TW200802977A - LED mounting structures - Google Patents
LED mounting structuresInfo
- Publication number
- TW200802977A TW200802977A TW096111426A TW96111426A TW200802977A TW 200802977 A TW200802977 A TW 200802977A TW 096111426 A TW096111426 A TW 096111426A TW 96111426 A TW96111426 A TW 96111426A TW 200802977 A TW200802977 A TW 200802977A
- Authority
- TW
- Taiwan
- Prior art keywords
- mounting structure
- substrate
- elongate mounting
- mounting structures
- led mounting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74403006P | 2006-03-31 | 2006-03-31 | |
US11/691,025 US20070252161A1 (en) | 2006-03-31 | 2007-03-26 | Led mounting structures |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200802977A true TW200802977A (en) | 2008-01-01 |
Family
ID=38647513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096111426A TW200802977A (en) | 2006-03-31 | 2007-03-30 | LED mounting structures |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070252161A1 (zh) |
EP (1) | EP2002489A2 (zh) |
JP (1) | JP2009532882A (zh) |
CN (1) | CN101416325B (zh) |
TW (1) | TW200802977A (zh) |
WO (1) | WO2007133857A2 (zh) |
Families Citing this family (34)
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---|---|---|---|---|
US7550777B2 (en) * | 2003-01-10 | 2009-06-23 | Toyoda Gosei, Co., Ltd. | Light emitting device including adhesion layer |
KR101365621B1 (ko) | 2007-09-04 | 2014-02-24 | 서울반도체 주식회사 | 열 방출 슬러그들을 갖는 발광 다이오드 패키지 |
US8118447B2 (en) | 2007-12-20 | 2012-02-21 | Altair Engineering, Inc. | LED lighting apparatus with swivel connection |
US8360599B2 (en) | 2008-05-23 | 2013-01-29 | Ilumisys, Inc. | Electric shock resistant L.E.D. based light |
US8901823B2 (en) | 2008-10-24 | 2014-12-02 | Ilumisys, Inc. | Light and light sensor |
US8653984B2 (en) | 2008-10-24 | 2014-02-18 | Ilumisys, Inc. | Integration of LED lighting control with emergency notification systems |
US8324817B2 (en) | 2008-10-24 | 2012-12-04 | Ilumisys, Inc. | Light and light sensor |
US8214084B2 (en) | 2008-10-24 | 2012-07-03 | Ilumisys, Inc. | Integration of LED lighting with building controls |
US7938562B2 (en) | 2008-10-24 | 2011-05-10 | Altair Engineering, Inc. | Lighting including integral communication apparatus |
CN102097420B (zh) * | 2009-12-10 | 2014-08-20 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管及其制造方法 |
KR101055383B1 (ko) * | 2010-03-15 | 2011-08-08 | (주)포인트엔지니어링 | 광소자 디바이스 및 그 제조 방법 |
CA2794541C (en) | 2010-03-26 | 2018-05-01 | David L. Simon | Inside-out led bulb |
CA2792940A1 (en) | 2010-03-26 | 2011-09-19 | Ilumisys, Inc. | Led light with thermoelectric generator |
TW201135991A (en) * | 2010-04-12 | 2011-10-16 | Foxsemicon Integrated Tech Inc | Solid-state lighting device and light source module incorporating the same |
KR101690509B1 (ko) | 2010-07-05 | 2016-12-28 | 엘지이노텍 주식회사 | 발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템 |
WO2012058556A2 (en) | 2010-10-29 | 2012-05-03 | Altair Engineering, Inc. | Mechanisms for reducing risk of shock during installation of light tube |
US9072171B2 (en) | 2011-08-24 | 2015-06-30 | Ilumisys, Inc. | Circuit board mount for LED light |
CN102299146A (zh) * | 2011-09-16 | 2011-12-28 | 王海军 | 一种提高光效柔化光照的led封装结构 |
JP5692655B2 (ja) | 2011-11-17 | 2015-04-01 | 株式会社リコー | 画像投影装置 |
US9184518B2 (en) | 2012-03-02 | 2015-11-10 | Ilumisys, Inc. | Electrical connector header for an LED-based light |
WO2014008463A1 (en) | 2012-07-06 | 2014-01-09 | Ilumisys, Inc. | Power supply assembly for led-based light tube |
US9271367B2 (en) | 2012-07-09 | 2016-02-23 | Ilumisys, Inc. | System and method for controlling operation of an LED-based light |
DE102012109158B4 (de) * | 2012-09-27 | 2017-08-03 | Osram Oled Gmbh | Leuchtelement |
US10295124B2 (en) * | 2013-02-27 | 2019-05-21 | Cree, Inc. | Light emitter packages and methods |
US9285084B2 (en) | 2013-03-14 | 2016-03-15 | Ilumisys, Inc. | Diffusers for LED-based lights |
US9267650B2 (en) | 2013-10-09 | 2016-02-23 | Ilumisys, Inc. | Lens for an LED-based light |
