JP2008524826A5 - - Google Patents

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Publication number
JP2008524826A5
JP2008524826A5 JP2007548235A JP2007548235A JP2008524826A5 JP 2008524826 A5 JP2008524826 A5 JP 2008524826A5 JP 2007548235 A JP2007548235 A JP 2007548235A JP 2007548235 A JP2007548235 A JP 2007548235A JP 2008524826 A5 JP2008524826 A5 JP 2008524826A5
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JP
Japan
Prior art keywords
conductive substrate
thermally conductive
major surface
led
thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007548235A
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English (en)
Japanese (ja)
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JP4728346B2 (ja
JP2008524826A (ja
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Publication date
Priority claimed from US11/018,961 external-priority patent/US7296916B2/en
Application filed filed Critical
Publication of JP2008524826A publication Critical patent/JP2008524826A/ja
Publication of JP2008524826A5 publication Critical patent/JP2008524826A5/ja
Application granted granted Critical
Publication of JP4728346B2 publication Critical patent/JP4728346B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2007548235A 2004-12-21 2005-11-23 照明アセンブリおよびその作製方法 Expired - Fee Related JP4728346B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/018,961 2004-12-21
US11/018,961 US7296916B2 (en) 2004-12-21 2004-12-21 Illumination assembly and method of making same
PCT/US2005/042640 WO2006068762A2 (en) 2004-12-21 2005-11-23 Illumination assembly and method of making same

Publications (3)

Publication Number Publication Date
JP2008524826A JP2008524826A (ja) 2008-07-10
JP2008524826A5 true JP2008524826A5 (enExample) 2009-01-15
JP4728346B2 JP4728346B2 (ja) 2011-07-20

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Family Applications (1)

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JP2007548235A Expired - Fee Related JP4728346B2 (ja) 2004-12-21 2005-11-23 照明アセンブリおよびその作製方法

Country Status (7)

