PL1947693T3 - Płaska struktura urządzenia oświetleniowego z diodami emitującymi światło - Google Patents

Płaska struktura urządzenia oświetleniowego z diodami emitującymi światło

Info

Publication number
PL1947693T3
PL1947693T3 PL07100750T PL07100750T PL1947693T3 PL 1947693 T3 PL1947693 T3 PL 1947693T3 PL 07100750 T PL07100750 T PL 07100750T PL 07100750 T PL07100750 T PL 07100750T PL 1947693 T3 PL1947693 T3 PL 1947693T3
Authority
PL
Poland
Prior art keywords
light emitting
lighting device
flat structure
emitting leds
leds
Prior art date
Application number
PL07100750T
Other languages
English (en)
Inventor
Sam Yu
Dalong Cheng
Original Assignee
Polytron Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polytron Tech Inc filed Critical Polytron Tech Inc
Publication of PL1947693T3 publication Critical patent/PL1947693T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
PL07100750T 2007-01-18 2007-01-18 Płaska struktura urządzenia oświetleniowego z diodami emitującymi światło PL1947693T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07100750.4A EP1947693B1 (en) 2007-01-18 2007-01-18 Plane structure of light-emitting diode lighting apparatus

Publications (1)

Publication Number Publication Date
PL1947693T3 true PL1947693T3 (pl) 2015-09-30

Family

ID=38169330

Family Applications (1)

Application Number Title Priority Date Filing Date
PL07100750T PL1947693T3 (pl) 2007-01-18 2007-01-18 Płaska struktura urządzenia oświetleniowego z diodami emitującymi światło

Country Status (3)

Country Link
EP (1) EP1947693B1 (pl)
ES (1) ES2536919T3 (pl)
PL (1) PL1947693T3 (pl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007041896A1 (de) 2007-09-04 2009-03-05 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
BE1018633A5 (nl) * 2009-01-23 2011-05-03 Glorieux Rik Samenstel met verlichting, en dak- of wandconstructie omvattende een aantal dergelijke samenstellen.
EP2441576B1 (de) * 2010-09-10 2012-06-20 BGT Bischoff Glastechnik AG Verbundglasscheibe mit integrierter LED-Matrix und Verfahren zu ihrer Herstellung
US9048034B2 (en) 2012-05-04 2015-06-02 Industrial Control Systems Limited Extended contact strip
CN103227277A (zh) * 2013-03-27 2013-07-31 王定锋 不用焊线的led封装方法和led封装结构
WO2017063865A1 (en) * 2015-10-13 2017-04-20 Philips Lighting Holding B.V. Flex foil, led assembly, lighting device and assembly method
CN105304390B (zh) * 2015-11-04 2018-02-02 昆山兴协和光电科技有限公司 Led饰条及其制作方法、应用其的背光模组和键盘
CN109488897A (zh) * 2018-11-06 2019-03-19 宁波凯耀电器制造有限公司 一种led插脚灯

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10019888B4 (de) * 2000-04-20 2011-06-16 Schott Ag Transparente elektronische Bauelementanordnung und Verfahren zu ihrer Herstellung
IT1320547B1 (it) * 2000-07-21 2003-12-10 Fiat Ricerche Dispositivo di illuminazione, particolarmente proiettore o fanale diautoveicolo con distribuzione a matrice di sorgenti luminose
AU2001295987B2 (en) 2001-10-19 2005-10-20 Sphelar Power Corporation Light emitting or light receiving semiconductor module and method for manufacturing the same
US20040166335A1 (en) * 2002-08-06 2004-08-26 O'regan Marie B. Laminated polymer with integrated lighting, sensors and electronics
BE1015302A3 (fr) 2003-01-10 2005-01-11 Glaverbel Vitrage comportant des composants electroniques.
MXPA06011114A (es) 2004-03-29 2007-01-25 Articulated Technologies Llc Hoja luminosa fabricada de rodillo a rodillo y dispositivos encapsulados de circuito semiconductor.
ATE546836T1 (de) * 2005-04-21 2012-03-15 Fiat Ricerche Anwendung einer transparenten leuchtdiodenanzeigevorrichtung in einem kraftfahrzeug

Also Published As

Publication number Publication date
EP1947693A1 (en) 2008-07-23
ES2536919T3 (es) 2015-05-29
EP1947693B1 (en) 2015-03-25

Similar Documents

Publication Publication Date Title
EP2331873A4 (en) LIGHT EMITTING DIODE (LED) LIGHTING DEVICE
ZA201101943B (en) Light emitting diode (led) roadway lighting fixture
EP2438349A4 (en) LED BULB WITH SCREW PUSH
IL204616A0 (en) Light emitting diode recessed light fixture
EP2020015A4 (en) Embedded led light source
FI20070496A0 (fi) Valoa säteilevä diodi
BRPI0910962A2 (pt) aparelho de iluminação de led
EP2142849A4 (en) LED LIGHTING DEVICE WITH HIGHLY UNIFORM ILLUMINATION PATTERN
EP2330345A4 (en) LED LIGHTING DEVICE
EP2283404A4 (en) ADDRESSABLE LED LIGHT TRACK
PL2082167T3 (pl) Urządzenie oświetlające diodą emitującą światło
EP2395568A4 (en) LED LIGHT EMITTING DEVICE
FR2926947B1 (fr) Source lumineuse a diodes led
BRPI0924046A2 (pt) aparelho de iluminação usando diodo emissor de luz.
PL1947693T3 (pl) Płaska struktura urządzenia oświetleniowego z diodami emitującymi światło
DE112009001774A5 (de) Leuchtmittel mit LED
FIU20100541U0 (fi) Pulssitusvälinein varustettu LED-valaisinmatriisi
AT10993U2 (de) Led-leuchtröhre
EP2304823A4 (en) ORGANIC LIGHT DIODE LIGHTING DEVICES
DE112009002140A5 (de) LED-basierender Beleuchtungskörper
EP2436231A4 (en) Light emitting diode (LED) LAMP
TWI366259B (en) Light emitting diode lamp and light emitting diode string
DE502007006514D1 (de) Led-lichtmodul mit reflektor
AT10995U2 (de) Led-leuchtröhre
EP2483596A4 (en) LED LIGHT EMITTING LAMP