EP3097748A1 (en) | 2014-01-22 | 2016-11-30 | iLumisys, Inc. | Led-based light with addressed leds |
US9510400B2 (en) | 2014-05-13 | 2016-11-29 | Ilumisys, Inc. | User input systems for an LED-based light |
CN104103741A (zh) * | 2014-07-02 | 2014-10-15 | 柳钊 | 一种以碳化硅陶瓷为散热器一体封装的led光源器件及其制备方法 |
CN104501044B (zh) * | 2014-12-19 | 2017-07-11 | 东莞市闻誉实业有限公司 | Led水下灯 |
CN104534430B (zh) * | 2014-12-19 | 2018-04-20 | 东莞市闻誉实业有限公司 | 散热装置 |
US10161568B2 (en) | 2015-06-01 | 2018-12-25 | Ilumisys, Inc. | LED-based light with canted outer walls |
WO2020153937A1 (en) * | 2019-01-22 | 2020-07-30 | Siemens Aktiengesellschaft | Integrated no-solder snap-fit electronic component bays for non-traditional pcbs and am structures |
CN114698262A (zh) * | 2022-03-18 | 2022-07-01 | 广州华星光电半导体显示技术有限公司 | 发光基板、显示面板以及显示装置 |
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JPS62163977U (zh) * | 1986-04-09 | 1987-10-17 | ||
JPH01110454U (zh) * | 1988-01-19 | 1989-07-26 | ||
DE4013863A1 (de) * | 1990-04-30 | 1991-10-31 | Staff Gmbh & Co Kg | Adapter fuer stromschienen |
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JPH065924A (ja) * | 1992-06-17 | 1994-01-14 | Seiko Epson Corp | 発光ダイオードの実装方式 |
FR2697484B1 (fr) * | 1992-11-02 | 1995-01-20 | Valeo Vision | Elément modulaire pour la réalisation de feux de signalisation de véhicules automobiles. |
JPH08264922A (ja) * | 1995-03-28 | 1996-10-11 | Rohm Co Ltd | 発光装置の実装構造 |
DE29825062U1 (de) * | 1997-07-29 | 2004-07-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
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JP2002182589A (ja) * | 2000-12-11 | 2002-06-26 | Rohm Co Ltd | 発光表示装置 |
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JP2003101072A (ja) * | 2001-09-26 | 2003-04-04 | Ichikoh Ind Ltd | 発光ダイオードの固定構造 |
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US7163327B2 (en) * | 2002-12-02 | 2007-01-16 | 3M Innovative Properties Company | Illumination system using a plurality of light sources |
US6974229B2 (en) * | 2003-05-21 | 2005-12-13 | Lumileds Lighting U.S., Llc | Devices for creating brightness profiles |
US20050116235A1 (en) * | 2003-12-02 | 2005-06-02 | Schultz John C. | Illumination assembly |
JP4028545B2 (ja) * | 2003-12-26 | 2007-12-26 | 古河電気工業株式会社 | 電子部品とフラットケーブルの接続構造及び接続方法 |
KR100563373B1 (ko) * | 2004-02-27 | 2006-03-22 | 서울반도체 주식회사 | 반사기를 이용한 칩 발광다이오드 |
US20050207156A1 (en) * | 2004-03-22 | 2005-09-22 | Harvatek Corporation | Flexible light array and fabrication procedure thereof |
US7427782B2 (en) * | 2004-03-29 | 2008-09-23 | Articulated Technologies, Llc | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
US7138659B2 (en) * | 2004-05-18 | 2006-11-21 | Onscreen Technologies, Inc. | LED assembly with vented circuit board |
US7997771B2 (en) * | 2004-06-01 | 2011-08-16 | 3M Innovative Properties Company | LED array systems |
US20060082315A1 (en) * | 2004-10-20 | 2006-04-20 | Timothy Chan | Method and system for attachment of light emmiting diodes to circuitry for use in lighting |
US7303315B2 (en) * | 2004-11-05 | 2007-12-04 | 3M Innovative Properties Company | Illumination assembly using circuitized strips |
US7285802B2 (en) * | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
-
2007
- 2007-03-26 US US11/691,025 patent/US20070252161A1/en not_active Abandoned
- 2007-03-29 EP EP07811834A patent/EP2002489A2/en not_active Withdrawn
- 2007-03-29 JP JP2009503259A patent/JP2009532882A/ja active Pending
- 2007-03-29 WO PCT/US2007/065425 patent/WO2007133857A2/en active Application Filing
- 2007-03-29 CN CN2007800124750A patent/CN101416325B/zh not_active Expired - Fee Related
- 2007-03-30 TW TW096111426A patent/TW200802977A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP2002489A2 (en) | 2008-12-17 |
CN101416325A (zh) | 2009-04-22 |
WO2007133857A3 (en) | 2008-01-10 |
JP2009532882A (ja) | 2009-09-10 |
US20070252161A1 (en) | 2007-11-01 |
WO2007133857A2 (en) | 2007-11-22 |
CN101416325B (zh) | 2011-04-13 |
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