Country Link
US (1) US7296916B2 (enExample)
EP (1) EP1829125A2 (enExample)
JP (1) JP4728346B2 (enExample)
KR (1) KR20070089183A (enExample)
CN (1) CN100530717C (enExample)
TW (1) TW200627022A (enExample)
WO (1) WO2006068762A2 (enExample)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2862424B1 (fr) * 2003-11-18 2006-10-20 Valeo Electronique Sys Liaison Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif
JP4176703B2 (ja) * 2004-11-25 2008-11-05 松下電器産業株式会社 半導体発光装置、照明装置、携帯通信機器、カメラ、及び製造方法
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
US7633177B2 (en) * 2005-04-14 2009-12-15 Natural Forces, Llc Reduced friction wind turbine apparatus and method
US7537374B2 (en) * 2005-08-27 2009-05-26 3M Innovative Properties Company Edge-lit backlight having light recycling cavity with concave transflector
JP5290755B2 (ja) * 2005-08-27 2013-09-18 スリーエム イノベイティブ プロパティズ カンパニー 照明アセンブリおよびシステム
US20070047228A1 (en) * 2005-08-27 2007-03-01 3M Innovative Properties Company Methods of forming direct-lit backlights having light recycling cavity with concave transflector
US7815355B2 (en) * 2005-08-27 2010-10-19 3M Innovative Properties Company Direct-lit backlight having light recycling cavity with concave transflector
JP4798432B2 (ja) * 2005-11-21 2011-10-19 ミネベア株式会社 面状照明装置
US7943946B2 (en) * 2005-11-21 2011-05-17 Sharp Kabushiki Kaisha Light emitting device
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
US7488097B2 (en) * 2006-02-21 2009-02-10 Cml Innovative Technologies, Inc. LED lamp module
JP2008034622A (ja) * 2006-07-28 2008-02-14 Sharp Corp 半導体発光素子アセンブリ
US8608363B2 (en) 2007-05-20 2013-12-17 3M Innovative Properties Company Recycling backlights with semi-specular components
WO2008144636A2 (en) 2007-05-20 2008-11-27 3M Innovative Properties Company Design parameters for thin hollow cavity backlights of the light-recycling type
EP2535766A3 (en) 2007-05-20 2013-05-01 3M Innovative Properties Company Asymmetric reflective film and backlight having a hollow cavity, which recycles the light
TWI439641B (zh) 2007-05-20 2014-06-01 3M Innovative Properties Co 用於側面發光型背光之準直光注入器
CN101378613B (zh) 2007-08-27 2012-07-04 佶益投资股份有限公司 发光二极管光源以及发光二极管灯体
JP2009088373A (ja) * 2007-10-02 2009-04-23 Toyoda Gosei Co Ltd Ｌｅｄランプモジュール
JP2011519148A (ja) * 2007-12-13 2011-06-30 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ヒートシンクに取り付ける発光ダイオード
US8848132B2 (en) 2008-02-07 2014-09-30 3M Innovative Properties Company Hollow backlight with structured films
JP5104385B2 (ja) * 2008-02-20 2012-12-19 豊田合成株式会社 Ｌｅｄランプモジュール
KR20100126389A (ko) 2008-02-22 2010-12-01 쓰리엠 이노베이티브 프로퍼티즈 컴파니 선택된 출력 광속 분포를 갖는 백라이트 및 이를 사용한 디스플레이 시스템
JP5185683B2 (ja) * 2008-04-24 2013-04-17 パナソニック株式会社 Ｌｅｄモジュールの製造方法および照明器具の製造方法
CN102057319B (zh) 2008-06-04 2014-02-26 3M创新有限公司 具有斜光源的中空背光源
US7952114B2 (en) * 2008-09-23 2011-05-31 Tyco Electronics Corporation LED interconnect assembly
US8220980B2 (en) * 2008-09-23 2012-07-17 Tyco Electronics Corporation Socket assembly for light-emitting devices
JP5245980B2 (ja) * 2008-09-30 2013-07-24 豊田合成株式会社 発光装置及びその製造方法
JP5440064B2 (ja) 2008-10-21 2014-03-12 東芝ライテック株式会社 照明装置
KR20110080170A (ko) 2008-10-27 2011-07-12 쓰리엠 이노베이티브 프로퍼티즈 컴파니 경사 추출을 이용하는 반-경면 중공형 백라이트
JP5327601B2 (ja) 2008-12-12 2013-10-30 東芝ライテック株式会社 発光モジュールおよび照明装置
US8408724B2 (en) 2008-12-26 2013-04-02 Toshiba Lighting & Technology Corporation Light source module and lighting apparatus
RU2011143927A (ru) * 2009-03-31 2013-05-10 Конинклейке Филипс Электроникс Н.В. Модуль коллимирующей оптики светодиодов, снабженный изолирующей соединительной деталью
US8192048B2 (en) * 2009-04-22 2012-06-05 3M Innovative Properties Company Lighting assemblies and systems
US20100302789A1 (en) * 2009-05-28 2010-12-02 Qing Li LED Light Source Module and Method for Producing the Same
US9303861B2 (en) 2009-09-14 2016-04-05 Us Vaopto, Inc. Light emitting diode light source modules
IT1397380B1 (it) 2010-01-08 2013-01-10 Khatod Optoelectronic Srl Sistema di illuminazione e metodo di montaggio dello stesso.
US20130016494A1 (en) * 2010-01-11 2013-01-17 Ingo Speier Package for light emitting and receiving devices
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus
JP2011238367A (ja) * 2010-05-06 2011-11-24 Funai Electric Co Ltd 面発光装置の光源取付構造
WO2011142145A1 (ja) * 2010-05-10 2011-11-17 シャープ株式会社 光源および光源装置ならびに表示装置
JP5390704B2 (ja) * 2010-06-02 2014-01-15 シャープ株式会社 照明装置、表示装置及びテレビ受信装置
US10074779B2 (en) 2011-03-11 2018-09-11 Seoul Semiconductor Co., Ltd. LED module, method for manufacturing the same, and LED channel letter including the same
JP5456077B2 (ja) 2011-03-11 2014-03-26 ソウル セミコンダクター カンパニー リミテッド Ｌｅｄモジュール及びその製造方法と、ｌｅｄモジュールを含むｌｅｄチャンネルレター
TW201250159A (en) * 2011-06-01 2012-12-16 gui-fang Chen Light-emitting diode module
US9236547B2 (en) 2011-08-17 2016-01-12 3M Innovative Properties Company Two part flexible light emitting semiconductor device
US20120175667A1 (en) 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
US8632221B2 (en) * 2011-11-01 2014-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. LED module and method of bonding thereof
TWI536617B (zh) * 2012-02-17 2016-06-01 鴻海精密工業股份有限公司 發光二極體燈條及其製造方法
WO2013133725A1 (en) 2012-03-09 2013-09-12 Rawle Christopher Bruce Portable device for detecting molecule(s)
CN104303291A (zh) * 2012-05-23 2015-01-21 皇家飞利浦有限公司 可表面安装的半导体器件
DE102012106982A1 (de) 2012-07-31 2014-02-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Leuchtmittels
CN102833986B (zh) * 2012-08-16 2014-12-31 苏州金科信汇光电科技有限公司 自粘软性导热基板
EP2965063A4 (en) * 2013-03-08 2016-09-14 Otago Innovation Ltd REACTION BATTERY AND MOLECULE DETECTION DEVICE
US20140264423A1 (en) * 2013-03-15 2014-09-18 Grote Industries, Llc Flexible lighting device including a protective conformal coating
US20150346505A1 (en) * 2013-05-07 2015-12-03 Koninklijke Philips N.V. Optical system providing polarized light
CN106195924B (zh) * 2013-06-08 2019-05-03 深圳光峰科技股份有限公司 一种波长转换装置及其制作方法、相关发光装置
CN103617969B (zh) * 2013-12-04 2016-06-29 广州先艺电子科技有限公司 一种焊接金锡合金薄膜的热沉及其制备方法
US10718474B1 (en) 2014-11-20 2020-07-21 The Light Source, Inc. Lighting fixture with closely-packed LED components
CN104848067B (zh) * 2015-05-28 2017-01-25 成都斯科泰科技有限公司 用于led光源的多芯阵列集成结构
US9659844B2 (en) * 2015-08-31 2017-05-23 Texas Instruments Incorporated Semiconductor die substrate with integral heat sink
CN108954039B (zh) * 2017-05-19 2020-07-03 深圳光峰科技股份有限公司 波长转换装置及其制备方法
WO2021172799A1 (ko) * 2020-02-25 2021-09-02 삼성전자주식회사 디스플레이 장치 및 이에 구비되는 디스플레이 패널
CN116146925A (zh) * 2021-11-22 2023-05-23 东莞市景茂电子科技有限公司 一种led仿真火焰装置及led仿真蜡烛

