TWI366259B - Light emitting diode lamp and light emitting diode string - Google Patents

Light emitting diode lamp and light emitting diode string

Info

Publication number
TWI366259B
TWI366259B TW096151143A TW96151143A TWI366259B TW I366259 B TWI366259 B TW I366259B TW 096151143 A TW096151143 A TW 096151143A TW 96151143 A TW96151143 A TW 96151143A TW I366259 B TWI366259 B TW I366259B
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
string
lamp
diode lamp
Prior art date
Application number
TW096151143A
Other languages
Chinese (zh)
Other versions
TW200929516A (en
Inventor
Chih Ming Lai
Tse An Lee
Original Assignee
Foxsemicon Integrated Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxsemicon Integrated Tech Inc filed Critical Foxsemicon Integrated Tech Inc
Priority to TW096151143A priority Critical patent/TWI366259B/en
Publication of TW200929516A publication Critical patent/TW200929516A/en
Application granted granted Critical
Publication of TWI366259B publication Critical patent/TWI366259B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
TW096151143A 2007-12-31 2007-12-31 Light emitting diode lamp and light emitting diode string TWI366259B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096151143A TWI366259B (en) 2007-12-31 2007-12-31 Light emitting diode lamp and light emitting diode string

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096151143A TWI366259B (en) 2007-12-31 2007-12-31 Light emitting diode lamp and light emitting diode string

Publications (2)

Publication Number Publication Date
TW200929516A TW200929516A (en) 2009-07-01
TWI366259B true TWI366259B (en) 2012-06-11

Family

ID=44864517

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096151143A TWI366259B (en) 2007-12-31 2007-12-31 Light emitting diode lamp and light emitting diode string

Country Status (1)

Country Link
TW (1) TWI366259B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509186B (en) * 2013-09-06 2015-11-21 Lextar Electronics Corp Omnidirectional lighting unit and illumination device and method for manufacturing the omnidirectional lighting unit
US9228726B2 (en) 2013-11-13 2016-01-05 Lediamond Opto Corporation Globular illuminant device

Also Published As

Publication number Publication date
TW200929516A (en) 2009-07-01

Similar Documents

Publication Publication Date Title
EP2199658A4 (en) Light emitting element lamp and lighting equipment
ZA201101943B (en) Light emitting diode (led) roadway lighting fixture
IL204616A0 (en) Light emitting diode recessed light fixture
IL208356A0 (en) White light emission diode and white light emission diode lamp
EP2162926A4 (en) Light emitting diodes and fabrication methods thereof
EP2256402A4 (en) Light-emitting element lamp and lighting fixture
EP2331873A4 (en) Light emitting diode (led) lighting device
EP2268966A4 (en) Lighting apparatus using light emitting diode
EP2235433A4 (en) Lighting apparatus using light emitting diode
EP2055147A4 (en) Led lighting arrangement including light emitting phosphor
PL2082167T3 (en) Light emitting diode lighting device
EP2242948A4 (en) Submersible high illumination led light source
EP2375866A4 (en) Light-emitting diode lamp
EP2056366A4 (en) Light emitting device and illumination device
HK1142461A1 (en) Light emitting diode
EP2283404A4 (en) Addressable led light string
EP2408027A4 (en) Light emitting diode, light emitting diode lamp and illuminating device
TWI383518B (en) Light emitting diode
EP2376835A4 (en) Light emitting diode luminaire
EP2376836A4 (en) Light emitting diode lamp
EP2098778A4 (en) Light emitting diode illuminating equipment
TWM386528U (en) Light emitting diode lamp with high heat-dissipation capacity
GB0819147D0 (en) Outdoor light-emitting diode light fixture and lamp casing device thereof
TWI350012B (en) White light emitting diode and base thereof
TWI366259B (en) Light emitting diode lamp and light emitting diode string

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees