
| US20060131601A1 (en) * | 2004-12-21 | 2006-06-22 | Ouderkirk Andrew J | Illumination assembly and method of making same |
| US7285802B2 (en) * | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
-
2004
- 2004-12-21 US US11/018,961 patent/US7296916B2/en not_active Expired - Fee Related
-
2005
- 2005-11-23 WO PCT/US2005/042640 patent/WO2006068762A2/en not_active Ceased
- 2005-11-23 KR KR1020077014006A patent/KR20070089183A/ko not_active Abandoned
- 2005-11-23 CN CNB200580044080XA patent/CN100530717C/zh not_active Expired - Fee Related
- 2005-11-23 EP EP05852145A patent/EP1829125A2/en not_active Withdrawn
- 2005-11-23 JP JP2007548235A patent/JP4728346B2/ja not_active Expired - Fee Related
- 2005-12-09 TW TW094143503A patent/TW200627022A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006068762A2 (en) | 2006-06-29 |
| JP4728346B2 (ja) | 2011-07-20 |
| CN101084585A (zh) | 2007-12-05 |
| EP1829125A2 (en) | 2007-09-05 |
| CN100530717C (zh) | 2009-08-19 |
| KR20070089183A (ko) | 2007-08-30 |
| US7296916B2 (en) | 2007-11-20 |
| US20060131596A1 (en) | 2006-06-22 |
| WO2006068762A3 (en) | 2006-11-02 |
| JP2008524826A (ja) | 2008-07-10 |
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