JP2009532882A - Ｌｅｄ実装構造体 - Google Patents

Ｌｅｄ実装構造体 Download PDF

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Publication number
JP2009532882A
JP2009532882A JP2009503259A JP2009503259A JP2009532882A JP 2009532882 A JP2009532882 A JP 2009532882A JP 2009503259 A JP2009503259 A JP 2009503259A JP 2009503259 A JP2009503259 A JP 2009503259A JP 2009532882 A JP2009532882 A JP 2009532882A
Authority
JP
Japan
Prior art keywords
led
mounting structure
substrate
leg
led assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009503259A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009532882A5 (enExample
Inventor
エー． メイズ，マイケル
オー． アエリング，エレン
アール． デイビッド，ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009532882A publication Critical patent/JP2009532882A/ja
Publication of JP2009532882A5 publication Critical patent/JP2009532882A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8508—Package substrates, e.g. submounts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
JP2009503259A 2006-03-31 2007-03-29 Ｌｅｄ実装構造体 Pending JP2009532882A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74403006P 2006-03-31 2006-03-31
US11/691,025 US20070252161A1 (en) 2006-03-31 2007-03-26 Led mounting structures
PCT/US2007/065425 WO2007133857A2 (en) 2006-03-31 2007-03-29 Led mounting structures

Publications (2)

Publication Number Publication Date
JP2009532882A true JP2009532882A (ja) 2009-09-10
JP2009532882A5 JP2009532882A5 (enExample) 2010-05-13

Family

ID=38647513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009503259A Pending JP2009532882A (ja) 2006-03-31 2007-03-29 Ｌｅｄ実装構造体

Country Status (6)

Country Link
US (1) US20070252161A1 (enExample)
EP (1) EP2002489A2 (enExample)
JP (1) JP2009532882A (enExample)
CN (1) CN101416325B (enExample)
TW (1) TW200802977A (enExample)
WO (1) WO2007133857A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9010939B2 (en) 2011-11-17 2015-04-21 Ricoh Company, Limited Image projection apparatus

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US7550777B2 (en) * 2003-01-10 2009-06-23 Toyoda Gosei, Co., Ltd. Light emitting device including adhesion layer
KR101365621B1 (ko) 2007-09-04 2014-02-24 서울반도체 주식회사 열 방출 슬러그들을 갖는 발광 다이오드 패키지
US8118447B2 (en) 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
US8360599B2 (en) 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US7938562B2 (en) 2008-10-24 2011-05-10 Altair Engineering, Inc. Lighting including integral communication apparatus
US8214084B2 (en) 2008-10-24 2012-07-03 Ilumisys, Inc. Integration of LED lighting with building controls
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US8324817B2 (en) 2008-10-24 2012-12-04 Ilumisys, Inc. Light and light sensor
US8653984B2 (en) 2008-10-24 2014-02-18 Ilumisys, Inc. Integration of LED lighting control with emergency notification systems
CN102097420B (zh) * 2009-12-10 2014-08-20 鸿富锦精密工业（深圳）有限公司 发光二极管及其制造方法
KR101055383B1 (ko) * 2010-03-15 2011-08-08 (주)포인트엔지니어링 광소자 디바이스 및 그 제조 방법
CA2794541C (en) 2010-03-26 2018-05-01 David L. Simon Inside-out led bulb
US8541958B2 (en) 2010-03-26 2013-09-24 Ilumisys, Inc. LED light with thermoelectric generator
TW201135991A (en) * 2010-04-12 2011-10-16 Foxsemicon Integrated Tech Inc Solid-state lighting device and light source module incorporating the same
KR101690509B1 (ko) 2010-07-05 2016-12-28 엘지이노텍 주식회사 발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템
US8523394B2 (en) 2010-10-29 2013-09-03 Ilumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
WO2013028965A2 (en) * 2011-08-24 2013-02-28 Ilumisys, Inc. Circuit board mount for led light
CN102299146A (zh) * 2011-09-16 2011-12-28 王海军 一种提高光效柔化光照的led封装结构
WO2013131002A1 (en) 2012-03-02 2013-09-06 Ilumisys, Inc. Electrical connector header for an led-based light
WO2014008463A1 (en) 2012-07-06 2014-01-09 Ilumisys, Inc. Power supply assembly for led-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
DE102012109158B4 (de) * 2012-09-27 2017-08-03 Osram Oled Gmbh Leuchtelement
US10295124B2 (en) * 2013-02-27 2019-05-21 Cree, Inc. Light emitter packages and methods
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
CN106063381A (zh) 2014-01-22 2016-10-26 伊卢米斯公司 具有被寻址led的基于led的灯
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
CN104103741A (zh) * 2014-07-02 2014-10-15 柳钊 一种以碳化硅陶瓷为散热器一体封装的led光源器件及其制备方法
CN104501044B (zh) * 2014-12-19 2017-07-11 东莞市闻誉实业有限公司 Led水下灯
CN104534430B (zh) * 2014-12-19 2018-04-20 东莞市闻誉实业有限公司 散热装置
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
WO2020153937A1 (en) * 2019-01-22 2020-07-30 Siemens Aktiengesellschaft Integrated no-solder snap-fit electronic component bays for non-traditional pcbs and am structures
CN114698262B (zh) * 2022-03-18 2024-11-22 广州华星光电半导体显示技术有限公司 发光基板、显示面板以及显示装置
DE102023114502A1 (de) * 2023-06-02 2024-12-05 Heraeus Noblelight Gmbh Verfahren zum Fügen eines keramischen Substrats für Chip-on-board-LEDs mit einem Kühlelement

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9010939B2 (en) 2011-11-17 2015-04-21 Ricoh Company, Limited Image projection apparatus
US9010940B2 (en) 2011-11-17 2015-04-21 Ricoh Company, Limited Image projection apparatus
US9304381B2 (en) 2011-11-17 2016-04-05 Ricoh Company, Limited Image projection apparatus

Also Published As

Publication number Publication date
EP2002489A2 (en) 2008-12-17
WO2007133857A3 (en) 2008-01-10
CN101416325A (zh) 2009-04-22
US20070252161A1 (en) 2007-11-01
CN101416325B (zh) 2011-04-13
TW200802977A (en) 2008-01-01
WO2007133857A2 (en) 2007-11-22

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