TWI418736B - - Google Patents
Info
- Publication number
- TWI418736B TWI418736B TW100119202A TW100119202A TWI418736B TW I418736 B TWI418736 B TW I418736B TW 100119202 A TW100119202 A TW 100119202A TW 100119202 A TW100119202 A TW 100119202A TW I418736 B TWI418736 B TW I418736B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100119202A TW201250159A (en) | 2011-06-01 | 2011-06-01 | Light-emitting diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100119202A TW201250159A (en) | 2011-06-01 | 2011-06-01 | Light-emitting diode module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201250159A TW201250159A (en) | 2012-12-16 |
| TWI418736B true TWI418736B (enExample) | 2013-12-11 |
Family
ID=48139205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100119202A TW201250159A (en) | 2011-06-01 | 2011-06-01 | Light-emitting diode module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201250159A (enExample) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM311119U (en) * | 2006-11-15 | 2007-05-01 | Unity Opto Technology Co Ltd | Heat-dissipating module for LED |
| TWM311844U (en) * | 2006-11-17 | 2007-05-11 | Mgta Consultant Co Ltd | Heat dissipation devices for LED lamps |
| CN100388513C (zh) * | 2003-05-14 | 2008-05-14 | 纳米封装工艺公司 | 发光器件及其封装结构以及该封装结构的制造方法 |
| CN100530717C (zh) * | 2004-12-21 | 2009-08-19 | 3M创新有限公司 | 照明组件及其制造方法 |
| CN100539218C (zh) * | 2006-07-07 | 2009-09-09 | Lg电子株式会社 | 用于安装发光器件的辅助底座和发光器件封装 |
| CN201475720U (zh) * | 2009-08-10 | 2010-05-19 | 林万炯 | 具有散热电路板的led灯 |
-
2011
- 2011-06-01 TW TW100119202A patent/TW201250159A/zh not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100388513C (zh) * | 2003-05-14 | 2008-05-14 | 纳米封装工艺公司 | 发光器件及其封装结构以及该封装结构的制造方法 |
| CN100530717C (zh) * | 2004-12-21 | 2009-08-19 | 3M创新有限公司 | 照明组件及其制造方法 |
| CN100539218C (zh) * | 2006-07-07 | 2009-09-09 | Lg电子株式会社 | 用于安装发光器件的辅助底座和发光器件封装 |
| TWM311119U (en) * | 2006-11-15 | 2007-05-01 | Unity Opto Technology Co Ltd | Heat-dissipating module for LED |
| TWM311844U (en) * | 2006-11-17 | 2007-05-11 | Mgta Consultant Co Ltd | Heat dissipation devices for LED lamps |
| CN201475720U (zh) * | 2009-08-10 | 2010-05-19 | 林万炯 | 具有散热电路板的led灯 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201250159A (en) | 2012-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |