JP2009532882A5 - - Google Patents

Download PDF

Info

Publication number
JP2009532882A5
JP2009532882A5 JP2009503259A JP2009503259A JP2009532882A5 JP 2009532882 A5 JP2009532882 A5 JP 2009532882A5 JP 2009503259 A JP2009503259 A JP 2009503259A JP 2009503259 A JP2009503259 A JP 2009503259A JP 2009532882 A5 JP2009532882 A5 JP 2009532882A5
Authority
JP
Japan
Prior art keywords
substrate
mounting structure
mechanical
mounting leg
leg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009503259A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009532882A (ja
Filing date
Publication date
Priority claimed from US11/691,025 external-priority patent/US20070252161A1/en
Application filed filed Critical
Publication of JP2009532882A publication Critical patent/JP2009532882A/ja
Publication of JP2009532882A5 publication Critical patent/JP2009532882A5/ja
Pending legal-status Critical Current

Links

JP2009503259A 2006-03-31 2007-03-29 Ｌｅｄ実装構造体 Pending JP2009532882A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74403006P 2006-03-31 2006-03-31
US11/691,025 US20070252161A1 (en) 2006-03-31 2007-03-26 Led mounting structures
PCT/US2007/065425 WO2007133857A2 (en) 2006-03-31 2007-03-29 Led mounting structures

Publications (2)

Publication Number Publication Date
JP2009532882A JP2009532882A (ja) 2009-09-10
JP2009532882A5 true JP2009532882A5 (enExample) 2010-05-13

Family

ID=38647513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009503259A Pending JP2009532882A (ja) 2006-03-31 2007-03-29 Ｌｅｄ実装構造体

Country Status (6)

Country Link
US (1) US20070252161A1 (enExample)
EP (1) EP2002489A2 (enExample)
JP (1) JP2009532882A (enExample)
CN (1) CN101416325B (enExample)
TW (1) TW200802977A (enExample)
WO (1) WO2007133857A2 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7550777B2 (en) * 2003-01-10 2009-06-23 Toyoda Gosei, Co., Ltd. Light emitting device including adhesion layer
KR101365621B1 (ko) * 2007-09-04 2014-02-24 서울반도체 주식회사 열 방출 슬러그들을 갖는 발광 다이오드 패키지
US8118447B2 (en) 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
US8360599B2 (en) 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US8324817B2 (en) 2008-10-24 2012-12-04 Ilumisys, Inc. Light and light sensor
US8653984B2 (en) 2008-10-24 2014-02-18 Ilumisys, Inc. Integration of LED lighting control with emergency notification systems
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US7938562B2 (en) 2008-10-24 2011-05-10 Altair Engineering, Inc. Lighting including integral communication apparatus
US8214084B2 (en) 2008-10-24 2012-07-03 Ilumisys, Inc. Integration of LED lighting with building controls
CN102097420B (zh) * 2009-12-10 2014-08-20 鸿富锦精密工业（深圳）有限公司 发光二极管及其制造方法
KR101055383B1 (ko) * 2010-03-15 2011-08-08 (주)포인트엔지니어링 광소자 디바이스 및 그 제조 방법
WO2011119921A2 (en) 2010-03-26 2011-09-29 Altair Engineering, Inc. Led light with thermoelectric generator
EP2553332B1 (en) 2010-03-26 2016-03-23 iLumisys, Inc. Inside-out led bulb
TW201135991A (en) * 2010-04-12 2011-10-16 Foxsemicon Integrated Tech Inc Solid-state lighting device and light source module incorporating the same
KR101690509B1 (ko) * 2010-07-05 2016-12-28 엘지이노텍 주식회사 발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템
EP2633227B1 (en) 2010-10-29 2018-08-29 iLumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
US9072171B2 (en) 2011-08-24 2015-06-30 Ilumisys, Inc. Circuit board mount for LED light
CN102299146A (zh) * 2011-09-16 2011-12-28 王海军 一种提高光效柔化光照的led封装结构
JP5692655B2 (ja) 2011-11-17 2015-04-01 株式会社リコー 画像投影装置
WO2013131002A1 (en) 2012-03-02 2013-09-06 Ilumisys, Inc. Electrical connector header for an led-based light
US9163794B2 (en) 2012-07-06 2015-10-20 Ilumisys, Inc. Power supply assembly for LED-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
DE102012109158B4 (de) * 2012-09-27 2017-08-03 Osram Oled Gmbh Leuchtelement
US10295124B2 (en) * 2013-02-27 2019-05-21 Cree, Inc. Light emitter packages and methods
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
KR20160111975A (ko) 2014-01-22 2016-09-27 일루미시스, 인크. 어드레스된 led들을 갖는 led 기반 조명
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
CN104103741A (zh) * 2014-07-02 2014-10-15 柳钊 一种以碳化硅陶瓷为散热器一体封装的led光源器件及其制备方法
CN104534430B (zh) * 2014-12-19 2018-04-20 东莞市闻誉实业有限公司 散热装置
CN104501044B (zh) * 2014-12-19 2017-07-11 东莞市闻誉实业有限公司 Led水下灯
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
WO2020153937A1 (en) * 2019-01-22 2020-07-30 Siemens Aktiengesellschaft Integrated no-solder snap-fit electronic component bays for non-traditional pcbs and am structures
CN114698262B (zh) * 2022-03-18 2024-11-22 广州华星光电半导体显示技术有限公司 发光基板、显示面板以及显示装置
DE102023114502A1 (de) * 2023-06-02 2024-12-05 Heraeus Noblelight Gmbh Verfahren zum Fügen eines keramischen Substrats für Chip-on-board-LEDs mit einem Kühlelement