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2574616B1 (fr) * 1984-12-07 1987-01-23 Radiotechnique Compelec Matrice d'element electro-luminescents et son procede de fabrication
US4774434A (en) * 1986-08-13 1988-09-27 Innovative Products, Inc. Lighted display including led's mounted on a flexible circuit board
DE3803951A1 (de) 1988-02-10 1989-08-24 Mentor Gmbh & Co Reflektor-leuchte
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5882774A (en) * 1993-12-21 1999-03-16 Minnesota Mining And Manufacturing Company Optical film
US6080467A (en) * 1995-06-26 2000-06-27 3M Innovative Properties Company High efficiency optical devices
US6164789A (en) * 1996-07-12 2000-12-26 Honeywell International Inc. Illumination sources and systems
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US5998935A (en) * 1997-09-29 1999-12-07 Matsushita Electric Industrial Co., Ltd. AC plasma display with dual discharge sites and contrast enhancement bars
KR19990047842A (ko) * 1997-12-05 1999-07-05 윤종용 휴대용 단말기의 안테나 장치
US6531230B1 (en) * 1998-01-13 2003-03-11 3M Innovative Properties Company Color shifting film
US6274924B1 (en) * 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
DE19922176C2 (de) 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
US6362964B1 (en) * 1999-11-17 2002-03-26 International Rectifier Corp. Flexible power assembly
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
US6452217B1 (en) * 2000-06-30 2002-09-17 General Electric Company High power LED lamp structure using phase change cooling enhancements for LED lighting products
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
US7758222B2 (en) * 2001-01-18 2010-07-20 Ventra Greenwich Holdings Corp. Method for vacuum deposition of circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same
US6541800B2 (en) * 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
EP1398839B1 (en) * 2001-04-23 2012-03-28 Panasonic Corporation Light emitting device comprising light emitting diode chip
US20030057421A1 (en) * 2001-09-27 2003-03-27 Tzer-Perng Chen High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US6714348B2 (en) * 2001-11-14 2004-03-30 Ken-A-Vision Manufacturing Co., Inc. Cordless microscope
US6784462B2 (en) * 2001-12-13 2004-08-31 Rensselaer Polytechnic Institute Light-emitting diode with planar omni-directional reflector
KR100991830B1 (ko) 2001-12-29 2010-11-04 항조우 후양 신잉 띠앤즈 리미티드 Ｌｅｄ 및 ｌｅｄ램프
US6936855B1 (en) * 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
US6945672B2 (en) * 2002-08-30 2005-09-20 Gelcore Llc LED planar light source and low-profile headlight constructed therewith
DE10245930A1 (de) * 2002-09-30 2004-04-08 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Bauelement-Modul
DE10245892A1 (de) * 2002-09-30 2004-05-13 Siemens Ag Beleuchtungseinrichtung zur Hinterleuchtung einer Bildwiedergabevorrichtung
TW578280B (en) * 2002-11-21 2004-03-01 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
US20040135162A1 (en) * 2003-01-13 2004-07-15 Unity Opto Technology Co., Ltd. Light emitting diode
US7320531B2 (en) * 2003-03-28 2008-01-22 Philips Lumileds Lighting Company, Llc Multi-colored LED array with improved brightness profile and color uniformity
KR100852579B1 (ko) * 2003-03-31 2008-08-14 샤프 가부시키가이샤 면 조명 장치 및 그것을 이용한 액정 표시 장치
TWI321248B (en) * 2003-05-12 2010-03-01 Au Optronics Corp Led backlight module
US6846089B2 (en) * 2003-05-16 2005-01-25 3M Innovative Properties Company Method for stacking surface structured optical films
US6974229B2 (en) * 2003-05-21 2005-12-13 Lumileds Lighting U.S., Llc Devices for creating brightness profiles
US6969874B1 (en) * 2003-06-12 2005-11-29 Sandia Corporation Flip-chip light emitting diode with resonant optical microcavity
US20060131601A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same

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