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54179073U (enExample) * 1978-06-08 1979-12-18
JPS62163977U (enExample) * 1986-04-09 1987-10-17
JPH01110454U (enExample) * 1988-01-19 1989-07-26
DE4013863A1 (de) * 1990-04-30 1991-10-31 Staff Gmbh & Co Kg Adapter fuer stromschienen
US4999755A (en) * 1990-06-07 1991-03-12 Lin Tak Huei Tube light
JPH065924A (ja) * 1992-06-17 1994-01-14 Seiko Epson Corp 発光ダイオードの実装方式
FR2697484B1 (fr) * 1992-11-02 1995-01-20 Valeo Vision Elément modulaire pour la réalisation de feux de signalisation de véhicules automobiles.
JPH08264922A (ja) * 1995-03-28 1996-10-11 Rohm Co Ltd 発光装置の実装構造
WO1999007023A1 (de) * 1997-07-29 1999-02-11 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelektronisches bauelement
US6340824B1 (en) * 1997-09-01 2002-01-22 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a fluorescent material
US6491412B1 (en) * 1999-09-30 2002-12-10 Everbrite, Inc. LED display
US6866394B1 (en) * 1999-10-04 2005-03-15 Nicholas D. Hutchins Modules for elongated lighting system
US6330111B1 (en) * 2000-06-13 2001-12-11 Kenneth J. Myers, Edward Greenberg Lighting elements including light emitting diodes, microprism sheet, reflector, and diffusing agent
JP2002182589A (ja) * 2000-12-11 2002-06-26 Rohm Co Ltd 発光表示装置
US6840652B1 (en) * 2001-07-31 2005-01-11 Hi-Lite Safety Systems, L.C. Lighting enhanced by magnified reflective surfaces
JP2003101072A (ja) * 2001-09-26 2003-04-04 Ichikoh Ind Ltd 発光ダイオードの固定構造
JP2003243721A (ja) * 2002-02-18 2003-08-29 Ichikoh Ind Ltd 発光ダイオードの固定構造
EP1567894A2 (en) * 2002-12-02 2005-08-31 3M Innovative Properties Company Illumination system using a plurality of light sources
US6974229B2 (en) * 2003-05-21 2005-12-13 Lumileds Lighting U.S., Llc Devices for creating brightness profiles
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
JP4028545B2 (ja) * 2003-12-26 2007-12-26 古河電気工業株式会社 電子部品とフラットケーブルの接続構造及び接続方法
KR100563373B1 (ko) * 2004-02-27 2006-03-22 서울반도체 주식회사 반사기를 이용한 칩 발광다이오드
US20050207156A1 (en) * 2004-03-22 2005-09-22 Harvatek Corporation Flexible light array and fabrication procedure thereof
US7427782B2 (en) * 2004-03-29 2008-09-23 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7138659B2 (en) * 2004-05-18 2006-11-21 Onscreen Technologies, Inc. LED assembly with vented circuit board
US7997771B2 (en) * 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
US20060082315A1 (en) * 2004-10-20 2006-04-20 Timothy Chan Method and system for attachment of light emmiting diodes to circuitry for use in lighting
US7303315B2 (en) * 2004-11-05 2007-12-04 3M Innovative Properties Company Illumination assembly using circuitized strips
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same

Similar Documents

Publication Publication Date Title
JP2009532882A5 (enExample)
TW200802977A (en) LED mounting structures
EP1932188A4 (en) LED WITH LIGHT-TRANSMITTANT COOLING BODY
EP2458266A3 (en) Light emitting diode (LED) lamp
EP2142849A4 (en) LED LIGHTING DEVICE WITH HIGHLY UNIFORM ILLUMINATION PATTERN
TWD132846S1 (zh) 燈
EP2193516A4 (en) AERODYNAMIC LED ILLUMINATION PROJECTOR
DE602007005054D1 (de) Hochleistungs-LED-Lampe mit verstärkter Wärmeableitung
JP2010081957A5 (enExample)
WO2008044170A3 (en) Thin illumination device, display device and luminary device
JP2009521782A5 (enExample)
WO2013028965A3 (en) Circuit board mount for led light
JP2013247369A5 (enExample)
EP1836721A4 (en) LUMINOUS DIODE WITH CONDUCTIVE METAL SUBSTRATE
EP1909336A4 (en) LIGHT-EMITTING COMPONENT
EP1842398A4 (en) Light emitting device
DE602006007068D1 (de) Led mit leuchtstoff
JP2006261039A5 (enExample)
JP2009245945A5 (enExample)
TW200734580A (en) Reflector frame, flat light source device provided with the reflector frame, and display device using the flat light source device
DE502007000631D1 (de) Leuchteinheit mit einer Leuchtdiode mit integriertem Lichtumlenkkörper
JP2011029164A5 (ja) 照明装置
EP2187120A3 (en) Lamp
ATE513162T1 (de) Beleuchtungseinrichtung und diese verwendende anzeigevorrichtung
EP1805805A4 (en) HIGH POWER LEDS